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Zhang C.,Nanjing Southeast University | Liu S.-D.,Nanjing Southeast University | Qian G.-T.,Shaoxing Tianlong Tin Materials Co. | Zhou J.,Nanjing Southeast University | Xue F.,Nanjing Southeast University
Transactions of Nonferrous Metals Society of China (English Edition) | Year: 2014

The effect of Sb content on the properties of Sn-Bi solders was studied. The nonequilibrium melting behaviors of a series of Sn-Bi-Sb solders were examined by differential scanning calorimetry (DSC). The spreading test was carried out to characterize the wettability of Sn-Bi-Sb solders on Cu substrate. The mechanical properties of the solders/Cu joints were evaluated. The results show that the ternary alloy solders contain eutectic structure resulting from quasi-peritetic reaction. With the increase of Sb content, the amount of the eutectic structure increases. At a heating rate of 5 C/min, Sn-Bi-Sb alloys exhibit a higher melting point and a wider melting range. A small amount of Sb has an impact on the wettability of Sn-Bi solders. The reaction layers form during spreading process. Sb is detected in the reaction layer while Bi is not detected. The total thickness of reaction layer between solder and Cu increases with the increase of the Sb content. The shear strength of the Sn-Bi-Sb solders increases as the Sb content increases. © 2014 The Nonferrous Metals Society of China. Source

Chu W.,Harbin Institute of Technology | Lin T.,Harbin Institute of Technology | He P.,Harbin Institute of Technology | Wei H.,Harbin Institute of Technology | Dai D.,Shaoxing Tianlong Tin Materials Co.
Hanjie Xuebao/Transactions of the China Welding Institution | Year: 2016

A model of consecutive Electro spark deposition was built, by using birth and death element method and establishing suitable boundary conditions, to analyze the residual stress on WC-12Co coating by consecutive electro spark deposition. Curves of variation of stress at different depths with time were derived with finite element software ANSYS. It is found that the residual stress was mainly parallel to the surface of workpiece, and the maximum tensile stress appeared on the coating surface. The model of consecutive electro spark deposition was used to analyze the influence of process parameters on the residual stress and to predict the most suitable process parameters window. Electro spark deposition experiments were conducted to verify the simulated results. © 2016, Harbin Research Institute of Welding. All right reserved. Source

He P.,Harbin Institute of Technology | Li H.,Harbin Institute of Technology | Lin T.,Harbin Institute of Technology | Huang Y.,Harbin Institute of Technology | And 2 more authors.
Hanjie Xuebao/Transactions of the China Welding Institution | Year: 2012

Diffusion bonding of TiAl to Ni-based alloy using Ti interlayer was studied. The microstructure of the joint and effect of bonding temperature on microstructure and properties of the joint were investigated, and the mechanism of the formation of reaction layers was also discussed. The experiment results show that the interfacial structure of the GH99/Ti/TiAl joint is GH99/(Ni, Cr) ss/rich Ti-(Ni, Cr) ss/TiNi/Ti 2Ni/ α-Ti+Ti 2Ni/Ti(Al) ss/ TiAl+Ti 3Al/TiAl. With the bonding temperature increasing, the thickness of reaction layers increases. The shear strength of the joint increases with the bonding temperature, and goes through a maximum at 1173 K/30 min/20 MPa and thereafter falls off. The maximum shear strength is 260.7 MPa. Source

Lin T.,Harbin Institute of Technology | He P.,Harbin Institute of Technology | Han L.,Harbin Institute of Technology | Han C.,Harbin Institute of Technology | And 2 more authors.
Hanjie Xuebao/Transactions of the China Welding Institution | Year: 2012

GH99 alloys were joined by transient liquid phase (TLP) process using self-designed Ni-Cr-Si-B interlayers. The effects of joining parameters and interlayer components on the interfacial microstructure of the joints were investigated with SEM and EDS. The results showed that with the increase of holding time and temperature, the precipitation of the compounds reduced and the microstructure of the joints became more uniform. The precipitation of the compounds in the joints was related to the diffusion of the melting point depressants. B element in the interlayer was one of the melting point depressants, and its content directly affected the quantity of the compounds in the joints. Because Si element in the base alloy was highly solid dissolved, the Si-rich compounds were reluctant to precipitate during bonding. Source

Shaoxing Tianlong Tin; Materials Co. | Date: 2010-04-13

Gold solder; rods of metal for welding; alloys of common metal; colophony soldering wire made primarily of metal; brazing alloys; zinc ingots; tin ores; white metal, namely, white metal as a metal alloy; silver solder. Re-tinning; rust proofing; spraying service, namely, spray-painting of metal.

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