Sensirion AG

Stäfa, Switzerland

Sensirion AG

Stäfa, Switzerland
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The invention relates to a flow sensor (1) and a method for determining the presence of a gas bubble (G) in a liquid (L) flowing through the flow sensor (1).


Patent
Sensirion AG | Date: 2017-03-22

A gas sensor module (1) integrated onto a PCB carrier (2) comprising at least one radiation source (3) configured for emitting radiation, at least one radiation detector unit (4) configured to detect at least part of said radiation, and a radiation cell (5) providing at least one radiation path (X) from said radiation source (3) to said radiation detector unit (4). Said PCB carrier (2) is provided with a recess (20) and said radiation path (X) is propagating within said recess (20).


Patent
Sensirion AG | Date: 2017-04-05

The invention relates to a flow sensor for measuring the flow of a medium, particularly a liquid, comprising: a semiconductor module (1) on which at least one temperature sensor (13a, 13b), a heat source (12) and electrical connection points (18) are integrated, a substrate (5) on which conductor paths (19) are provided, wherein the substrate (5) is configured to be at least partially arranged between the semiconductor module (1) and said medium, wherein each connection point (18) is connected to an associated conductor path, and wherein the heat source and the at least one temperature sensor is configured to be in thermal contact with said medium via said substrate (5) such that said substrate (5) forms a thermally conducting partition wall between the semiconductor module (1) and said medium. According to the invention, the partition wall (5a) comprises or is formed as a liquid crystal polymer. Furthermore, the invention relates to a method for manufacturing such a flow sensor.


Patent
Sensirion AG | Date: 2017-01-18

A mass flow controller (10) comprises a fluid inlet (15) and at least one first flow meter (11) to measure a first flow rate (F_(1)) and to output a first flow signal (FS_(1)); at least one second flow meter (12) to measure a second flow (F_(2)) rate and to output a second flow signal (FS_(2)); a control device (13) connected to said first and second flow meters (11,12) and configured and arranged to generate a control signal (C); and at least one control valve (14) connected to said control device (13) to control a total flow rate (F_(out)) through the mass flow controller (10) in response to the control signal (C). The control signal (C) is generated as a function of both the first and second flow signals (FS_(1),FS_(2)) such that the mass flow controllers (10) sensitivity to perturbations of said inlet pressure is minimized.


Patent
Sensirion AG | Date: 2017-03-08

A sensor assembly comprises a substrate arrangement (1) and a sensor chip (2) mounted to the substrate arrangement (1). A sensing element (24) is integrated on or in the sensor chip (2) and is sensitive to at least one parameter of a fluid. An access opening is provided in the substrate arrangement (1) enabling the fluid to access the sensing element (24). A metallization (18) arranged on at least a portion of the substrate arrangement (1) seals a chamber (5) containing the sensor chip (2) which portion comprises one or more of a wall defining the access opening or an area facing the sensor chip (2).


Patent
Sensirion AG | Date: 2017-02-15

Flow sensor device (10) that comprises a first flow sensor arrangement (11) for intermittently measuring a flow rate (R) of a fluid (g) and a second sensor (12) for measuring a parameter (P) indicative of said flow rate (R) or of a change in said flow rate (R). The flow sensor device (10) further comprises a control unit (13) that is configured and arranged to receive at least one second measurement signal (S) from said second flow sensor (12), to generate a control signal (C) if the change in said flow rate (R) sensed by the second sensor (12) exceeds a predefined threshold value, and to trigger with said control signal (C) a measurement with said first flow sensor arrangement (11). The second sensor (12) uses less energy for the measurement than the first flow sensor arrangement (11) does.


Patent
Sensirion AG | Date: 2017-02-01

A method for manufacturing a gas sensor, comprising the steps of integrating a processing circuit (36) to a gas sensor chip (3), integrating a heater (34) to the gas sensor chip (3), and applying a sensitive material to the gas sensor chip (3), for building a layer (31) sensitive to a gas. Multiple gas sensor chips (3) are mounted onto a carrier (2), wherein the common carrier (2) comprises sets of contact pads (200). Each set of contact pads (200) electrically contacts one of the multiple gas sensor chips (3), wherein one of the contact pads (22-27) out of each set (200) is a supply contact pad (25), for supplying electrical current to the processing circuit (36) of the corresponding gas sensor chip (3). A set of supply contact pads (250) is electrically interconnected by electrical interconnectors (251).


Patent
Sensirion AG | Date: 2017-04-26

A method for manufacturing a gas sensor package comprises the steps of providing a semiconductor chip (1) and building a gas sensitive element (4) on a surface of the semiconductor chip (1) by contactless dispensing a first portion of a liquid (9) comprising sensitive material onto the surface of the semiconductor chip (1), and by annealing the dispensed first portion to generate a first layer (41) of sensitive material contributing to the gas sensitive element (4). For N times with N 1, another portion of a liquid (9) comprising the same sensitive material is contactless dispensed onto the previously generated layer (41) of sensitive material, and the other portion is annealed to generate another layer (42) of sensitive material contributing to the gas sensitive element (4).


In a method for determining a combustion parameter (H_(0)) of a gas in a gas flow, a flow velocity or volumetric flow rate (dV/dt) of the gas in the gas flow is determined. In addition, a thermal flow sensor is exposed to the gas flow. A heat transfer parameter (_(0)) and a heat capacity parameter (c_(p0)_(0)) of the gas are calculated from an output of the thermal flow sensor and from the flow velocity or volumetric flow rate. The combustion parameter of the gas is then calculated from the heat transfer parameter and the heat capacity parameter.


Patent
Sensirion AG | Date: 2017-04-12

A gas sensor (10) comprises a set of gas sensing cells (1). Each gas sensing cell (1) comprises on or integrated in a substrate (14): a gas sensitive element (11), and a heater (15) for heating the assigned gas sensitive element (11). A control unit is configured to individually control the heaters (15) of the set of gas sensing cells (1). During a first period (T1) in the lifetime of the gas sensor (10), gas measurements are conducted with a first gas sensing cell (FSC) of the set by activating the corresponding heater (15) to heat the assigned sensitive element (11) while at the same time leaving the heater (15) of at least one other gas sensing cell (OSC) of the set inactive. In response to a trigger event (TR1), during a second period (T2) in the lifetime of the gas sensor (10) following the first period (T1), gas measurements are conducted with the other gas sensing cell (OSC) by activating the corresponding heater (15) to heat the assigned sensitive element (11), while at the same time leaving the heater (15) of the first gas sensing cell (FSC) inactive.

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