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Kawasaki, Japan

Renesas Electronics Corporation TYO: 6723 is a Japanese semiconductor manufacturer headquartered in Tokyo. It has manufacturing, design and sales operations in around 20 countries. Renesas is one of the world's largest manufacturers of semiconductor systems for mobile phones and automotive applications. It is the world's largest manufacturer of microcontrollers and the second largest manufacturer of application processors. Renesas is also known for LCD drivers, RF ICs, mixed-signal integrated circuits and system-on-a-chip semiconductors. Wikipedia.


Patent
Renesas Electronics Corporation | Date: 2016-01-07

A semiconductor device having a high degree of freedom of layout has a first part AR


Patent
Renesas Electronics Corporation | Date: 2016-01-08

An acceleration sensor includes an outer frame body, a heating element, a first temperature sensing element for temperature measurement and a second temperature sensing element for temperature measurement, and an operational amplifier. In the outer frame body, a fluid chamber capable of sealing a fluid inside thereof is formed. The heating element is formed on a circuit mounting surface which is a specific inner wall surface of a plurality of inner wall surfaces defining the fluid chamber. The first temperature sensing element and the second temperature sensing element are formed on the circuit mounting surface. The distance from the first temperature sensing element to the heating element is shorter than the distance from the second temperature sensing element to the heating element. The operational amplifier calculates a difference between a measurement result by the first temperature sensing element and a measurement result by the second temperature sensing element.


Patent
Renesas Electronics Corporation | Date: 2016-01-04

In a semiconductor device, a vocoder processing unit requests, after executing a first vocoder process being one of an encoding process and a decoding process and before executing a following second vocoder process being other one of the encoding process and the decoding process, a cache memory to prefetch first program data to be used for the second vocoder process from an external memory.


Patent
Renesas Electronics Corporation | Date: 2016-01-06

A processor, includes a first comparison operation unit; a second comparison operation unit; a first operation unit; a second operation unit; a third operation unit; and a register, wherein the first comparison operation unit receives a first comparison operation signal, a first input signal, and a second input signal, performs a comparison operation indicated by the first comparison operation signal on the first input signal and the second input signal, and outputs a result of the comparison operation, the second comparison operation unit receives a second comparison operation signal, a third input signal, and a fourth input signal, performs a comparison operation indicated by the second comparison operation signal on the third input signal and the fourth input signal, and outputs a result of the comparison operation, the first operation unit receives the comparison result of the first comparison operation unit.


Patent
Renesas Electronics Corporation | Date: 2016-01-06

A semiconductor device includes a first semiconductor chip that includes a first main surface, a first inductor formed on the first main surface, and a first external connection terminal formed on the first main surface; a second semiconductor chip that includes a second main surface, a second inductor formed on the second main surface, a second external connection terminal formed on the second main surface; and a first insulating film that is located between the first semiconductor chip and the second semiconductor chip, wherein the first semiconductor chip and the second semiconductor chip overlap each other such that the first main surface and the second main face each other, the semiconductor device includes a facing region in which the first semiconductor chip and the second semiconductor chip overlap each other when seen in a plan view.

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