Shinagawa-ku, Japan
Shinagawa-ku, Japan

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Tominaga S.,Roki Techno Co. | Abe D.,Roki Techno Co. | Enomoto T.,Roki Techno Co. | Kondo S.,Roki Techno Co. | And 5 more authors.
Japanese Journal of Applied Physics | Year: 2010

A hybrid electrochemical mechanical planarization and chemical mechanical planarization (e-CMP/CMP) was applied to the Cu dual-damascene through-silicon via (TSV) process for wafer-level three-dimensional integrated circuit (3D-IC) stacking. In this process, an electrochemically deposited Cu film was removed by e-CMP at a removal rate of 3.5μm/min until the voltage endpoint was detected. Then, residual Cu film was polished off in the CMP mode using the same e-CMP pad. A fine Cu damascene structure was successfully fabricated with a dishing depth of less than 200nm in a metal pad of 200 × 200 μm 2 area. The criterion of dishing without failure in the adhesive coat for 3D-IC stacking is discussed. © 2010 The Japan Society of Applied Physics.


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Roki Techno Co. | Date: 2013-01-16

Filtering machines for chemical processing; A full line of filters for filtering machines; A full line of filter cartridges for filtering machines; ultrafiltration filters for chemical processing machines and apparatus; filters for chemical processing machines and apparatus; filter cartridges for chemical processing machines and apparatus; chemical processing machines and apparatus, namely, chemical fiber drying machines, chemical fiber spinning machines; corrosive-resistant filter cartridges for beer brewing machines used in the process of beer making; filters for brewed liquid used in brewing or fermenting machines and apparatus; food or beverage processing machines and apparatus, namely, food chopping machines for commercial use, food slicing machines for commercial use; industrial milk strainers; filter cartridges for industrial milk strainers; plastic processing machines and apparatus, namely, injection plastic molding machines; filter cartridges for plastic processing machines; filters for semiconductor manufacturing machines and systems; filters for liquid for semiconductor manufacturing machines used in the manufacture of semiconductors; machines and apparatus for manufacturing rubber goods; filter cartridges for machines and apparatus for manufacturing rubber goods. Ozonisers in the nature of ozonators; electrolysers; filtration apparatus for laboratory or experimental use; filters or filter cartridge parts of filtration apparatus for laboratory or experimental use; filters for laboratory apparatus and instruments; ozone concentration meters; water quality analyzer; electronic machines, apparatus and their parts, namely, discharge tubes, electric, other than for lighting. Clean-up filters for industrial water; clean-up filters for water of water-purifying apparatus; absorbent filters for water-purifying apparatus; membrane filters for water-purifying apparatus; filters for water-purifying apparatus; water purifying apparatus; filters for water purifiers for household purposes; filter cartridges for water purifiers for household purposes; water purifiers for household purposes; electrolytic ion water purifiers and filters thereof; filters for septic tanks for waste water for household purposes; septic tanks for waste water for household purposes; filters for septic tanks for household purposes; septic tanks for household purposes.

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