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Durham, NC, United States

A method for selectively transferring active components from a source substrate to a destination substrate includes providing a source substrate having a process side including active components and a back side opposite the process side, the active components having respective primary surfaces including electrical connections thereon adjacent the process side and respective secondary surfaces opposite the primary surfaces and facing the back side; pressing a first stamp having first pillars protruding therefrom against the active components on the process side of the source substrate to adhere the respective primary surfaces of the active components including the electrical connections thereon to respective transfer surfaces of the first pillars; pressing a second stamp having second pillars protruding therefrom against the active components on the first pillars of the first stamp to adhere the respective secondary surfaces of the active components to respective transfer surfaces of the second pillars, wherein the respective transfer surfaces of the second pillars have greater adhesive strength than those of the first pillars; and pressing the second stamp including the active components on the second pillars thereof against a destination substrate to adhere the respective primary surfaces of the active components including the electrical connections thereon to a receiving surface of the destination substrate.

An active substrate includes a plurality of active components distributed over a surface of a destination substrate, each active component including a component substrate different from the destination substrate, and each active component having a circuit and connection posts on a process side of the component substrate. The connection posts may have a height that is greater than a base width thereof, and may be in electrical contact with the circuit and destination substrate contacts. The connection posts may extend through the surface of the destination substrate contacts into the destination substrate connection pads to electrically connect the connection posts to the destination substrate contacts.

An active component array includes a target substrate having one or more contacts formed on a side of the target substrate, and one or more printable active components distributed over the target substrate. Each active component includes an active layer having a top side and an opposing bottom side and one or more active element(s) formed on or in the top side of the active layer. The active element(s) are electrically connected to the contact(s), and the bottom side is adhered to the target substrate. Related fabrication methods are also discussed.

University of Illinois at Urbana - Champaign and Semprius | Date: 2015-07-15

Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.

Agency: Department of Defense | Branch: Air Force | Program: SBIR | Phase: Phase I | Award Amount: 149.75K | Year: 2015

ABSTRACT:We propose an ultra-low profile hybrid CPV concept that combines multi-junction (MJ) CPV cells capable of 40% efficiency at 1 sun with a low-cost single-junction PV backplane in a design that is lightweight, based on concentration ratios >100X and has a panel thickness 500 W/kg and a wide acceptance angle of >4.0. The low-profile design, combined with world record performance, will yield W/m3 metrics that are unprecedented for space photovoltaics. Use of concentrating optics enables dramatic (order of magnitude) cost savings through reduction in III-V material usage, while also improving radiation shielding. Rigidity is provided by the lens array combined with a lightweight honeycomb composite. Key innovations include: (1) low profile optics using monolithic, ultra-thin, lightweight lens arrays; (2) microscale 6 junction solar cells with 40% efficiency (AM0) at 1sun and high concentration efficiency of >46%, which are stacked by (3) micro-transfer printing directly onto (4) COTS c-Si cells. The use of larger area c-Si allows the design to generate power without solar tracking. This capability is important during deployment and mitigates the risks associated with a loss of tracking accuracy.BENEFIT:The research and development will produce light-weight solar arrays with significantly higher specific power densities (W/m3, W/m2, W/kg) and lower costs than what is available at present or is anticipated to be available in the foreseeable future. Concentrator configurations increase the radiation hardness of the solar arrays of the research and development. The outcome of the proposed work is expected to be applicable for solar power generation in commercial spacecraft.

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