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Yu L.,CAS Shanghai Institute of Microsystem and Information Technology | Yu L.,Shanghai Xinanna Electronic Technology Co. | Yu L.,University of Chinese Academy of Sciences | Liu W.-L.,CAS Shanghai Institute of Microsystem and Information Technology | And 5 more authors.
Chinese Chemical Letters | Year: 2015

In this paper, a facile synthesis of 100. nm commercial colloid silica coated with nano-ceria core-shell composite particles by the precipitation method using ammonium cerium nitrate and urea as a precipitator with polyvinylpyrrolidone (PVP) as an assistant was briefly introduced. The results showed that the colloid silica was surrounded by nano-ceria uniformly forming the core-shell composite particles. The synthesis process was further discussed and optimized. It was found that the type and quantity of surfactant played a key role in the process. PVP connected the surface of colloid silica and that of the ceria precursor. © 2015 Wei-Li Liu. Source


Wang H.,CAS Shanghai Institute of Microsystem and Information Technology | Wang H.,Shanghai Xinanna Electronic Technology Co. | Wang H.,University of Chinese Academy of Sciences | Song Z.,CAS Shanghai Institute of Microsystem and Information Technology | And 5 more authors.
Microelectronic Engineering | Year: 2011

The effect of hydrogen peroxide (H2O2) concentration in alkaline slurry on the surface micro-roughness of final polished silicon wafer was investigated. The root mean square roughness (RMS) reached minimum with H2O2 when the concentration is 0.05 wt%. Meanwhile, the contact angle of the polished surface was decreased to 21°. This decrease was attributed to enhanced chemical reaction in the CMP process. Electrochemical impedance was measured to explore the variation with addition of H2O2 in the reaction process of silicon erosion. Based on the measurements, a mechanism was suggested to explain the phenomenon in combine with the coefficient of friction force in the chemical mechanical polishing (CMP) process. © 2010 Elsevier B.V. All rights reserved. Source


Zhang Z.,CAS Shanghai Institute of Microsystem and Information Technology | Zhang Z.,Shanghai Xinanna Electronic Technology Co. | Zhang Z.,University of Chinese Academy of Sciences | Liu W.,CAS Shanghai Institute of Microsystem and Information Technology | And 3 more authors.
Microelectronic Engineering | Year: 2010

Effect of abrasive particle concentration on material removal rate (MRR), MRR per particle and the surface quality in the preliminary chemical mechanical polishing (CMP) of rough glass substrate was investigated. Experimental results showed that the MRR increases linearly with the increase of abrasive concentration and reaches to the maximum when the abrasive concentration is 20 wt.%, and then tends to be stable. When the abrasive concentration increases from 2 to 5 wt.%, the MRR per particle increases greatly and reaches a peak. Then the MRR per particle decreases almost linearly with the increase of the abrasive concentration. The root mean squares (RMS) roughness almost decreases with increasing particle concentration. In addition, in situ coefficient of friction (COF) was also conducted during the polishing process and the zeta potentials of abrasive particles in slurry with different solid concentration were also characterized. Results show that COF value is not related to zeta potential but be sensitive to glass surface conditions in terms of rough peaks in preliminary polishing of glass substrate. © 2010 Elsevier Ltd. All rights reserved. Source


Zhang Z.,CAS Shanghai Institute of Microsystem and Information Technology | Zhang Z.,Shanghai Xinanna Electronic Technology Co. | Zhang Z.,University of Chinese Academy of Sciences | Liu W.,CAS Shanghai Institute of Microsystem and Information Technology | And 3 more authors.
Applied Optics | Year: 2010

This study explores the effect of particle size and surfactant on the chemical mechanical polishing (CMP) of glass using colloidal silica-based slurry. It was found that the material removal rate strongly depends on the particle size and the types of surfactants and that the rms roughness was independent of particle size and correlated to surfactants. On the basis of polishing results, it was concluded that the main polishing mechanism was changed from indentation mechanism to surface-area mechanism, with the variation of particle size. In addition, the molecular structure, charge type, and lubricating effect of the surfactants play an important role in the dispersion of abrasive particles and in the CMP performance. © 2010 Optical Society of America. Source


Zhang L.,CAS Shanghai Institute of Microsystem and Information Technology | Zhang L.,Shanghai Xinanna Electronic Technology Co. | Zhang L.,University of Chinese Academy of Sciences | Liu W.-L.,CAS Shanghai Institute of Microsystem and Information Technology | And 3 more authors.
Gongneng Cailiao yu Qijian Xuebao/Journal of Functional Materials and Devices | Year: 2012

A novel method was developed to prepare monodisperse ultrafine silica using ammonia as a catalyst by means of hydrolysis of tetraethoxysilane (TEOS). Polyvinylpyrrolidone (PVP) can effectively reduce the silica particles size. It was found that the size of monodisperse silica particles tends to decrease with increase of the PVP concentration. By using the optimum process parameters, monodisperse silica nanoparticles with diameter 11 nm were prepared. Furthermore, these monodisperse silica spheres can be successfully used as seeds in the regrowth procedure in the same reaction media. The size of the particles can be precisely controlled by addition various TEOS concentration. Source

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