Stäfa, Switzerland
Stäfa, Switzerland

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Patent
Sensirion AG | Date: 2016-06-08

Electronic device (10) comprising a housing (11) with a fluid-filled cavity (12), the cavity (12) being coupled to the housing (11) such that a pressure in said cavity (12) changes upon application of an external force onto the housing (12). A pressure sensor (13) is arranged for sensing inside said cavity (12) said pressure change and for generating a pressure signal indicative of said pressure change. The device (10) further comprises an evaluation unit (14) for deriving from said pressure signal at least one component of said external force and for generating a force signal that is indicative of said at least one component of said external force and/or for deriving from said pressure signal a deformation of the housing (11) in at least one direction and to generate a force signal that is indicative of said deformation of the housing (11) in at least one direction.


Patent
Sensirion AG | Date: 2016-10-06

The present invention is notably directed to computerized method for detecting parking-related events from a mobile device. The latter comprising a pressure sensor and a peak detection module. The method comprises: monitoring pressure sensor data from the pressure sensor, the pressure sensor data representative of a pressure variation over a period of time; and comparing the monitored pressure sensor data with reference pressure data corresponding to pressure variations over time as occurring inside a vehicle when, on the one hand, opening a door and, on the other hand, closing a door of this vehicle, to detect a corresponding pressure variation in the monitored pressure sensor data, in order to determine whether a vehicle has parked or has started, wherein the steps of monitoring and comparing are performed by the peak detection module, in the vehicle. The present invention is further directed to related devices and computer program products.


Patent
Sensirion AG | Date: 2017-04-26

A method for manufacturing a gas sensor package comprises the steps of providing a semiconductor chip (1) and building a gas sensitive element (4) on a surface of the semiconductor chip (1) by contactless dispensing a first portion of a liquid (9) comprising sensitive material onto the surface of the semiconductor chip (1), and by annealing the dispensed first portion to generate a first layer (41) of sensitive material contributing to the gas sensitive element (4). For N times with N 1, another portion of a liquid (9) comprising the same sensitive material is contactless dispensed onto the previously generated layer (41) of sensitive material, and the other portion is annealed to generate another layer (42) of sensitive material contributing to the gas sensitive element (4).


The invention relates to a flow sensor (1) and a method for determining the presence of a gas bubble (G) in a liquid (L) flowing through the flow sensor (1).


Patent
Sensirion AG | Date: 2017-06-14

A method for manufacturing a semiconductor package, comprising the step of providing an electrically conducting leadframe (2), the leadframe (2) comprising a die pad (21), a set of contact pads (22), a support lead (24) connected to the contact pads (22) of the set, and an area (AR) of reduced thickness (T2) in each contact pad (22) of the set extending across a full width (W) of the respective contact pad (22). A semiconductor chip (3) is mounted on the die pad. The leadframe (2) is arranged in a mold (4), the mold (4) comprising one or more protrusions (411) reaching into the areas (AR) of reduced thickness (T2). A mold compound is applied into the mold (4) for generating an arrangement comprising at least a partial encapsulation (1) of the semiconductor chip (3) with the areas (AR) of reduced thickness (T2) remaining free from the mold compound by means of the protrusions (411) in the mold (4). The arrangement is separated from the support lead (24) in the area (AR) of reduced thickness (T2) of each contact pad (22) of the set.


Patent
Sensirion AG | Date: 2016-12-27

The invention relates to a flow sensor (1), comprising: a semiconductor module (2) on which a temperature sensing means (13a, 13b) and a heat source (12) are arranged, a flow channel (6) for guiding the fluid medium in a flow direction (D), and a wall (W) delimiting the flow channel, wherein said heat source (12) and said temperature sensing means (13a, 13b) are configured such that they are in thermal contact with said wall (W). According to the invention, said wall (W) comprises a glass member (4) and a metal member (3a), wherein the glass member (4) is connected to the metal member (3a).


