Rudolph Technologies, Inc. is a provider of process characterization equipment and software for semiconductor, light emitting diode , data storage, flat panel display and photovoltaic manufacturing industries. The company’s product offering includes automated macro defect inspection systems, probe card test and analysis systems and thin film metrology systems. In addition, Rudolph provides a broad range of software products designed to improve yield, control processes and reduce manufacturing costs. Wikipedia.
Rudolph Technologies | Date: 2015-04-21
A system for scanning a substrate and specifically a volume of that substrate to identify anomalous structures or defects is herein described. Radiation is focused at locations within the volume of the substrate and measurements of scattered light are made. Scanning of the volume of a substrate may be fairly uniform or over selected regions, favoring those regions of the substrate that are to be involved with subsequent substrate processing steps.
Rudolph Technologies | Date: 2014-03-17
A member that facilitates the handling of semiconductor devices of arbitrary shapes and sizes by handling equipment not normally adapted to handling such devices is herein described. The member includes a base that emulates a substrate for which handling equipment is available. A fixation device on the base secures a device to the member. A vacuum structure allows a vacuum clamping system to simultaneously secure the member and a device to the handling equipment.
Rudolph Technologies | Date: 2014-03-14
A system for assessing a structure and the tools and processes used to form the structure is described. 2D images of the structure are captured and processed to obtain 3D information concerning the structure. Both 2D and 3D information is then used to identify and analyze selected characteristics of the structure. This analysis allows for a quality assessment of the structure. The selected characteristics are correlated with information relating to the operation of the tool that carried out the process that at least in part created the structure. The correlation of tool/process information to structure characteristics allows for the generation of feedback that may be used to modify the tool or processed used to form the structure.
Rudolph Technologies | Date: 2014-01-23
A method for characterizing a microfabrication process and the product thereof is described. A substrate having TSVs formed therein is assessed by determining the geometries and positions of the top and bottom ends of a TSV. Individual TSVs as well as the entire pattern of TSVs formed in a substrate may be assessed.
Rudolph Technologies | Date: 2015-11-18
A method and apparatus for detecting and handling deformed substrates, thus allowing them to be processed, and for increasing device yield on the substrate is herein disclosed. A sensor detects deformity, then the substrate is flattened, allowing a support to hold it securely.
Rudolph Technologies | Date: 2016-04-29
A system (10) for directly measuring the depth of a high aspect ratio etched feature on a wafer (80) that includes an etched surface (82) and a non-etched surface (84). The system (10) utilizes an infrared reflectometer (12) that in a preferred embodiment includes a swept laser (14), a fiber circulator (16), a photodetector (22) and a combination collimator (18) and an objective lens (20). From the objective lens (20) a focused incident light (23) is produced that is applied to the non-etched surface (84) of the wafer (80). From the wafer (80) is produced a reflected light (25) that is processed through the reflectometer (12) and applied to an ADC (24) where a corresponding digital data signal (29) is produced. The digital data signal (29) is applied to a computer (30) that, in combination with software (32), measures the depth of the etched feature that is then viewed on a display (34).
Rudolph Technologies | Date: 2014-10-06
The invention relates to a holding and rotating apparatus for flat objects which define an object plane, having a gripper device that is rotatable about a rotation axis, said gripper device having a plurality of edge grippers and being designed to fix the object in a defined position in all spatial directions, the object plane being oriented perpendicularly to the rotation axis in said position, and having a rotary drive coupled to the gripper device, said rotary drive being designed to set the gripper device with the object in rotation about the rotation axis. The invention is characterized by a device for distance positioning, said device being designed to apply a supporting force, directed perpendicularly to the object plane, to the object in a contactless manner.
Rudolph Technologies | Date: 2016-04-07
An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc., and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.
Rudolph Technologies | Date: 2016-07-13
A method and apparatus for optimizing inspection high-speed optical inspection of parts using intelligent image analysis to determine optimal focus using high numerical aperture (NA) optics, achieve a superior signal-to-noise ratio, resolution, and inspection speed performance with very limited depth of field lenses.
Rudolph Technologies | Date: 2015-10-13
A method of cleaning calibration and other substrates that improves the correlation of measurements from calibration and product substrates and increases the useful life of the calibration substrates is herein disclosed. By exposing a calibration substrate to ultraviolet light, a reaction is triggered that results in the cleaning of the contaminants from the calibration substrate. For instance, monatomic oxygen is introduced to contaminants on the surface of a calibration substrate to remove the contaminants without inducing modifications in the substrate itself. Through the cleaning process, the temperature of the calibration substrate may be controlled to limit adverse effects caused by the overheating of the calibration substrate.