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CAS Shanghai Institute of Microsystem, Information Technology and Shanghai Simgui Technology Co. | Date: 2010-07-10

A method for forming an edge-chamfered substrate with a buried insulating layer is provided, which comprises the following steps: providing a first substrate (S


Liu X.,CAS Shanghai Institute of Microsystem and Information Technology | Liu X.,University of Chinese Academy of Sciences | Ma X.,CAS Shanghai Institute of Microsystem and Information Technology | Ma X.,University of Chinese Academy of Sciences | And 6 more authors.
Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics | Year: 2010

A modified postannealing at 1000 °C in N2 ambient has been carried out to improve the Ge distribution in the SiGe layer fabricated by the Ge condensation process, which is a potential technique for strained Si fabrication. Three kinds of SiGe-on-insulator samples have been fabricated by so-called Ge condensation, which is the oxidation of the SiGe layer on an insulator to enhance the Ge fraction. After different postannealing processes and the necessary cleaning steps, 20-nm-thick strained Si films are epitaxially grown on them. Though the differences of surface topography among the three samples are not great, the one with the modified postannealing process has the most uniform Ge element distribution and the least misfit dislocations. Meanwhile, the strain values obtained by Raman spectra are coherent with the Ge fraction in SiGe near the Si/SiGe interface and the sample with the modified postannealing process has a larger strain value than the one with a conventional postannealing. The performance of metal-oxide-semiconductor field-effect transistors, based on the strained Si samples here, shows a significant enhancement, compared to those based on Si and Si on insulator samples. © 2010 American Vacuum Society. Source


A method for preparing a semiconductor substrate with an buried insulating layer by a guttering process, includes the following steps: providing a device substrate and a supporting substrate; forming an insulating layer on a surface of the device substrate; performing a heating treatment on the device substrate, so as to form a denuded zone on the surface of the device substrate; bonding the device substrate having the insulating layer with the supporting substrate, such that the insulating layer is sandwiched between the device substrate and the supporting substrate; annealing and reinforcing a bonding interface, such that an adherence level of the bonding interface meets requirements in the following chamfering grinding, thinning and polishing processes; performing the chamfering grinding, thinning and polishing processes on the device substrate which is bonded.


Chang Y.,CAS Shanghai Institute of Microsystem and Information Technology | Chang Y.,Shanghai Simgui Technology Co. | Xue Z.,CAS Shanghai Institute of Microsystem and Information Technology | Chen D.,Ningbo University | And 9 more authors.
Journal of Vacuum Science and Technology B: Nanotechnology and Microelectronics | Year: 2016

High-quality strain-relaxed extremely thin silicon-on-insulator (ETSOI) has been fabricated by using H-trapping and etch-stop process in the H-implanted Si/Si0.70Ge0.30/Si/B-doped Si0.70Ge0.30/Si heterostructure. Compared to conventional ion-cut process, the combination of ultrathin SiGe interlayer with boron doping can significantly decrease the critical hydrogen implantation dosage needed for layer transfer by improving H-trapping efficiency. During subsequent annealing process, implanted H preferentially agglomerates at the trapping centers and induces long microcracks at the B-doped Si0.70Ge0.30/Si interface as well as in the near-interface region. The selective etch-stop process was used to remove residual Si/SiGe layers to expose a strain-relaxed Si device layer with a smooth surface morphology. These results demonstrate facilitated ion-cut as a promising approach for fabricating high crystalline quality ETSOI substrate and further offer a potential solution for scaling planar complementary metal-oxide-semiconductor to 22 nm node and beyond. © 2016 American Vacuum Society. Source


Wei X.,CAS Shanghai Institute of Microsystem and Information Technology | Wu A.,CAS Shanghai Institute of Microsystem and Information Technology | Weng X.,Shanghai Simgui Technology Co. | Li X.,Shanghai Simgui Technology Co. | And 8 more authors.
Journal of the Electrochemical Society | Year: 2010

In this paper, two approaches combining the separation by implanted oxygen layer transfer (SLT) process with Si epitaxy are proposed to fabricate a silicon-on-insulator (SOI) wafer. Spectroscopic ellipsometry indicates that SOI wafers with the top Si layers of 1491.46 ± 14.9 and 1476.44 ± 18.5 nm are obtained. Defect-free top Si as well as atomic-scale sharp top Si/buried oxide interfaces are observed by transmission electron microscopy, indicating a high crystal quality and a perfect structure of the SLT SOI wafers. Using atomic force microscopy, the surface and top Si/buried oxide interface morphology of the SLT SOI wafers is also investigated. © 2009 The Electrochemical Society. Source

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