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News Article | February 21, 2017
Site: en.prnasia.com

MILPITAS, California, Feb. 21, 2017 /PRNewswire/ -- SEMI, the global association connecting and representing the worldwide electronics manufacturing supply chain, today announced the appointment of Ajit Manocha as its president and CEO. He will succeed Denny McGuirk, who announced his intention to retire last October. The SEMI International Board of Directors conducted a comprehensive search process, selecting Manocha, an industry leader with over 35 years of global experience in the semiconductor industry. Manocha will begin his new role on March 1 at SEMI's new Milpitas headquarter offices. "Ajit has a deep understanding of our industry's dynamics and the interdependence of the electronics manufacturing supply chain," said Y.H. Lee, chairman of SEMI's board of directors. "From his early days developing dry etch processes at AT&T Bell Labs, to running global manufacturing for Philips/NXP, Spansion, and, as CEO of GLOBALFOUNDRIES, Ajit has been formative to our industry's growth. Ajit is the ideal choice to drive our SEMI 2020 plan and beyond, ensuring that SEMI provides industry stewardship and engages its members to advance the interests of the global electronics manufacturing supply chain." "Beyond his experience leading some of our industry's top fabs, Ajit has long been active at SEMI and has served on boards of several global associations and consortia," said Denny McGuirk, retiring president and CEO of SEMI. "Ajit's experience in technology, manufacturing, and industry stewardship is a powerful combination. I'm very excited to be passing the baton to Ajit as he will continue to advance the growth and prosperity of SEMI's members." "I have tremendous respect for the work SEMI does on behalf of the industry," said Ajit Manocha, incoming president and CEO of SEMI. "I am excited to be joining SEMI at a time when our ecosystem is rapidly expanding due to extensive innovation on several fronts. From applications based on the Internet and the growth of mobile devices to artificial intelligence/machine learning, autonomous vehicles, and the Internet of Things, there is a much broader scope for SEMI to foster heterogeneous collaboration and fuel growth today than ever before. I am looking forward to leading the global SEMI organization as we strive to maximize value for our members across this extended global ecosystem." Manocha was formerly CEO at GLOBALFOUNDRIES, during which he also served as vice chairman and chairman of the Semiconductor Industry Association (SIA). Earlier, Manocha served as EVP of worldwide operations at Spansion. Prior to Spansion, Manocha was EVP and chief manufacturing officer at Philips/NXP Semiconductors. Manocha also held senior management positions within AT&T Microelectronics. He began his career at AT&T Bell Laboratories as a research scientist where he was granted several patents related to microelectronics manufacturing. Manocha holds a bachelor's degree from the University of Delhi and a master's degree in physical chemistry from Kansas State University. About SEMI SEMI® connects nearly 2,000 member companies and 250,000 professionals worldwide annually to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, and services that enable smarter, faster, more powerful, and more affordable electronic products. Since 1970, SEMI has built connections that have helped its members grow, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C.  For more information, visit www.semi.org and follow SEMI on LinkedIn and Twitter.


News Article | February 21, 2017
Site: www.prnewswire.co.uk

MILPITAS, California, Feb. 21, 2017 /PRNewswire/ -- SEMI, the global association connecting and representing the worldwide electronics manufacturing supply chain, today announced the appointment of Ajit Manocha as its president and CEO. He will succeed Denny McGuirk, who announced his intention to retire last October. The SEMI International Board of Directors conducted a comprehensive search process, selecting Manocha, an industry leader with over 35 years of global experience in the semiconductor industry.  Manocha will begin his new role on March 1 at SEMI's new Milpitas headquarter offices. "Ajit has a deep understanding of our industry's dynamics and the interdependence of the electronics manufacturing supply chain," said Y.H. Lee, chairman of SEMI's board of directors. "From his early days developing dry etch processes at AT&T Bell Labs, to running global manufacturing for Philips/NXP, Spansion, and, as CEO of GLOBALFOUNDRIES, Ajit has been formative to our industry's growth. Ajit is the ideal choice to drive our SEMI 2020 plan and beyond, ensuring that SEMI provides industry stewardship and engages its members to advance the interests of the global electronics manufacturing supply chain." "Beyond his experience leading some of our industry's top fabs, Ajit has long been active at SEMI and has served on boards of several global associations and consortia," said Denny McGuirk, retiring president and CEO of SEMI. "Ajit's experience in technology, manufacturing, and industry stewardship is a powerful combination. I'm very excited to be passing the baton to Ajit as he will continue to advance the growth and prosperity of SEMI's members." "I have tremendous respect for the work SEMI does on behalf of the industry," said Ajit Manocha, incoming president and CEO of SEMI. "I am excited to be joining SEMI at a time when our ecosystem is rapidly expanding due to extensive innovation on several fronts. From applications based on the Internet and the growth of mobile devices to artificial intelligence/machine learning, autonomous vehicles, and the Internet of Things, there is a much broader scope for SEMI to foster heterogeneous collaboration and fuel growth today than ever before. I am looking forward to leading the global SEMI organization as we strive to maximize value for our members across this extended global ecosystem." Manocha was formerly CEO at GLOBALFOUNDRIES, during which he also served as vice chairman and chairman of the Semiconductor Industry Association (SIA).  Earlier, Manocha served as EVP of worldwide operations at Spansion. Prior to Spansion, Manocha was EVP and chief manufacturing officer at Philips/NXP Semiconductors. Manocha also held senior management positions within AT&T Microelectronics. He began his career at AT&T Bell Laboratories as a research scientist where he was granted several patents related to microelectronics manufacturing. Manocha holds a bachelor's degree from the University of Delhi and a master's degree in physical chemistry from Kansas State University. About SEMI SEMI® connects nearly 2,000 member companies and 250,000 professionals worldwide annually to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, and services that enable smarter, faster, more powerful, and more affordable electronic products. Since 1970, SEMI has built connections that have helped its members grow, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C.  For more information, visit www.semi.org and follow SEMI on LinkedIn and Twitter.


