SanDisk Semiconductor Shanghai Co.

Shanghai, China

SanDisk Semiconductor Shanghai Co.

Shanghai, China
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Patent
Sandisk Semiconductor Shanghai Co. and Sandisk Information Technology Shanghai Co. | Date: 2017-03-01

A semiconductor device, and a method of its manufacture, are disclosed. The semiconductor device includes a semiconductor die, such as a controller die, mounted on a surface of a substrate. A bridge structure is also mounted to the substrate, with the semiconductor die fitting within a trench formed in a bottom surface of the bridge structure. The bridge structure may be formed from a semiconductor wafer into either a dummy bridge structure functioning as a mechanical spacer layer, or an IC bridge structure functioning as both a mechanical spacer layer and an integrated circuit semiconductor die. Memory die may also be mounted atop the bridge structure.


Patent
Sandisk Information Technology Shanghai Co. and Sandisk Semiconductor Shanghai Co. | Date: 2015-04-09

A system and method are disclosed for applying a die attach epoxy to substrates on a panel of substrates. The system includes a window clamp having one or more windows through which the epoxy may be applied onto the substrate panel. The size and shape of the one or more windows correspond to the size and shape of the area on the substrate to receive the die attach epoxy. Once the die attach epoxy is sprayed onto the substrate through the windows of the window clamp, the die may be affixed to the substrate and the epoxy cured in one or more curing steps. The system may further include a clean-up follower for cleaning epoxy off of the window clamp, and a window cleaning mechanism for cleaning epoxy off of the sidewalls of the windows of the window clamp.


Patent
Sandisk Semiconductor Shanghai Co. and Sandisk Information Technology Shanghai Co. | Date: 2013-01-09

A semiconductor package including a plurality of stacked semiconductor die, and methods of forming the semiconductor package, are disclosed. In order to ease wirebonding requirements on the controller die, the controller die may be mounted directly to the substrate in a flip chip arrangement requiring no wire bonds or footprint outside of the controller die. Thereafter, a spacer layer may be affixed to the substrate around the controller die to provide a level surface on which to mount one or more flash memory die. The spacer layer may be provided in a variety of different configurations.


Patent
SanDisk Semiconductor Shanghai Co. | Date: 2016-02-25

A system is disclosed for providing backward and forward traceability by a methodology which identifies discrete components (die, substrate and/or passives) that are included in a semiconductor device. The present technology further includes a system for generating a unique identifier and marking a semiconductor device with the unique identifier enabling the semiconductor device, and the discrete components within that device, to be tracked and traced through each process and test in the production of the semiconductor device.


Patent
SanDisk Semiconductor Shanghai Co. and SanDisk Information Technology Shanghai Co. | Date: 2012-11-21

A wire bonded structure (100) for a semiconductor device is disclosed. The wire bonded structure (100) comprises a bonding pad (104) and a continuous length of wire (110) mutually diffused with the bonding pad (104). The wire (110) electrically couples the bonding pad (104) with a first electrical contact and a second electrical contact different from the first electrical contact.


Patent
Sandisk Semiconductor Shanghai Co. and Sandisk Information Technology Shanghai Co. | Date: 2014-11-18

A semiconductor device, and a method of its manufacture, are disclosed. The semiconductor device includes a semiconductor die, such as a controller die, mounted on a surface of a substrate. A bridge structure is also mounted to the substrate, with the semiconductor die fitting within a trench formed in a bottom surface of the bridge structure. The bridge structure may be formed from a semiconductor wafer into either a dummy bridge structure functioning as a mechanical spacer layer, or an IC bridge structure functioning as both a mechanical spacer layer and an integrated circuit semiconductor die. Memory die may also be mounted atop the bridge structure.


Patent
SanDisk Semiconductor Shanghai Co. and SanDisk Information Technology Shanghai Co. | Date: 2012-07-04

A wire bonded structure (100) for a semiconductor device is disclosed. The wire bonded structure (100) comprises a bonding pad (102); a conductive bump (104) disposed on the bonding pad (102), the conductive bump (104) including a concave top surface (106); and a continuous length of wire (110) mutually diffused with the concave top surface (106) of the conductive bump (104). The wire (110) electrically couples the bonding pad (102) with a first electrical contact and a second electrical contact different from the first electrical contact.


Patent
Sandisk Semiconductor Shanghai Co. and Sandisk Information Technology Shanghai Co. | Date: 2014-12-05

A semiconductor device, and a method of its manufacture, are disclosed. The semiconductor device includes a semiconductor die, such as a controller die, mounted on a surface of a substrate. Pillars, for example of solder, may also formed on the substrate, around the semiconductor die. The pillars are formed to a height above the substrate that is greater than the height of the substrate-mounted semiconductor die, including any wire bonds, above the substrate. A second group of one or more semiconductor die, such as flash memory die, may be affixed to the substrate, on top of the solder pillars without contacting the substrate-mounted semiconductor die.


Patent
Sandisk Semiconductor Shanghai Co. | Date: 2014-12-05

A semiconductor device, and a method of its manufacture, are disclosed. The semiconductor device includes a semiconductor die, such as a controller die, mounted on a surface of a substrate. A spacer layer is also mounted to the substrate, with the semiconductor die fitting within an aperture or a notch formed through first and second major opposed surfaces of the spacer layer. Additional semiconductor die, such as flash memory die, may be mounted atop the spacer layer.


Patent
Sandisk Semiconductor Shanghai Co. and Sandisk Information Technology Shanghai Co. | Date: 2012-05-07

A laminating device (230) and method are disclosed for laminating semiconductor die (220) on substrates on a panel (200) of substrates. The laminating device (230) includes lamination units (234,236,238,240) that operate independently of each other so that a row or column of semiconductor die (220) may be independently laminated onto a row or column of substrates simultaneously.

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