Albuquerque, NM, United States
Albuquerque, NM, United States

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Patent
SBA Materials | Date: 2015-06-10

A method of preparing at least one layer of a multilayer dielectric (MLD) film stack by producing a sol from a mixture that comprises an epoxide and at least one precursor to a metal oxide, depositing the sol on a substrate, and preparing a metal oxide layer from the deposited sol. The mixture can also include one or any combination of a solvent, water, a precursor to a glassforming oxide, at least one modifier, a cosolvent, or a porogen. Two or more layers of the film stack can be prepared in similar fashion using the same or different sols.


Kopycinska-Muller M.,TU Dresden | Kopycinska-Muller M.,Fraunhofer Institute for Non-Destructive Testing | Yeap K.-B.,Fraunhofer Institute for Non-Destructive Testing | Mahajan S.,SBA Materials | And 6 more authors.
Nanotechnology | Year: 2013

We have used the atomic force acoustic microscopy (AFAM) method to determine the indentation modulus of nanoporous thin-film materials with ultralow values of dielectric permittivity (dielectric constant k < 2.4). The AFAM method is based on the contact mode of atomic force microscopy (AFM) and as such is able to characterize materials with high spatial resolution. The tested material was porous organosilicate glass with nominal porosity ranging from 27% to 40%. The values obtained for the indentation modulus varied from 4 to 7 GPa depending on the pore concentration. The values obtained for the indentation modulus by use of the AFAM method were in very good agreement with those determined by nanoindentation. In addition, a part of the AFAM results obtained for the sample with the highest porosity content showed dependence of the effective indentation modulus on the applied load. Preliminary data analysis suggests that the stress rate is the critical factor in triggering this particular mechanical response of the porous material. © 2013 IOP Publishing Ltd.


Hobaika A.B.D.S.,SBA Materials | Pires K.C.D.C.,Servico de Anestesiologia da Santa Casa de Belo Horizonte | Fernandes V.B.S.A.,CET SBA Santa Casa de Belo Horizonte
Revista Brasileira de Anestesiologia | Year: 2010

Background and objectives: The rate of mortality during the surgical separation of conjoined twins in the neonatal period is 50% and can reach up to 75% if it occurs in emergency situations. The planning of the surgical separation procedure is detailed and involves imaging assessment, evaluation of cross-circulation and even other surgical preparation procedures, such as skin expansion. Case Report: Eleven-day-old female omphalopagus conjoined twins underwent emergency surgical separation due to the death of one twin caused by sepsis associated to cardiopathy. The liver was shared by the twins and was separated. The surviving twin died six days later. Conclusions: Surgical separation of conjoined twins in the neonatal period must be avoided due to the patients' organic system immaturity. However, emergency situations such as the one described herein can require the procedure to be carried out.


Krishtab M.,Catholic University of Leuven | Krishtab M.,IMEC | Vanstreels K.,IMEC | Savage T.,SBA Materials | And 4 more authors.
Microelectronic Engineering | Year: 2015

In this study cohesion strength in low-k dielectric films was enhanced by tuning the pore structure. The correlation between the average size of pores in ultra-low-k materials and cohesion energy was demonstrated by performing a 4-point bending test on multi-layer structures including TaN/Ta metal barrier. Spin-on organosilica films prepared with different templating surfactants were used to alleviate porosity- pore size coupling, which revealed the particular role of pore size with respect to material toughness. The paper also discusses aspects of material design at precursor level. © 2015 Elsevier B.V. All rights reserved.


Wills A.,SBA Materials | Movassat M.,SBA Materials | Pakbaz H.,SBA Materials | Hacker N.,SBA Materials
2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference, IITC/AMC 2016 | Year: 2016

Plasma protection of uLK films with siloxane based molecules can significantly reduce plasma induced damage. Damage layer thickness can be reduced by up to 75% for films with k values 2.0, 2.2 and 2.3 depending on the initial k value of the film and the loading of the pore protection material. © 2016 IEEE.


A sol composition for producing a porous low-k dielectric material is provided. The composition can include at least one silicate ester, a polar solvent, water, an acid catalyst for silicate ester hydrolysis, an amphiphilic block copolymer surfactant, and a nonmetallic catalyst that reduces dielectric constant in the produced material. The composition can further include a metallic ion at a lower parts-per-million concentration than the nonmetallic catalyst, and/or the composition can further include a cosolvent. A method of preparing a thin film on a substrate using the sol composition is also provided.


A sol composition for producing a porous low-k dielectric material is provided. The composition can include at least one silicate ester, a polar solvent, water, an acid catalyst for silicate ester hydrolysis, an amphiphilic block copolymer surfactant, and a nonmetallic catalyst that reduces dielectric constant in the produced material. The composition can further include a metallic ion at a lower parts-per-million concentration than the nonmetallic catalyst, and/or the composition can further include a cosolvent. A method of preparing a thin film on a substrate using the sol composition is also provided.


PubMed | TU Dresden, Fraunhofer Institute for Ceramic Technologies and Systems and SBA Materials
Type: | Journal: Ultramicroscopy | Year: 2016

The indentation modulus of thin films of porous organosilicate glass with a nominal porosity content of 30% and thicknesses of 350nm, 200nm, and 46nm is determined with help of atomic force acoustic microscopy (AFAM). This scanning probe microscopy based technique provides the highest possible depth resolution. The values of the indentation modulus obtained for the 350nm and 200nm thin films were respectively 6.3GPa0.2GPa and 7.2GPa0.2GPa and free of the substrate influence. The sample with the thickness of 46nm was tested in four independent measurement sets. Cantilevers with two different tip radii of about 150nm and less than 50nm were applied in different force ranges to obtain a result for the indentation modulus that was free of the substrate influence. A detailed data analysis yielded value of 8.3GPa0.4GPa for the thinnest film. The values of the indentation modulus obtained for the thin films of porous organosilicate glasses increased with the decreasing film thickness. The stiffening observed for the porous films could be explained by evolution of the pore topology as a function of the film thickness. To ensure that our results were free of the substrate influence, we analyzed the ratio of the sample deformation as well as the tip radius to the film thickness. The results obtained for the substrate parameter were compared for all the measurement series and showed, which ones could be declared as free of the substrate influence.


News Article | October 27, 2013
Site: www.finsmes.com

SBA Materials, an Albuquerque, NM-based developer of nano-porous dielectrics, received funding from Intel Capital. The amount of the transaction was not disclosed. Led by Hash Pakbaz, President and CEO, and Mark Phillips, CTO, SBA has developed patented Liquid Phase Self Assembly technology that enables the design of advanced siloxane-based materials with a broad range of porosities and a combination of electrical, optical and mechanical properties. This class of materials has applications in significant markets ranging from energy storage to high-performance logic chips. According to the company, its low-k dielectric has the potential to improve the performance of advanced chips used in mobile devices while significantly reducing their power consumption.

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