Rogers, CT, United States
Rogers, CT, United States

Rogers Corporation is an American specialty materials company with headquarters located in Rogers, Connecticut. In 1832, Peter Rogers founded the company, which started out as a materials manufacturer for the textile industry. Rogers is known as one of the oldest public companies in America, and has a great standing of innovation and collaborative problem solving with its customers. Originally a paperboard manufacturing company, Rogers has formed into a major global materials technology leader, creating a variety of high-technology devices and systems. Rogers, as of 2013, has 2,400 full-time employees both in the U.S. and around the world in Japan, Taiwan, Singapore, Korea, China, Germany and Belgium. Since its inception, Rogers has been known for sticking to a set of Values that guide the company’s actions. These values help guide the company with “decisions and behaviors within the company and defines their relationships with employees, customers, and the communities in which they operate around the world.“ Rogers Corporation has seven divisions, including the Advanced Circuit Materials division, which offers high-frequency printed circuit board laminates and flexible circuit laminates; the High Performance Foams division; and the Durel division, which offers electroluminescent lighting and drivers. Rogers uses C.A.G. as a foundation for the company’s culture of innovation. These three ideas is how Rogers works together to develop new, innovative material technologies that power, protect, and connect our world. Rogers continues to focus its research, development, and engineering investments on megatrends, a large, long-lasting, global shift in thinking or an approach that affects countries, industries and organizations, which drives global demand for a cleaner, safer, and more connected world. The company was listed on the New York Stock Exchange in April, 2000. In 2013, Rogers is the technology leader in their chosen markets of research. Their goal is to “imagine what could be possible, then apply it to their creativity, research and development expertise to create new products and services for their customers.” Wikipedia.


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A subassembly for a display device includes a display component having an outer display surface and an opposite inner surface; a compressible pressure pad including a plurality of nonwoven fibers having an average diameter of 100 micrometers or less, disposed on the inner surface of the display component; and an internal component disposed on a side of the compressible pressure pad on a side opposite the display component. Methods for reducing ripple effect and improving impact absorption in a display device are also described.


A thermally conductive composite includes a polymer; and boron nitride, wherein the boron nitride is in a form of a nanofiber, a nanotube, a nanoplate, or a combination thereof. Alternatively, a thermally conductive composite includes a boron nitride comprising pores; and a polymer disposed in a pore of the boron nitride.


Patent
Nanotherm and Rogers Corporation | Date: 2016-05-13

A metal substrate with insulated vias (MSIV) has a metallic layer with through-holes defined through a thickness of the layer, a dielectric layer formed on part of the surface of the metallic layer and extending to cover internal walls of the through-hole, a conductive material extending through the insulated through-hole to form an insulated via, and an electrical circuit formed on a portion of the dielectric layer in thermal and/or electrical contact with the conductive via. The dielectric layer is a dielectric nanoceramic layer having an equiaxed crystalline structure with an average grain size of 500 nanometres or less, a thickness of between 0.1 and 100 micrometres, a dielectric strength of greater than 20 KV mm^(1), and a thermal conductivity of greater than 3 W/mK. Such a MSIV can be used as an electronic substrate to support devices such as power, microwave, optoelectronic, solid-state lighting and thermoelectric devices.


Patent
Rogers Corporation | Date: 2015-03-04

A dielectric substrate comprises a resin composition impregnated with non-woven fibrous mat material having a thickness of 5 mils (127 micrometers), wherein the fibrous mat material comprises fibers, having a diameter of 1 nm to 10 m, that have been extruded through one or more openings to produce fibers that have been collected in the form of a fibrous non-woven mat, and wherein the fibers exhibit a multi-directional orientation in the non-woven mat material. The dielectric substrate is useful in circuit materials, circuits, and multi-layer circuits, economical to make, and has excellent electrical and mechanical properties.


A foam tape having a multi-layer structure comprising a polyurethane foam core layer, at least one tie layer, adjacent one side of the polyurethane foam core layer, a first PSA film on one side of the first tie layer and a second PSA film, either on one side of a second tie layer or on one side of a polyester layer directly adjacent the opposite side of the polyurethane foam core layer, and a double-sided release layer on one side of the first PSA film. The foamed tape can be made by a process comprising applying a polymeric film to a first release layer to form a supported tie layer, referred to as Intermediate Product A, coating and drying a PSA composition on a second release layer to form a supported PSA coating, referred to as Intermediate Product B, laminating Intermediate Product B to Intermediate Product A which, after removing the release layer on the tie layer, forms Intermediate Product C comprising, in sequence, release layer, PSA film, and tie layer. A polyurethane foam precursor composition can be coated between a first and second Intermediate Product C, and the composition cured to form a polyurethane foam core layer.


Patent
Rogers Corporation | Date: 2016-06-09

Disclosed is a circuit material, including dielectric substrate or a circuit subassembly further comprising a conductive layer, that is formed from a precursor composition, wherein the precursor composition comprises, based on the total weight of the precursor composition, thermosetting resin or thermoplastic polymer, optionally monomeric triallyl isocyanurate or triallyl cyanurate, dispersed particles of poly(triallyl isocyanurate) or poly(triallyl cyanurate), and optionally inorganic filler, wherein the circuit material has a D_(f )of less than 0.0060 at 10 GHz. Also disclosed is a method of manufacturing such a circuit material in which emulsion polymerized particles of poly(triallyl isocyanurate) or poly(triallyl cyanurate) are dispersed in a thermosetting or thermoplastic resin.


Circuit subassemblies comprising a conductive layer disposed on a dielectric substrate layer, wherein the dielectric substrate layer comprises a crosslinked fluoropolymer.


Patent
Rogers Corporation | Date: 2016-02-05

Compositions for the formation of heat resistant foams are disclosed. The invention also relates to a process for the production of polymeric foams containing amide groups with foaming substantially accomplished by elimination of carbon dioxide by reaction of polyfunctional isocyanates, carboxylic acids, and polyols in the presence of a catalyst system composition comprises a catalyst compound having a cation of a metal, in a salt or ligand, which metal is selected from the group consisting of magnesium, cobalt, manganese, yttrium, Lanthanide Series metals, and combinations thereof, resulting in formation of amide groups in the polymer.


In an embodiment, a magneto-dielectric substrate comprises a dielectric polymer matrix; and a plurality of hexaferrite particles dispersed in the dielectric polymer matrix in amount and of a type effective to provide the magneto-dielectric substrate with a magnetic constant of less than or equal to 3.5 from 500 MHz to 1 GHz, or 3 to 8 from 500 MHz to 1 GHz, and a magnetic loss of less than or equal to 0.1 from 0 to 1 GHz, or 0.001 to 0.07 over 0 to 1 GHz.


A thermal management circuit material comprises a thermally conductive metallic core substrate having at least one through-hole via, non-metallic dielectric layers deposited on both sides of the metallic core substrate and on the containing walls of the through-hole via, electrically conductive metal layers on the non-metallic dielectric layers and an electrically conductive metal-containing core element filling the insulated through-hole via connecting at least a portion of each of the electrically conductive metal layers. Also disclosed are methods of making such circuit materials, comprising forming non-metallic dielectric layers by vapor deposition of a non-metallic material, for example by reacting an oxygen-containing precursor with an aluminum containing precursor and/or reacting a nitrogen-containing precursor with an aluminum or boron containing precursor on the surface of the metallic core substrate. Articles having a heat-generating electronic device such as an HBLED mounted in the circuit material are also disclosed.

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