Voiron, France
Voiron, France

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A switching device for opening and closing an electrical line, including:


Grant
Agency: European Commission | Branch: FP7 | Program: CP-FP | Phase: FoF.NMP.2012-5 | Award Amount: 5.35M | Year: 2012

Due to the high potential of miniaturization and integration, with regard to the innovation degree, quality and sustainability requirements, the 21st century looks forward to the integration of new functions on plastic parts to produce smart plastic products, as markets are requiring traceability, security, communication as well as ergonomics. So called Molded Interconnected Devices (MID) basically combine all the features of molded plastic parts with electrical conductive circuitry and electronics components assembly directly on the plastic packaging. MID lead finally to highly integrated multimaterial and multifunctional 3D compact systems. With a 20% of growth per year since 2008, MID is the tomorrows converging technology for electronics and plastics. To achieve advanced high precision and high quality 3D micro systems, the EU industry is facing the following MIDs bottlenecks: - to be able to manufacture high precision 3D micro-parts integration plastics and electronics, including 3D plastic system carrier, 3D-conductive tracks and 3D electronics component assembly - to be able to reduce the manufacturing cost by 50% in order for EU industry to be competitive with low-wage countries, - to provide the industry with reliable, robust and in-line controlled manufacturing processes for plastics and electronics converging technologies. 3D-HiPMAS will overcome these challenges by providing the EU industry with a pilot factory based on 4 key technological building blocks enabling the manufacturing of low costs and high precision 3D multi-materials parts: A. 3D high precision plastics micro-parts B. 3D high definition conductive tracks C. 3D precision electronics components assembly D. 3D reliable and robust online monitoring and quality inspection system E. These 4 technologies will be integrated in order to launch the future EU pilot factory The consortium is composed of all key actors from the value chain, from the material manufacturer to the end-user


An optoelectronic module, intended to provide a conversion of an electrical signal from an electronic board into an optical signal propagated in free space or vice versa, includes the following stack: an electronic board, intended to act as an interface with an electronic application board; an electronic control component suitable for controlling an optoelectronic component, the electronic component being attached directly onto the electronic board and electrically connected to the electronic circuit; an optoelectronic component suitable for transmitting or receiving a light signal via its upper surface, the optoelectronic component being attached directly on the top of the electronic control component and electrically connected to the electronic component; an optical device suitable for transmitting an optical signal; an optical device support, the support being attached, preferably by gluing or brazing, directly onto the electronic board so as to ensure the mechanical alignment between the optical device and the optoelectronic component.


The present invention relates to an adapter for a connector, notably for a multicontact connector, of the type including at least one insert, a housing containing the insert and at least one alveolus suitable for housing an alignment sleeve, notably slotted. According to the invention, each alveolus is also suitable for housing a securing cage for an alignment sleeve, by a mounting that is floating radially to its axis, over the entire length of the alignment sleeve.


The present invention relates to an adapter (3) for a connector (1), notably for a multicontact connector, of the type comprising at least one insert (2) and one housing (6) comprising, within it, the insert (2). According to the invention, the adapter (3) comprises at least one means for removably fastening, inside the housing (6), a connector in its configuration bearing by its front face (30) against the front face (20) of the insert (2).


The inventive assembly comprises a hyperfrequency component of the surface-mounted component type including at least one first hyperfrequency transmission line, as well as a printed circuit board including at least one second hyperfrequency transmission line able to be put in contact with the first hyperfrequency transmission line. The component comprises an enclosure with a face in contact with the printed circuit board, which includes at least one cavity for confining a hyperfrequency signal, delimited by conductive surfaces of the enclosure, and by a conductive zone of the second hyperfrequency transmission line.


An optical connection assembly includes a first optical contact including at least one body which is designed to envelop a first ferrule at least partly, laterally, and constitutes the receptacle for the first ferrule, at least a first guide arm extending beyond the front face of the first ferrule, and at least a second guide arm beyond which the body of the ferrule extends; a second optical contact including at least one body which is designed to envelop a second ferrule at least partly, laterally, and constitutes the receptacle for the second ferrule, and at least one guide means extending beyond the front face of the ferrule and being designed to cooperate with the first guide arm of the first optical contact, in order to carry out the guiding, then the connection, between the first and second optical contacts.


The hyperfrequency connection element according to the invention, designed to be electrically connected with a complementary connector, comprises: a body having an inner passage surrounding a central axis, a monolithic conductive contact rod extending along the central axis, an insulating ring surrounding the central axis, The body includes at least one hole that connects an outer surface of the connector to the inner passage. The ring is solid and deformable and includes an outer peripheral slot communicating with the hole. A resin securing the ring with the body is housed in the hole and in the slot of the ring, and the ring is removable before the resin is housed in the hole and in the slot of the ring.


The present invention relates to a novel microwave coaxial connector that allows for a board-to-board connection over a very short distance, typically less than or equal to 2 mm, with relatively high tolerances in relative value terms but low tolerances in absolute value terms, typically equal to 0.2 mm, and at the same time ensuring a good electrical contact between all the tracks of the printed circuits to be connected.


A connection assembly with bayonet locking of the connection elements. In accordance with this disclosure, there is provided a part for immobilizing the locking element of the bayonet system against movement in translation in the position of mutual locking, the immobilizing part being removably placed on the body carrying the bayonet lug.

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