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Zhao B.,CAS Shenzhen Institutes of Advanced Technology | Zhao B.,Shenzhen High Density Electronic Packaging and Device Assembly Key Laboratory | Zhang K.,Hong Kong University of Science and Technology | Yuen M.M.F.,Hong Kong University of Science and Technology | And 6 more authors.
16th International Conference on Electronic Packaging Technology, ICEPT 2015 | Year: 2015

Graphene nanosheets are prepared by electrochemical exfoliated of graphite in aqueous electrolytes. After exfoliation, the electrolyte containing exfoliated graphite is filtered. Then the precipitate is repeatedly washed using ultrapure water, and dispersed in ultrapure water for centrifuging separation. Finally, the above graphene dispersion is collected to fabricate graphene films. The graphene films exhibit low sheet resistance and excellent heat conductivity. © 2015 IEEE.


Xie J.-Q.,CAS Shenzhen Institutes of Advanced Technology | Xie J.-Q.,Shenzhen High Density Electronic Packaging and Device Assembly Key Laboratory | Ren H.-M.,CAS Shenzhen Institutes of Advanced Technology | Ren H.-M.,Shenzhen High Density Electronic Packaging and Device Assembly Key Laboratory | And 8 more authors.
16th International Conference on Electronic Packaging Technology, ICEPT 2015 | Year: 2015

In this paper, we reported thermally conductive adhesives filled with Ag-coated Cu flakes and investigated the effect of adhesive composition on the thermal conductive performance. Results revealed that the thermal conductivity increased by increasing the content of Ag coated Cu filler and 16 W/mK can be obtained with 90 wt.% Ag coated Cu filler content. © 2015 IEEE.


Huang S.-Y.,CAS Shenzhen Institutes of Advanced Technology | Huang S.-Y.,Shenzhen High Density Electronic Packaging and Device Assembly Key Laboratory | Zhang K.,Hong Kong University of Science and Technology | Yuen M.M.F.,Hong Kong University of Science and Technology | And 5 more authors.
16th International Conference on Electronic Packaging Technology, ICEPT 2015 | Year: 2015

Significant enhancement in thermal diffusivity and thermal conductivity of graphene film, made from individual graphene oxide sheets, can be achieved upon modification with a small amount of Ag nanoparticles. It is readily rationalized in terms of not only the crosslink between the graphene sheets and Ag nanoparticles, but also the chemical intercalation of Ag nanoparticles into the gallery space between graphene basal planes. © 2015 IEEE.


Ren H.-M.,CAS Shenzhen Institutes of Advanced Technology | Ren H.-M.,Shenzhen High Density Electronic Packaging and Device Assembly Key Laboratory | Guo Y.,CAS Shenzhen Institutes of Advanced Technology | Guo Y.,Shenzhen High Density Electronic Packaging and Device Assembly Key Laboratory | And 12 more authors.
ACS Applied Materials and Interfaces | Year: 2015

A facile one-step solution-phase chemical reduction method has been developed to synthesize Ag microsheets at room temperature. The morphology of Ag sheets is a regular hexagon more than 1 μm in size and about 200 nm in thickness. The hexagonal Ag microsheets possess a smoother and straighter surface compared with that of the commercial Ag micrometer-sized flakes prepared by ball milling for electrically conductive adhesives (ECAs). The function of the reagents and the formation mechanism of Ag hexagonal microsheets are also investigated. For the polyvinylpyrrolidone (PVP) and citrate facet-selective capping, the Ag atoms freshly reduced by N2H4 would orientationally grow alone on the {111} facet of Ag seeds, with the synergistically selective etching of irregular and small Ag particles by H2O2, to form Ag hexagonal microsheets. The hexagonal Ag microsheet-filled epoxy adhesives, as electrically conductive materials, can be easily printed on various substrates such as polyethylene terephthalate (PET), epoxy, glass, and flexible papers. The hexagonal Ag microsheet filled ECAs demonstrate lower bulk resistivity (approximately 8 × 10-5 Ω cm) than that of the traditional Ag micrometer-sized-flake-filled ECAs with the same Ag content of 80 wt % (approximately 1.2 × 10-4 Ω cm) (Figure Presented). © 2015 American Chemical Society.


Su X.,CAS Shenzhen Institutes of Advanced Technology | Su X.,Shenzhen High Density Electronic Packaging and Device Assembly Key Laboratory | Su X.,Shenzhen University | Lai L.,CAS Shenzhen Institutes of Advanced Technology | And 10 more authors.
16th International Conference on Electronic Packaging Technology, ICEPT 2015 | Year: 2015

Ni-P alloy thin films are prepared by electroless plating as embedded thin-film resistor (ETFR) materials. The micro-structure, electrical, thermal, mechanical, and corrosion-resistant properties of Ni-P alloy thin films are investigated to optimize the electroless plating conditions. When the phosphorus content was greater than 9 %, Ni-P alloy thin films are amorphous. Ni-P alloy thin films' sheet resistance, corrosion resistance and hardness increase with the increase of P content. © 2015 IEEE.

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