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Stäfa, Switzerland

Sensirion AG | Date: 2014-08-11

A method of manufacturing an integrated metal oxide gas sensor is described including the steps of depositing a composition with metal oxide particles or precursors thereof at the desired location on a substrate including electronic components followed by a step of heating the substrate whereby the heating step is designed such that it creates a local temperature difference between the location of the deposited composition and the location of more temperature sensitive parts of the sensor such as the electronic components and is interrupted before the temperature of the substrate at the location of the electronic components reaches a threshold above which the more sensitive parts can be damaged.

Sensirion AG | Date: 2015-09-10

A sensor chip comprises a substrate (

Sensirion AG | Date: 2015-07-13

The sensor device comprises a hotplate on a membrane. The hotplate is heated by a N-fold rotationally symmetric heater structure having N>1 heater elements of identical design. Each heater element comprises an inner section, an intermediate section and an outer section arranged in series, with the inner section having a larger electrical cross section than the outer section. This design allows to heat the hotplate to a homogeneous temperature at moderate supply voltages.

Sensirion AG | Date: 2015-02-24

A sensor module for integration within a seat assembly is provided. The sensor module comprises a temperature and/or humidity sensor (

Sensirion AG | Date: 2015-02-12

In a portable electronic device, an ambient temperature is sensed by means of a temperature sensor. In addition, it is assessed if the portable electronic device is exposed to condensation. A corresponding condensation indicator is provided. The condensation indicator is determined based on a dew point and based on sensed temperature values of the past or temperature derived from the past sensed temperature values.

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