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Flanders, NJ, United States

Rudolph Technologies, Inc. is a provider of process characterization equipment and software for semiconductor, light emitting diode , data storage, flat panel display and photovoltaic manufacturing industries. The company’s product offering includes automated macro defect inspection systems, probe card test and analysis systems and thin film metrology systems. In addition, Rudolph provides a broad range of software products designed to improve yield, control processes and reduce manufacturing costs. Wikipedia.


Patent
Rudolph Technologies | Date: 2015-10-13

A method of cleaning calibration and other substrates that improves the correlation of measurements from calibration and product substrates and increases the useful life of the calibration substrates is herein disclosed. By exposing a calibration substrate to ultraviolet light, a reaction is triggered that results in the cleaning of the contaminants from the calibration substrate. For instance, monatomic oxygen is introduced to contaminants on the surface of a calibration substrate to remove the contaminants without inducing modifications in the substrate itself. Through the cleaning process, the temperature of the calibration substrate may be controlled to limit adverse effects caused by the overheating of the calibration substrate.


Patent
Rudolph Technologies | Date: 2014-03-17

A member that facilitates the handling of semiconductor devices of arbitrary shapes and sizes by handling equipment not normally adapted to handling such devices is herein described. The member includes a base that emulates a substrate for which handling equipment is available. A fixation device on the base secures a device to the member. A vacuum structure allows a vacuum clamping system to simultaneously secure the member and a device to the handling equipment.


Patent
Rudolph Technologies | Date: 2014-03-14

A system for assessing a structure and the tools and processes used to form the structure is described. 2D images of the structure are captured and processed to obtain 3D information concerning the structure. Both 2D and 3D information is then used to identify and analyze selected characteristics of the structure. This analysis allows for a quality assessment of the structure. The selected characteristics are correlated with information relating to the operation of the tool that carried out the process that at least in part created the structure. The correlation of tool/process information to structure characteristics allows for the generation of feedback that may be used to modify the tool or processed used to form the structure.


Patent
Rudolph Technologies | Date: 2014-05-20

The inspection of semiconductors or like substrates by the present mechanism minimizes deflection in the checkplate and probe card. An inspection device including a housing, a toggle assembly within the housing, an objective lens assembly attached within the toggle assembly including an objective coupled within an objective focus, wherein the objective focus is deflectable along an optics axis, and a cam assembly including a rotary cam and a window carrier, wherein the window carrier is moveable along the optics axis with rotation of the rotary cam, wherein the cam assembly is coupled to the toggle assembly with the objective and window are aligned along the optics axis.


Patent
Rudolph Technologies | Date: 2014-03-14

A system for assessing a structure and the tools and processes used to form the structure is described. 2D images of the structure are captured and processed to obtain 3D information concerning the structure. Both 2D and 3D information is then used to identify and analyze selected characteristics of the structure. This analysis allows for a quality assessment of the structure. The selected characteristics are correlated with information relating to the operation of the tool that carried out the process that at least in part created the structure. The correlation of tool/process information to structure characteristics allows for the generation of feedback that may be used to modify the tool or processed used to form the structure.

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