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Goh S.H.,Globalfoundries | Yeoh B.L.,Globalfoundries | You G.F.,Globalfoundries | Hao H.,Globalfoundries | And 3 more authors.
Conference Proceedings from the International Symposium for Testing and Failure Analysis | Year: 2015

A modulated laser beam in the form of a continuous pulse train is explored on Laser Assisted Device Alteration (LADA). We term this pulsed-LADA to differentiate from conventional continuous wave (cw)-LADA. It is found that a duty cycle of less than 0.9 at low frequency above 1 kHz is sufficient to experience significant enhancements in laser stimulation. Following this, a new derivative of LADA technique called Electrically-enhanced LADA (EeLADA) is developed. Experimental results to demonstrate its capability in improving diagnostic resolution and potential application to hard failure debug will be presented. Copyright © 2015 ASM International® All rights reserved. Source


Patent
Semicaps Pte Ltd | Date: 2013-05-06

A wafer stage and a method of supporting a wafer for inspection. the wafer stage comprises a platform for supporting a wafer such that a backside of the wafer is suspended above a cavity of the platform; and a support structure disposed substantially within the cavity for supporting a portion of the wafer; wherein the wafer stage is adapted for relative movement of the platform with respect to the support structure for alignment of the wafer with respect to a probe.


Goh S.H.,Globalfoundries | You G.F.,Globalfoundries | Yeoh B.L.,Globalfoundries | Chan Y.H.,Globalfoundries | And 3 more authors.
Conference Proceedings from the International Symposium for Testing and Failure Analysis | Year: 2013

Wafer level tester-based fault isolation (FI) tool exists back in 2008 but is not widely adopted by industry. This is expected because such tool is commonly known for its primary role in dynamic electrical FI. Since packages are readily available, there is little motivation in using wafers. This paper provides a different perspective to consider such tool as part of a wafer level debug solution to enhance current failure pre diagnostic and diagnosis capabilities, to meet requirements for fast and effective yield ramp. Test cases are presented to support this perspective and a roadmap that guides next generation wafer level FI tool is also proposed at the end of the paper. Copyright © 2013 ASM International® All rights reserved. Source


Patent
Semicaps Pte Ltd | Date: 2014-09-26

A method and an apparatus for cooling a semiconductor device. The method comprises the steps of contacting a surface of the semiconductor device with respective end portions of an array of contact elements thermally coupled to a cooling fluid, and disposing a flexible, heat conductive sheet between the respective end portions of the contact elements and the surface of the semiconductor device for transferring heat generated in the semiconductor device to the cooling fluid via the sheet and the contact elements.


Teo J.K.J.,National University of Singapore | Chua C.M.,SEMICAPS Pte Ltd. | Koh L.S.,SEMICAPS Pte Ltd. | Phang J.C.H.,National University of Singapore
Electronics Letters | Year: 2011

The variation of backside reflectance modulation effects on metal line samples at different electrical bias and silicon backside thicknesses is investigated. Negative reflected intensity modulations are observed and are one to two orders of magnitude larger than the values from published results. It was found that the negative reflected intensity modulation with electrical bias depends on the temperature variation of the absorption coefficient while observed positive reflectance intensity modulation is due to temperature variation of the reflectance. © 2011 The Institution of Engineering and Technology. Source

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