Kim J.H.,Korea Atomic Energy Research Institute |
Park H.D.,Radiation Technology EXcellence RTX |
Kim H.-J.,Kyungpook National University |
Tae H.-S.,Kyungpook National University
Molecular Crystals and Liquid Crystals | Year: 2015
For the fast and stable address under the high Xe gas condition of plasma display panels (PDPs), the weak and strong discharge characteristics in both surface-gap and plate-gap discharges were examined for two different Xe gas contents (7 and 20%). It is observed that it is very difficult to produce the strong plate-gap discharge required for the address discharge as the Xe gas content increases from 7 to 20%, thus requiring an additional voltage increase for the strong plate-gap discharge. Based on these experimental observations, the modified driving waveform, featuring being able to produce an intensified address discharge in the plate-gap discharge without a misfiring discharge in the surface-gap discharge, is proposed for the successful high speed address of the high Xe PDP. © 2015 Copyright © Taylor & Francis Group, LLC.
Kang H.S.,Radiation Technology eXcellence RTX |
Koo Y.H.,Radiation Technology eXcellence RTX |
Park H.D.,Korea Atomic Energy Research Institute |
Chai G.-S.,Radiation Technology eXcellence RTX |
And 3 more authors.
Journal of Nanoscience and Nanotechnology | Year: 2015
As the development of manufacturing technology for electronic devices, propresses it is necessary to study manufacturing technologies for mass storage, low-volume, improved reliability, and low cost materials for electronic devices used in data communication. The noble metals are the most commonly used raw materials used in such manufacturing. However, the raw materials (Ag, Pt, etc.) are expensive and raise the manufacturing cost. So, there is a need to replace these materials with raw materials of low cost. Recently, the much-cheaper Cu has received attention in that it has the same properties as the noble metals. Cu has good physical and chemical properties. However, its anti-oxidation is weak. Therefore, to make up for this weak point, research has generally been conducted to find a method to coat copper with a noble metal. The coating, comprised of the noble metal, is strong against the oxidation of the Cu surface. In this study, we made Cu@Ag core.shell nanoparticles; these particles have the same level of electro-conductivity as Ag. These materials are expected to reduce the product cost of raw materials. Copyright © 2015 American Scientific Publishers All rights reserved Printed in the United States of America.