Attleboro, MA, United States
Attleboro, MA, United States

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Patent
Sensata Technologies | Date: 2016-10-05

A circuit assembly (700) includes one or more electrical conductors (520). Each of the electrical conductors has a first axial end and a second axial end; the first axial end is disposed opposite the second axial end. The assembly further comprises a non-electrically conductive retainer component (510) operable to: i) retain the electrical conductor and ii) contact a lateral side and/or tip of the electrical conductor onto a conductive pad (152) of a circuit board (150). The retainer component exerts an appropriate force with respect to the one or more electrical conductors such that, a respective lateral side and/or tip of each of the electrical conductors contact a corresponding electrically conductive pad on the circuit board.


Patent
Sensata Technologies | Date: 2016-04-06

A method for correcting offset drift in a sensor used in cyclic sensing is provided. The method includes: identifying a target value for a parameter of a signal between sensing cycles of the sensor; ascertaining a difference between a measured value for the signal and the target value; ascertaining a duration between the sensing cycles; using the difference and the duration, calculating a number of steps to attain the target value from the measured value; and adjusting the measured value by the number of steps to substantially agree with the target value. A pressure sensor is disclosed.


Patent
Sensata Technologies | Date: 2016-09-21

In an embodiment, a pressure transducer includes a first portion, a second portion, and a third portion. The third portion is positioned in a cavity contained in the second portion. In addition, a seal is placed in the cavity. The first portion and second include provisions for applying a downward pressure on the third portion when the first portion and the second portion are joined. The downward pressure is applied by the third portion to the seal to seal the cavity.


Patent
Sensata Technologies | Date: 2016-06-16

A flexible printed circuit may include a flexible body portion and a flexible head end portion, where conductors and/or elongated cut outs may be formed in a pattern. The flexible body may include a proximal end and a distal end, wherein the proximal end is configured to be connected to a stationary object and the distal end is configured to be connected to a moving object that moves in relation to the stationary object. The head end of the flexible printed circuit may be located at the distal end of the flexible body. The head end may include a plurality of elongated cut-outs, and/or a plurality of electrical connection pads suspended from the flexible body by the plurality of elongated cutouts.


Patent
Sensata Technologies | Date: 2016-02-17

A small form factor Microfused Silicon Strain gage (MSG) sensor incorporates an offset spring and feed-in features. A pressure sensor includes a spring having first and second coiled sections offset by a coiled center section in a middle that is used to make offset contact between two electrical contact pads.


Patent
Sensata Technologies | Date: 2016-06-14

A temperature sensor including a mineral-insulated supply line, a bottomed metal tube and a temperature sensing element secured in a support structure. An open end part of the bottomed metal tube is connected mechanically to the mineral-insulated supply line. A wire connection mechanically and electrically couples the temperature sensing element to the mineral-insulated supply line. The support structure is moveable in axial direction of the bottomed metal tube in a bottom end part of the bottomed metal tube.


Patent
Sensata Technologies | Date: 2016-06-08

An oil filled pressure sensor is provided. The sensor includes a drift-stabilized pressure sensing element mounted to and electrically isolated from a header body, the pressure sensing element immersed in an oil filled cavity and temperature stabilized for sensing pressure in the cavity without substantial signal drift. A method of fabrication is provided.


Patent
Sensata Technologies | Date: 2016-02-18

In an embodiment, a pressure transducer includes a first portion, a second portion, and a third portion. The third portion is positioned in a cavity contained in the second portion. In addition, a seal is placed in the cavity. The first portion and second include provisions for applying a downward pressure on the third portion when the first portion and the second portion are joined. The downward pressure is applied by the third portion to the seal the cavity. The first portion also includes a stop and the second portion also includes a snap member. The snap member includes a prong that contains a first edge and a second edge. The snap member allows movement of the first portion after the first edge of the prong meets the stop and restricts movement of the first portion after the second edge of the prong meets the stop.


Featured is a current interruption device including first and second terminal members, each terminal member having at least first and second through apertures and a terminal portion. The first and second through apertures of each terminal member are arranged spaced from each other and in a predetermined pattern. Also included is a plurality of pin structures, one pin structure for each pair of through apertures, where one pin structure is secured in the first through apertures of the respective first and second terminal members and another pin structure is secured in the second through apertures of the respective first and second terminal members. Such securing results in the first and second terminal members being maintained in fixed relation. Such a device is located within a housing so that the terminal portions extend outwardly from a housing end surface.


Patent
Sensata Technologies | Date: 2016-10-05

Methods and apparatus for a combined temperature, absolute and differential pressure sensor assembly. A sensor assembly includes a housing, the housing including a carrier, a differential pressure sensor, a manifold absolute pressure sensor, an orifice shared by both the differential pressure sensor and the manifold absolute pressure sensor, a printed circuit board (PCB), a thermistor, terminal pins, and a cover.

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