Durham, NC, United States
Durham, NC, United States

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An optical power transfer device includes a transmitter circuit, including a laser light source that is configured to emit coherent light responsive to operation above a lasing threshold, and is configured to emit incoherent light responsive operation below the lasing threshold. A proximity sensor circuit is coupled to the transmitter circuit and is configured to output a detection signal therefrom responsive to authentication of an optical receiver including at least one photovoltaic cell having surface area of about 4 square millimeters or less within a proximity thereof. The transmitter circuit is configured to operate the laser light source below the lasing threshold to emit the incoherent light responsive to an absence of the detection signal from the proximity sensor circuit. Related devices and methods of operation are also discussed.


An optical data communication and power converter device includes a receiver circuit comprising an optical receiver. The optical receiver includes a photovoltaic device and a photoconductive device arranged within an area that is configured for illumination by a modulated optical signal emitted from a monochromatic light source of a transmitter circuit. The photovoltaic device is configured to generate electric current responsive to the illumination of the area by the modulated optical signal. The photoconductive device is configured to generate a data signal, distinct from the electric current, responsive to the illumination of the area by the modulated optical signal. A reverse bias voltage may be applied to the photoconductive device by the photovoltaic device, independent of an external voltage source. Related devices and methods of operation are also discussed.


Patent
University of Illinois at Urbana - Champaign and Semprius | Date: 2015-01-16

Multi-junction photovoltaic devices and methods for making multi-junction photovoltaic devices are disclosed. The multi-junction photovoltaic devices comprise a first photovoltaic p-n junction structure having a first interface surface, a second photovoltaic p-n junction structure having a second interface surface, and an optional interface layer provided between the first interface surface and the second interface surface, where the photovoltaic p-n junction structures and optional layers are provided in a stacked multilayer geometry. In an embodiment, the optional interface layer comprises a chalcogenide dielectric layer.


Patent
University of Illinois at Urbana - Champaign and Semprius | Date: 2015-07-15

Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.


Patent
Semprius and University of Illinois at Urbana - Champaign | Date: 2015-10-09

A method of printing transferable components includes pressing a stamp including at least one transferable semiconductor component thereon on a target substrate such that the at least one transferable component and a surface of the target substrate contact opposite surfaces of a conductive eutectic layer. During pressing of the stamp on the target substrate, the at least one transferable component is exposed to electromagnetic radiation that is directed through the transfer stamp to reflow the eutectic layer. The stamp is then separated from the target substrate to delaminate the at least one transferable component from the stamp and print the at least one transferable component onto the surface of the target substrate. Related systems and methods are also discussed.


Methods of forming integrated circuit devices include forming a sacrificial layer on a handling substrate and forming a semiconductor active layer on the sacrificial layer. The semiconductor active layer and the sacrificial layer may be selectively etched in sequence to define an semiconductor-on-insulator (SOI) substrate, which includes a first portion of the semiconductor active layer. A multi-layer electrical interconnect network may be formed on the SOI substrate. This multi-layer electrical interconnect network may be encapsulated by an inorganic capping layer that contacts an upper surface of the first portion of the semiconductor active layer. The capping layer and the first portion of the semiconductor active layer may be selectively etched to thereby expose the sacrificial layer. The sacrificial layer may be selectively removed from between the first portion of the semiconductor active layer and the handling substrate to thereby define a suspended integrated circuit chip encapsulated by the capping layer.


A substrate includes an anchor area physically secured to a surface of the substrate and at least one printable electronic component. The at least one printable electronic component includes an active layer having one or more active elements thereon, and is suspended over the surface of the substrate by electrically conductive breakable tethers. The electrically conductive breakable tethers include an insulating layer and a conductive layer thereon that physically secure and electrically connect the at least one printable electronic component to the anchor area, and are configured to be preferentially fractured responsive to pressure applied thereto. Related methods of fabrication and testing are also discussed.


A large-format substrate with distributed control elements is formed by providing a substrate and a wafer, the wafer having a plurality of separate, independent chiplets formed thereon; imaging the wafer and analyzing the wafer image to determine which of the chiplets are defective; removing the defective chiplet(s) from the wafer leaving remaining chiplets in place on the wafer; printing the remaining chiplet(s) onto the substrate forming empty chiplet location(s); and printing additional chiplet(s) from the same or a different wafer into the empty chiplet location(s).


An optical power converter device includes a light source configured to emit monochromatic light, and a multi-junction photovoltaic cell including respective photovoltaic cell layers having different bandgaps and/or thicknesses. The respective photovoltaic cell layers are electrically connected to collectively provide an output voltage and are vertically stacked relative to a surface of the multi-junction photovoltaic cell that is arranged for illumination by the monochromatic light from the light source. Responsive to the illumination of the surface by the monochromatic light from the light source, the respective photovoltaic cell layers are configured to generate respective output photocurrents that are substantially equal. Related devices and methods of operation are also discussed.


Grant
Agency: Department of Defense | Branch: Air Force | Program: SBIR | Phase: Phase I | Award Amount: 149.75K | Year: 2015

ABSTRACT:We propose an ultra-low profile hybrid CPV concept that combines multi-junction (MJ) CPV cells capable of 40% efficiency at 1 sun with a low-cost single-junction PV backplane in a design that is lightweight, based on concentration ratios >100X and has a panel thickness 500 W/kg and a wide acceptance angle of >4.0. The low-profile design, combined with world record performance, will yield W/m3 metrics that are unprecedented for space photovoltaics. Use of concentrating optics enables dramatic (order of magnitude) cost savings through reduction in III-V material usage, while also improving radiation shielding. Rigidity is provided by the lens array combined with a lightweight honeycomb composite. Key innovations include: (1) low profile optics using monolithic, ultra-thin, lightweight lens arrays; (2) microscale 6 junction solar cells with 40% efficiency (AM0) at 1sun and high concentration efficiency of >46%, which are stacked by (3) micro-transfer printing directly onto (4) COTS c-Si cells. The use of larger area c-Si allows the design to generate power without solar tracking. This capability is important during deployment and mitigates the risks associated with a loss of tracking accuracy.BENEFIT:The research and development will produce light-weight solar arrays with significantly higher specific power densities (W/m3, W/m2, W/kg) and lower costs than what is available at present or is anticipated to be available in the foreseeable future. Concentrator configurations increase the radiation hardness of the solar arrays of the research and development. The outcome of the proposed work is expected to be applicable for solar power generation in commercial spacecraft.

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