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SensorDynamics was a European semiconductor company specialized in developing and manufacturing high-volume micro- and wireless semiconductor sensor products for applications in automotive, industry and high-end consumer sectors. The company was acquired by Maxim Integrated Products, Inc.; a semiconductor company based in Sunnyvale, California. Acquisition was announced in Jul 2011 by Tunc Doluca, CEO and President of Maxim. SensorDynamics was acquired for $164 million . SensorDynamics developed and produced custom-made designs and standard components for use in vehicle stabilization, occupant protection, navigation systems, keyless go systems or autonomous energy generators for wireless and battery free controllers for industrial, automotive and high-end consumer application. With its headquarters in Graz, Austria, SensorDynamics had offices in Italy and Germany and a worldwide sales and distribution network. The company employed about 130 people in July 2011. Wikipedia.

Sabatelli S.,University of Pisa | Galgani M.,European Space Agency | Fanucci L.,University of Pisa | Rocchi A.,SensorDynamics
IEEE Transactions on Instrumentation and Measurement

This paper presents an application-specific integrated processor for an angular estimation system that works with 9-D inertial measurement units. The application-specific instruction-set processor (ASIP) was implemented on field-programmable gate array and interfaced with a gyro-plus-accelerometer 6-D sensor and with a magnetic compass. Output data were recorded on a personal computer and also used to perform a live demo. During system modeling and design, it was chosen to represent angular position data with a quaternion and to use an extended Kalman filter as sensor fusion algorithm. For this purpose, a novel two-stage filter was designed: The first stage uses accelerometer data, and the second one uses magnetic compass data for angular position correction. This allows flexibility, less computational requirements, and robustness to magnetic field anomalies. The final goal of this work is to realize an upgraded application-specified integrated circuit that controls the microelectromechanical systems (MEMS) sensor and integrates the ASIP. This will allow the MEMS sensor gyro plus accelerometer and the angular estimation system to be contained in a single package; this system might optionally work with an external magnetic compass. © 1963-2012 IEEE. Source

Hammer H.,SensorDynamics
Journal of Microelectromechanical Systems

Analytical expressions for electric potential and electric fringe fields in regions above the fingers of MEMS (microelectromechanical systems) comb capacitances are derived using potential-theoretic methods. The formulas are valid for the following: 1) a comb geometry exhibiting a large number of identical fingers and 2) a finger geometry where the gap between fingers is small compared to the height of the fingers and the finger overlap. For these conditions, symmetries that are inherent to the comb geometry can be exploited fruitfully to set up a properly defined Dirichlet problem formulation for the potential which can be solved for explicitly, yielding a series expansion for the electrostatic potential and electric field components. The accuracy of the approximated analytical solutions, obtained by truncating the series expansions to contain only a finite number of terms, is compared with the results obtained from finite element simulations of the electrostatic potential and electric field. From the analytic result, an approximation to the levitation force acting on the upper finger surfaces is derived. A formula expressing the mean length of the fringe electric field lines emanating from the upper finger surfaces into the ambient space is presented. © 2006 IEEE. Source

SensorDynamics | Date: 2012-06-29

A transponder is disclosed to receive a wireless electromagnetic query signal and transmit a corresponding wireless electromagnetic response signal. The transponder comprises a first coil and at least one further coil that function as antennas to receive the wireless electromagnetic query signal and generate separate wired electrical incoming signals. An axis of the first coil and an axis of the at least one further coil are differently aligned in space, and each coil is associated with at least one means for limiting the voltage of the respective incoming signal. The separate wired electrical incoming signals are rectified and converted to current signals. The peak values of the current signals are detected and compared, such that a control signal is generated to identify one coil between the first coil and the at least one further coil that has a larger peak value of current.

In a method for the measurement and analysis of tyre air pressure with an allocation of wheel positions (I, II, III, IV) of a vehicle (

Agency: Cordis | Branch: FP7 | Program: BSG-SME | Phase: SME-1 | Award Amount: 1.42M | Year: 2011

Sensors for motion tracking are used in a broad variety of contexts: Image stabilisation in cameras, automotive applications like drive control or precise airbag deployment, and even for recording the movements of a person in sports, physiotherapy or cinematographic character animation. The sensing principle is the detection of acceleration and rotation rate by inertial forces that act on a suspended static or vibrating proof mass. To address low cost markets, micromachining technologies produce thousands of these sensor structures - so-called MEMS (Micro Electro-Mechanical Systems) - on a 200 mm silicon wafer. An Inertial Measurement Unit (IMU) is formed through integration of electronic signal conditioning and sensor elements in a single device that is capable to measure motion in several degrees of freedom. The MILEPOST project targets to extend the accessible markets by a systematic improvement of the long-term stability of IMUs with respect to the electronics and MEMS design and process. The final project goal is to demonstrate a monolithic cluster for sensing threedimensional acceleration and angular velocity. The participating three SMEs provide in-depth system design and integration experience on automotive inertial sensors (SensorDynamics, AT), a broad application background (Xsens, NL), and detailed knowledge about MEMS manufacturing (MEMS Foundry Itzehoe, DE). Their research partners are Fraunhofer Institute for Silicon Technology (DE) and Consorzio Pisa Ricerche (IT). Considering the ever falling price per function in electronic products, the companies expect that they will not be able to compensate turnaround loss by higher productivity in their current activity fields. Systematic research along the whole value creation chain of complex integrated IMUs is therefore a vital need for the SMEs to gain new business opportunities.

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