Senju Metal Industry Co.

Adachi-ku, Japan

Senju Metal Industry Co.

Adachi-ku, Japan

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Patent
Senju Metal Industry Co. | Date: 2016-09-09

Provided is a jet nozzle that varies a width of a flow of jetted molten solder. The jet nozzle contains a nozzle main body having a channel section at its part and a molten solder flow width varying member that varies a width of the upper opening end of the nozzle main body by a slide of the molten solder flow width varying member within the channel section of the nozzle main body to vary a width of the molten solder flow jetted from the upper opening end of the nozzle main body. The molten solder flow width varying member includes a molten solder flow width varying plate that varies the width of the molten solder flow, a rectangular rectifying piece that extends along a slide direction of the molten solder flow width varying member, and a sliding shaft that slides the rectifying piece.


Patent
Senju Metal Industry Co. | Date: 2017-05-10

To provide a solder alloy in which the discoloration thereof is inhibited and a growth of oxide film is inhibited under a high temperature and high humidity environment, a solder ball, a chip solder, a solder paste and a solder joint, is an object. The solder alloy contains 0.005 mass% or more and 0.1 mass% or less of Mn, 0.001 mass% or more and 0.1 mass% or less of Ge, and a balance of Sn. A plurality of Ge oxides is distributed on an outermost surface side of an oxide film including Sn oxide, Mn oxide and Ge oxide by adding 0.005 mass% or more and 0.1 mass% or less of Mn, 0.001 mass% or more and 0.1 mass% or less of Ge to the solder alloy having a principal ingredient of Sn, so that it is possible to obtain the discolor-inhibiting effect even under the high-temperature and high-humidity environment. Mn and O_(2) are reacted to prevent Sn from reacting with O_(2), thereby inhibiting a generation of Sn oxide. This prevents an increase in the thickness of oxide film so that a fusion property can be improved.


Patent
Senju Metal Industry Co. | Date: 2016-12-09

A method of preventing variation of the viscosity of a solder paste, and flux for producing solder paste, viscosity of which is prevented from varying. In the flux, which is suitable to be mixed with solder powder to produce the solder paste, an amount of methacrylate polymer which reduces a thixotropic index of the solder paste and enhances viscosity thereof is contained. As the methacrylate polymer, polyalkyl methacrylate having an alkyl group is preferable, and it is preferable that an addition amount of polyalkyl methacrylate is 05.-5.0 mass % of the flux. Further, as a thixotropic agent, hardened castor oil is preferably added.


Patent
Senju Metal Industry Co. | Date: 2017-02-07

Using flux to suppress increase in the viscosity of solder paste during its storage and also to improve the fusibility of a solder alloy. The flux, which contains an activator and a solvent, forms solder paste by being mixed with a granular solder alloy. The flux contains a monoalkyl propylene glycol-based solvent. It is preferable that the monoalkyl propylene glycol-based solvent is butyl propylene triglycol or butyl propylene diglycol. It is also preferable that the amount of monoalkyl propylene glycol-based solvent is equal to or more than 75 percent by mass but less than 100 percent by mass of the amount of all the solvents.


Patent
Senju Metal Industry Co. | Date: 2016-12-29

A method of printing solder paste on a substrate through minute apertures in a mask member, in which the solder paste is supplied to the apertures of the mask member under less than atmospheric pressure and has a viscosity so that the solder paste is filled in the apertures under atmospheric pressure. It is preferable that the solder paste has a viscosity of 50 through 150 Pas and a thixotropic ratio of 0.3 through 0.5. Further, the solder paste is obtained by mixing a flux containing solvent having a boiling point such that volatilization thereof is suppressed under the less than atmospheric pressure and solder powders. It is preferable that in the flux, the solvent having the boiling point of 240 C. or more is used and the solvent is octanediol.


Patent
Senju Metal Industry Co. | Date: 2017-05-31

To provide a solder alloy capable of suppressing the occurrence of liftoff phenomena, suppressing the deterioration by thermal fatigue, and suppressing the generation of solder bridges and solder icicles in a fillet. The solder alloy has an alloy composition consisting of, in mass %: Bi: 0.1 to 0.8%; Ag: 0 to 0.3%; Cu: 0 to 0.7%; P: 0.001 to 0.1%, with the balance being Sn, and a total amount of Ag and Bi being from 0.3 to 0.8%.


The invention enables quick evacuation of a chamber to a specified target degree of vacuum while increasing selectivity of evacuation conditions. A vacuum-processing device contains a chamber 40 that enables a workpiece to be soldered in a vacuum environment, an operating part 20 that sets a condition for evacuating the chamber 40, a pump 23 that evacuates the chamber 40, and a control portion 61 that calculates the amount of decrease in the degree of vacuum when evacuating the chamber 40 using a predetermined pump output, sets the calculated value as a reference value and switches an evacuation property from the evacuation property including a lower pump output to the evacuation property including a higher pump output when the calculated amount of decrease in degree of vacuum in real time has become smaller than the reference value.


Patent
Senju Metal Industry Co. | Date: 2017-07-12

Provided is a lead-free solder alloy for terminal preliminary plating, by which the separation property when pulling up the terminals from molten solder is improved. The lead-free solder alloy for terminal preliminary plating contains 4 mass % or more and 6 mass % or less of Cu, 0.1 mass % or more and 0.2 mass % or less of Ni, 0.01 mass % or more and 0.04 mass % or less of Ga, 0.004 mass % or more and 0.03 mass % or less of P, and a remainder of Sn, a total amount of Ga and P being 0.05 mass % or less. Its tension in a melted condition by heating in soldering temperature is 200 dyn/cm or less.


Patent
Senju Metal Industry Co. | Date: 2017-07-19

Provided are a Cu column, a Cu core column, a solder joint, and a through-silicon via, which have the low Vickers hardness and the small arithmetic mean roughness.For the Cu column 1 according to the present invention, its purity is equal to or higher than 99.9% and equal to or lower than 99.995%, its arithmetic mean roughness is equal to or less than 0.3m, and its Vickers hardness is equal to or higher than 20HV and equal to or less than 60HV. Since the Cu column 1 is not melted at a melting temperature in the soldering and a definite stand-off height (a space between the substrates) can be maintained, it is preferably applied to the three dimensional mounting or the pitch narrowing mounting.


Patent
Senju Metal Industry Co. | Date: 2017-07-05

Provided is a solder material which enables a growth of an oxide film to be inhibited. A solder ball 1A which is a solder material is composed of a solder layer 2 and a covering layer 3 covering the solder layer 2. The solder layer 2 is spherical and is composed of a metal material containing an alloy including Sn content of 40% and more. Otherwise the solder layer 2 is composed of a metal material including Sn content of 100%. In the covering layer 3, a S_(n)O film 3a is formed outside the solder layer 2, and a S_(n)O_(2) film 3b is formed outside the S_(n)O film 3a. A thickness of the covering layer 3 is preferably more than 0nm and equal to or less than 4.5nm. Additionally, a yellow chromaticity of the solder ball 1A is preferably equal to or less than 5.7.

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