Screen Holdings Co. | Date: 2017-01-24
Printing paper according to the present invention includes a base material and a coating layer disposed on the base material and being capable of receiving an oil-based ink, and the coating layer includes, in an upper portion thereof, an ink receiving layer containing a cationic polymer and being capable of receiving the water-base ink by allowing the water-based ink to penetrate into the ink receiving layer. When ejected onto the printing paper, the water-based ink penetrates into the ink receiving layer included in the upper portion of the coating layer and is received, so that bleeding of the water-based ink is suppressed. The printing paper can be manufactured at low costs without containing expensive materials such as inorganic fine particles. The surface condition of the coated paper for offset printing can thus be modified so as to be suitable for the water-based ink at low costs.
SCREEN Holdings Co. | Date: 2017-01-24
A flash heating part in a heat treatment apparatus includes 30 built-in flash lamps, and irradiates a semiconductor wafer held by a holder in a chamber with a flash of light. Thirty switching elements are provided in a one-to-one correspondence with the 30 flash lamps. Each of the switching elements defines the waveform of current flowing through a corresponding one of the flash lamps by intermittently supplying electrical charge thereto. Radiation thermometers measure an in-plane temperature distribution of the semiconductor wafer during flash irradiation. Based on the results of measurement with the radiation thermometers, a controller individually controls the operations of the 30 switching elements to individually define the light emission patterns of the 30 flash lamps.
Screen Holdings Co. | Date: 2017-01-05
In a substrate processing apparatus, with an internal space of a chamber brought into a pressurized atmosphere, an etching process is performed by continuously supplying a first processing liquid onto an upper surface of a substrate while rotating the substrate. It is thereby possible to suppress vaporization of the first processing liquid on the substrate and further suppress a decrease in the temperature of the substrate due to the heat of vaporization as it goes from a center portion of the substrate toward a peripheral portion thereof as compared with under normal pressure. As a result, it is possible to improve the uniformity in the temperature of the upper surface of the substrate during the etching process using the first processing liquid and improve the uniformity of etching over the entire upper surface of the substrate.
SCREEN Holdings Co. | Date: 2016-11-08
A substrate treating apparatus includes a plurality of solution treating units for performing solution treatment of substrates, and a plurality of individual gas supply devices provided to correspond individually to the solution treating units, each for supplying gas at a variable rate only to one of the solution treating units. The solution treating units perform the solution treatment by supplying treating solutions to the substrates. The individual gas supply devices supply gas only to the solution treating units corresponding thereto. The individual gas supply devices supply the gas at adjustable rates to the solution treating units. The rate of gas supply to the solution treating units can therefore be varied for each solution treating unit.
SCREEN Holdings Co. | Date: 2016-11-09
A substrate treating apparatus includes a treating section for treating substrates. The treating section has a front face and a rear face both connectable to an indexer section for feeding the substrates to the treating section. Such substrate treating apparatus can improve the degree of freedom for arranging the treating section and the indexer section.
SCREEN Holdings Co. | Date: 2017-01-27
A susceptor of a holding part for holding a semiconductor wafer includes a disc-shaped holding plate, an annular shaped guide ring, and a plurality of support pins. The guide ring has an inside diameter greater than the diameter of the semiconductor wafer and is installed on the peripheral portion of the top face of the holding plate. The guide ring has a tapered surface along the inner circumference. The semiconductor wafer before irradiated with flash light is supported by the support pins. The annular shape of the guide ring increases the contact area when the semiconductor wafer that has jumped off the susceptor and fallen when irradiated with flash light collides with the guide ring, thus reducing the impact of the collision and preventing cracks in the substrate.
SCREEN Holdings Co. | Date: 2017-02-21
A substrate treating apparatus includes a circulating line having a treating tank for storing a phosphoric acid aqueous solution, a circulating pump for feeding the phosphoric acid aqueous solution, a heater for circulation for heating the phosphoric acid aqueous solution, a filter for filtering the phosphoric acid aqueous solution, the circulating line causing the phosphoric acid aqueous solution discharged from the treating tank to flow in order of the circulating pump, the heater for circulation and the filter, and returning the phosphoric acid aqueous solution from the filter to the treating tank. The apparatus also includes a branch pipe branching from the circulating line between the heater for circulation and the filter for extracting the phosphoric acid aqueous solution from the circulating line, and a concentration measuring station connected to the branch pipe for measuring silicon concentration in the phosphoric acid aqueous solution by potentiometry.
SCREEN Holdings Co. | Date: 2017-02-10
An imaging system 100 for imaging a sample in a medium carried in a container WP as an imaging object comprises: an imager 21 which obtains an original image by imaging the imaging object; and a data processor 33 which generates multi-gradation image data by performing a gradation correction on the original image, wherein the data processor 33 associates a luminance value corresponding to a luminance of the medium in the original image with a maximum gradation value in the gradation correction.
SCREEN Holdings Co. | Date: 2017-02-14
The inventive substrate treatment apparatus includes: a rotative treatment control unit which controls a first chemical liquid supplying unit and a second chemical liquid supplying unit to perform a first chemical liquid supplying step of supplying a first chemical liquid to a substrate rotated by a substrate holding and rotating mechanism and a second chemical liquid supplying step of supplying a second chemical liquid to the substrate rotated by the substrate holding and rotating mechanism after the first chemical liquid supplying step; and a cleaning control unit which controls the cleaning liquid supplying unit to spout the cleaning liquid from the cleaning liquid outlet port to supply the cleaning liquid to the cup inner wall and/or the base wall surface before start of the second chemical liquid supplying step after end of the first chemical liquid supplying step, and/or during and/or after the second chemical liquid supplying step.
SCREEN Holdings Co. | Date: 2017-07-12
In an inspection apparatus, a plurality of light source parts (42, 43) for irradiating an object area on a surface of an object (9) with light from a plurality of directions, respectively, are provided, and a first picked-up image representing an object area is acquired in one image pickup part (32, 33) by light irradiation from one of the plurality of light source parts and a second picked-up image is acquired in the image pickup part by light irradiation from the plurality of light source parts. Further, a first defect candidate area is detected by comparing the first picked-up image with a first reference image corresponding to the first picked-up image and a second defect candidate area is detected by comparing the second picked-up image with a second reference image corresponding to the second picked-up image. Then, an overlapping area in the first defect candidate area and the second defect candidate area is specified as a defect area in the object area. It is thereby possible to detect a defect on the satin-finished surface of the object with high accuracy.