Morgan R.,SEMI | Weiss B.,SEMI | Berwind J.,AEI Research | Raithel S.,SEMI Europe
Conference Record of the IEEE Photovoltaic Specialists Conference | Year: 2012

The "new" global photovoltaic industry is rapidly approaching $100B[1] but remains heavily subsidized, policy driven and subject to market barriers and profitability challenges. The key to competitive success and industry growth revolves around standardization and technology where the industry can resolve shared challenges collectively and publicly. This paper will outline how global industry standards and roadmaps help reduce industry barriers and accelerate market adoption of photovoltaics. © 2012 IEEE.


Vogler D.,SEMI
Solid State Technology | Year: 2013

Speakers and industry experts commented on the challenges they wanted to highlight in advance of the 2013 SEMICON West TechXPOT to be held July 9-11 in San Francisco. Adam Brand, senior director, Transistor Technology Group at Applied Materials, told SEMI that the increased complexity of the FinFET, high mobility channel, and GAA devices in combination with continued scaling requires more precision in structure formation and improved materials to address structure formation and parasitic effects. Gary Patton, VP at IBM's Semiconductor Research and Development Center, told SEMI that in order for the full benefit of the FinFET to be realized below 20nm, a dielectric isolation scheme is necessary to counter the uniformity and variability challenges. He also pointed out that die area increases are driven by the need for well contacts, and I/O guardrings. Mike Rieger, group director, R&D, Silicon Engineering Group at Synopsys, told SEMI that when there are optical systems without tuning all the spatial frequencies in the visible limit are present.


Dieseldorff C.G.,Semi
Solid State Technology | Year: 2014

The general consensus for the semiconductor industry is that 2014's positive trend will continue into 2015. Both revenue growth and unit shipment growth are expected to be in the mid- to high- single digit range. The SEMI World Fab Forecast also provides detailed data about fab construction projects underway. SEMI reports that the outlook is positive for 2014 for the chip-making industry compared to the previous few years and the outlook for 2015 also remains healthy. In addition to foundries, the World Fab Forecast report captures capacities across all industry segments as well as Systems LSI, Analog, Power, MEMS, LED, Memory and Logic/MPUSs.


Vogler D.,SEMI
Solid State Technology | Year: 2013

Semicon West 2013, to be held July 9-11 at the Moscone Center in San Francisco, will feature over 500 exhibitors, 50 hours of conference programs and more than 30,000 industry attendees. Skip Miller will present a topic on 'NXE Platform Performance and Volume Introduction' while Ben Rathsack, on 'Advances in Directed Self-Assembly Integration and Manufacturability on 300mm Wafers'. Speakers and topics on the challenges of nonplanar transistor processing include Gary Patton, IBM Semiconductor Research and Development Center, Subramani Kengeri from GlobalFoundries, and many more. The SEMICON West 450 Transition Forum will provide the latest updates on the status of 450 R&D, as well as a review of key technology considerations and a discussion of implications and opportunities for the supply chain.


Vogler D.,SEMI
Solid State Technology | Year: 2014

Experts state that continued shrinks will require a mix of different approaches to lithography, device structures, and 3D integration. One next-generation lithography (NGL) technology that Nikon has been evaluating is directed self-assembly (DSA). It is the scanners that make the guide patterns used to guide the block copolymers that self-assemble, so that the company was interested in anticipating what might be needed in terms of additional performance requirements on 193 immersion scanners to make the guide patterns. The company's S630D is able to meet the requirements and the S622D is coming along to meet these objectives. The IMAGINE Program is another such program, which is charged with developing and industrializing electron beam high-throughput maskless lithography developed by MAPPER Lithography. This technique appears attractive for coping with the increasing difficulties relative to the patterning of critical levels, such as contact layers, and the cut level in the case of complementary lithography.


Vogler D.,SEMI
Solid State Technology | Year: 2014

Semiconductor industry experts' note that once the industry adopts 5nm, something new will have to happen. One technology getting close scrutiny is carbon nanotube (CNT) logic transistors. H.S. Philip Wong, the Willard R. and Inez Kerr Bell Professor in the School of Engineering and Professor of Electrical Engineering at Stanford University, explains that transistors made with carbon nanotubes as the channel material hold special promise. The promise is due to the ultra-thin body of the carbon nanotube being only about one nanometer, while at the same time retaining excellent carrier transport properties. The key issues in bringing CNT logic transistors to the forefront include contact resistance, maintaining good carrier transport while meeting electrostatic requirements, having a coordinated effort in industry, and taking a practical approach and recognizing that exotic, non-FET-based devices will not meet the time line of the industry for the 5nm node.


News Article | February 21, 2017
Site: www.prnewswire.com

MILPITAS, Calif., Feb. 21, 2017 /PRNewswire/ -- SEMI, the global association connecting and representing the worldwide electronics manufacturing supply chain, today announced the appointment of Ajit Manocha as its president and CEO. He will succeed Denny McGuirk, who announced his...

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