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Rogers, CT, United States

Rogers Corporation is an American specialty materials company with headquarters located in Rogers, Connecticut. In 1832, Peter Rogers founded the company, which started out as a materials manufacturer for the textile industry. Rogers is known as one of the oldest public companies in America, and has a great standing of innovation and collaborative problem solving with its customers. Originally a paperboard manufacturing company, Rogers has formed into a major global materials technology leader, creating a variety of high-technology devices and systems. Rogers, as of 2013, has 2,400 full-time employees both in the U.S. and around the world in Japan, Taiwan, Singapore, Korea, China, Germany and Belgium. Since its inception, Rogers has been known for sticking to a set of Values that guide the company’s actions. These values help guide the company with “decisions and behaviors within the company and defines their relationships with employees, customers, and the communities in which they operate around the world.“ Rogers Corporation has seven divisions, including the Advanced Circuit Materials division, which offers high-frequency printed circuit board laminates and flexible circuit laminates; the High Performance Foams division; and the Durel division, which offers electroluminescent lighting and drivers. Rogers uses C.A.G. as a foundation for the company’s culture of innovation. These three ideas is how Rogers works together to develop new, innovative material technologies that power, protect, and connect our world. Rogers continues to focus its research, development, and engineering investments on megatrends, a large, long-lasting, global shift in thinking or an approach that affects countries, industries and organizations, which drives global demand for a cleaner, safer, and more connected world. The company was listed on the New York Stock Exchange in April, 2000. In 2013, Rogers is the technology leader in their chosen markets of research. Their goal is to “imagine what could be possible, then apply it to their creativity, research and development expertise to create new products and services for their customers.” Wikipedia.


Circuit subassemblies comprising a conductive layer disposed on a dielectric substrate layer, wherein the dielectric substrate layer comprises a crosslinked fluoropolymer.


A magneto-dielectric substrate includes a first dielectric layer, a second dielectric layer spaced apart from the first dielectric layer, and at least one magnetic reinforcing layer disposed between and in intimate contact with the first dielectric layer and the second dielectric layer.


A thermal management circuit material comprises a thermally conductive metallic core substrate having at least one through-hole via, non-metallic dielectric layers deposited on both sides of the metallic core substrate and on the containing walls of the through-hole via, electrically conductive metal layers on the non-metallic dielectric layers and an electrically conductive metal-containing core element filling the insulated through-hole via connecting at least a portion of each of the electrically conductive metal layers. Also disclosed are methods of making such circuit materials, comprising forming non-metallic dielectric layers by vapor deposition of a non-metallic material, for example by reacting an oxygen-containing precursor with an aluminum containing precursor and/or reacting a nitrogen-containing precursor with an aluminum or boron containing precursor on the surface of the metallic core substrate. Articles having a heat-generating electronic device such as an HBLED mounted in the circuit material are also disclosed.


A foam tape having a multi-layer structure comprising a polyurethane foam core layer, at least one tie layer, adjacent one side of the polyurethane foam core layer, a first PSA film on one side of the first tie layer and a second PSA film, either on one side of a second tie layer or on one side of a polyester layer directly adjacent the opposite side of the polyurethane foam core layer, and a double-sided release layer on one side of the first PSA film. The foamed tape can be made by a process comprising applying a polymeric film to a first release layer to form a supported tie layer, referred to as Intermediate Product A, coating and drying a PSA composition on a second release layer to form a supported PSA coating, referred to as Intermediate Product B, laminating Intermediate Product B to Intermediate Product A which, after removing the release layer on the tie layer, forms Intermediate Product C comprising, in sequence, release layer, PSA film, and tie layer. A polyurethane foam precursor composition can be coated between a first and second Intermediate Product C, and the composition cured to form a polyurethane foam core layer.


Patent
Rogers Corporation | Date: 2015-03-04

A dielectric substrate comprises a resin composition impregnated with non-woven fibrous mat material having a thickness of 5 mils (127 micrometers), wherein the fibrous mat material comprises fibers, having a diameter of 1 nm to 10 m, that have been extruded through one or more openings to produce fibers that have been collected in the form of a fibrous non-woven mat, and wherein the fibers exhibit a multi-directional orientation in the non-woven mat material. The dielectric substrate is useful in circuit materials, circuits, and multi-layer circuits, economical to make, and has excellent electrical and mechanical properties.

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