Patent
Sensirion AG | Date: 2017-07-05

The invention relates to a flow sensor (1), comprising: a semiconductor module (2) on which a temperature sensing means (13a, 13b) and a heat source (12) are arranged, a flow channel (6) for guiding the fluid medium in a flow direction (D), and a wall (W) delimiting the flow channel, wherein said heat source (12) and said temperature sensing means (13a, 13b) are configured such that they are in thermal contact with said wall (W). According to the invention, said wall (W) comprises a glass member (4) and a metal member (3a), wherein the glass member (4) is connected to the metal member (3a).The glass member (4) is connected to the metal member (3a) via a junction (J) such that a recess (43) of the glass member (4) is fluidly connected to two through holes (301, 302) of the metal member (3a), so that said flow channel (6) extends from one through hole (301) forming an inlet of the flow channel (6) via the recess (43) of the glass member (4) to the other through hole (302) which forms an outlet of the flow channel (6). Due to the fact, that the junction J extends circumferentially around the two through holes, the flow channel is sealed by means of the connection between the glass member (4) and the metal member (3a).The semiconductor module (2) comprises a recess (23) on the first side (21) which comprises thin a bottom (24), where the heat source (12) and said temperature sensing means (13a, 13b) are at least partially arranged, so that they are in thermal contact with the glass member (4). For connecting the semiconductor module to the outside world, the semiconductor module (2) comprises electrical contacts (25) which are each connected to a flexible conductor (53) via a solder junction (51). Alternatively or in addition, the flow sensor (1) comprises a transmitter (T) for transmitting data measured by the flow sensor in a wireless fashion to a remote receiver and a battery (B) for powering the components of the flow sensor (1).The housing (3) preferably encapsulates all components of the flow sensor (1), which may be a stand-alone device, but may also form a part of an implant or a medical device such as a catheter or a micro dosing pump. The metal member (3a) forms at least a part of said housing and is made preferably from titanium or steel.The problem underlying the present invention is to provide a flow sensor of the aforementioned kind that reliably shields the components of the flow sensor from the medium to be measured and can particularly be used as a medical device or part of such a device that is in contact with a patient, particularly body fluids of the patient.


The present invention is notably directed to a computerized method for deriving step counts from a hardware component (115 - 120) for a consumer good (4, 10) carried or worn by a user. The hardware component comprises a pressure sensor (116) and a detection module (140), the detection module configured to access data (116D) from the pressure sensor. The method comprising, at the detection module (140): sampling (S20) pressure sensor data from the pressure sensor, the pressure sensor data representative of temporal pressure oscillations; identifying (S30), from the sampled pressure sensor data, a signal corresponding to pressure oscillations characteristics of pressure waves induced by steps taken by the user (3) of the consumer good (10), while travelling on foot; and deriving (S38) a step count from the identified signal. The present invention is further directed to hardware components (115 - 120) and computer program products, configured to perform steps such as described above.


Patent
Sensirion AG | Date: 2016-06-01

The present invention is notably directed to computerized method for detecting parking-related events from a mobile device (10). The latter comprising a pressure sensor (116) and a peak detection module (140). The method comprises: monitoring (S10) pressure sensor data from the pressure sensor (116), the pressure sensor data representative of a pressure variation over a period of time; and comparing (S22) the monitored pressure sensor data with reference pressure data corresponding to pressure variations over time as occurring inside a vehicle (1) when, on the one hand, opening a door and, on the other hand, closing a door of this vehicle, to detect (S24) a corresponding pressure variation in the monitored pressure sensor data, in order to determine (S24, S42, S44) whether a vehicle (1) has parked or has started, wherein the steps of monitoring and comparing are performed by the peak detection module (140), in the vehicle. The present invention is further directed to related devices and computer program products.


Patent
Sensirion AG | Date: 2016-07-20

A sensor package comprises a carrier (11) comprising a through hole (111), and a sensor chip (2) with a front side (fs) and a back side (bs) and a recess (21) in the back side (bs). The sensor chip (2) is attached to the carrier (11) with its back side (bs) facing the carrier (11) by means of an attachment layer (4) thereby defining a first area (A1) of the carrier (2) the sensor chip (2) rests on and a second area (A2) of the carrier (11) facing the recess (21). The through hole (111) is arranged in the first area (A1) of the carrier (11).

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