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Kyoto, Japan

Matsutani A.,Tokyo Institute of Technology | Hashidume Y.,Tokyo Institute of Technology | Ohtsuki H.,SAMCO Inc. | Koyama F.,Tokyo Institute of Technology
Japanese Journal of Applied Physics | Year: 2012

We demonstrated the fabrication of a Si-based high-index-contrast-grating (HCG) structure by thermal nanoimprint lithography and Cl 2/Xe- inductively coupled plasma (ICP) etching. A vertical etching profile and a smooth etched surface, which satisfy the requirements for optical device application, were obtained. We believe that this proposed process is useful for the microfabrication of Si-based optical devices, such as the HCG structure, photonic crystals, narrow optical waveguides, and micro-electro-mechanical systems (MEMS). © 2012 The Japan Society of Applied Physics. Source


Matsutani A.,Tokyo Institute of Technology | Ohtsuki H.,SAMCO Inc. | Koyama F.,Tokyo Institute of Technology
Japanese Journal of Applied Physics | Year: 2011

We investigated the Si dry etching process by inductively coupled plasma (ICP) using solid I2 as an etching gas source. A vertical etching profile and a smooth etched surface, which satisfy the requirements for optical device fabrication, were obtained at a relatively higher substrate temperature. The etching rate of Si was approximately 90 nm/min at 1 Pa and at an ICP/bias RF power of 300/100 W. The I2 plasma etching technique is a very simple C-, CF-, and H-free process. In addition, we believe that this proposed process is useful for fabricating Si-based optical devices, such as photonic crystals, narrow optical waveguides, and micro-electro-mechanical systems (MEMS). © 2011 The Japan Society of Applied Physics. Source


Trademark
SAMCO Inc. | Date: 2012-10-16

Semiconductor manufacturing machines; semiconductor manufacturing systems comprised of semiconductor manufacturing machines.


Trademark
SAMCO Inc. | Date: 2012-10-16

Semiconductor manufacturing machines; semiconductor manufacturing systems comprised of semiconductor manufacturing machines.


Patent
Samco Inc. | Date: 2015-06-04

The present invention provides a light beam measuring instrument that can securely receive light reflected by a sample. The light beam measuring instrument

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