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Kyoto, Japan

Osamura K.,RIAS | Machiya S.,Daido University | Hampshire D.P.,Durham University | Tsuchiya Y.,Japan National Institute of Advanced Industrial Science and Technology | And 6 more authors.
Superconductor Science and Technology | Year: 2014

In order to explain the effect of uniaxial strain on the critical current of DI-BSCCO-Bi2223 tapes, we employed a springboard sample holder that can smoothly and continuously apply both tensile and compressive strains to tape samples. Over a narrow tensile strain region, the critical current in the tapes decreased linearly with increasing strain and returned reversibly with decreasing strain. When compressive strain was applied, the critical current first increased and then reached a weak maximum. Thereafter, it decreased monotonically with further increases in compressive strain. At room temperature, the local strain exerted on BSCCO filaments was measured by means of a quantum beam diffraction technique. Over the whole tensile strain region up to 0.2% and the small compressive strain range, the local strain changed linearly with applied strain. When the compressive strain was applied beyond the relaxation strain, the local strain (measured by diffraction) versus the applied strain (measured using a strain gauge) deviated from linearity, which is characteristic of strain relaxation and the onset of BSCCO filament fracture. Thus, the strain at the maximum critical current corresponds to a crossover point in strain, above which the critical current decreased linearly and reversibly with increasing applied strain, and below which the critical current decreased due to the BSCCO filament fracture. In this paper, we clearly characterize the reversible range terminated by both compressive and tensile strains, in which filaments do not fracture. Our analysis of the compressive regime beyond the relaxation strain suggests that although BSCCO filament fracture is the primary factor that leads to a decrease in critical current, the critical current in those regions of filaments that are not fractured increases linearly and reversibly with decreasing applied strain at compressive strains well beyond the reversible region for the tape. © 2014 IOP Publishing Ltd. Source


Osamura K.,RIAS | Machiya S.,Daido University | Tsuchiya Y.,Japan National Institute of Materials Science | Suzuki H.,Japan Atomic Energy Agency | And 7 more authors.
Superconductor Science and Technology | Year: 2013

Practical superconductive (SC) wires such as the Nb3Sn and Nb3Al strands used in fusion reactors are typical composite materials consisting of brittle superconducting intermetallic compounds. Thermally induced strain is inevitably generated in the composite due to the different coefficients of thermal expansion and different moduli of elasticity among the constituent components. In order to evaluate quantitatively the thermal strain, local strain measurements during heating by means of quantum beams, and room temperature tensile tests were carried out. The stress versus strain curves of both Nb3Sn and Nb3Al strands showed a typical elasto-plastic behavior, which could be numerically evaluated on the basis of the rule of mixtures. The local strain exerted on SC filaments along the axial direction was compressive at room temperature and tensile at high temperatures, which is common for Nb3Sn and Nb3Al strands. Their temperature dependence was numerically evaluated by means of the iteration method. As a whole, it has been established that the temperature dependence of thermal strain can be reproduced well by the numerical calculation proposed here. It is pointed out that the thermal strain in SC filaments is affected by the creep phenomenon at high temperatures above a threshold temperature. © 2013 IOP Publishing Ltd. Source


Osamura K.,RIAS | Machiya S.,Daido University | Ochiai S.,Kyoto University | Osabe G.,Sumitomo Electric Industries | And 2 more authors.
Superconductor Science and Technology | Year: 2013

A remarkable improvement in the strain dependence of critical current and the mechanical properties of DI-BSCCO-Bi2223 tapes was achieved by means of the pretensioned lamination technique. In order to elucidate the origin of this high performance, the local strain exerted on BSCCO filaments was investigated by means of the synchrotron radiation technique. The relaxation strain A r was expressed by the sum of thermal strain and tensile strain in the fracture of BSCCO filaments. It was concluded that the central parameter when considering the improvement of strain induced properties is the force free strain exerted on BSCCO filaments together with their own strength. © 2013 IOP Publishing Ltd. Source


Osamura K.,RIAS | MacHiya S.,Daido University | Tsuchiya Y.,Japan National Institute of Materials Science | Suzuki H.,Japan Atomic Energy Agency | And 5 more authors.
Superconductor Science and Technology | Year: 2012

It is important to evaluate the local strain exerted on superconducting filaments in Nb 3Sn strands, because it influences both superconducting and mechanical properties, in particular for the ITER (International Thermonuclear Experimental Reactor) project. The local strain in the twisted and untwisted Nb 3Sn strands was directly measured at room temperature as well as at low temperatures by means of quantum beam techniques. The local strain consists of thermal strain and lattice strain. The latter changes as a function of external strain. The interrelation between the force-free strain and the intrinsic strain showing a maximum critical current was considered on the basis of the present experimental data as well as the recent theory. The thermal strains along both directions parallel and transverse to the strand axis were numerically evaluated. Their evaluated results could explain well the observed values, when T o is the recovery temperature of pure Cu. The force-free strain along the axial direction is deduced to be distributed among grains with different crystal orientation with respect to the axial direction. It is suggested that this fact affects the definition of intrinsic strain. © 2012 IOP Publishing Ltd. Source

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