Radiall | Date: 2013-04-08
A connector socket has two hooking parts each having at least one hook to fasten to a housing, at least one hooking part is mounted on the housing; the two hooking parts move apart from each other when at least the slidable hooking part slides from a retracted position towards a deployed position; at least one tongue that is connected to the slidable hooking part to cause the hooking part to slide from a deployed position to a retracted position when an operator presses against the tongue; and at least one spring distinct from the hooking parts, each spring having one end connected to the housing and its other end connected to a corresponding slidable hooking part and exerting a thrust force thereon transversely to the axis of the housing, at least when in a deployed position and in the absence of pressure being applied on the corresponding tongue.
Radiall | Date: 2013-02-28
A housing designed to house an electromagnetic relay comprises a switching member including electrical contact switching pieces, able to move in translation along a principal direction. The housing has a hollow body receiving the switching member, elements fixing the body to a support. The fixing elements each include a fixing part having a surface bearing on the support and means of fixing to the support. The fixing elements further have a connection part connecting the fixing part to the body and the connection parts are designed so as to deform in flexion at least along the main direction.
Radiall | Date: 2014-04-15
The present invention relates to an adapter for a connector, notably for a multicontact connector, of the type including at least one insert, a housing containing the insert and at least one alveolus suitable for housing an alignment sleeve, notably slotted. According to the invention, each alveolus is also suitable for housing a securing cage for an alignment sleeve, by a mounting that is floating radially to its axis, over the entire length of the alignment sleeve.
Agency: Cordis | Branch: FP7 | Program: CP-FP | Phase: FoF.NMP.2012-5 | Award Amount: 5.35M | Year: 2012
Due to the high potential of miniaturization and integration, with regard to the innovation degree, quality and sustainability requirements, the 21st century looks forward to the integration of new functions on plastic parts to produce smart plastic products, as markets are requiring traceability, security, communication as well as ergonomics. So called Molded Interconnected Devices (MID) basically combine all the features of molded plastic parts with electrical conductive circuitry and electronics components assembly directly on the plastic packaging. MID lead finally to highly integrated multimaterial and multifunctional 3D compact systems. With a 20% of growth per year since 2008, MID is the tomorrows converging technology for electronics and plastics. To achieve advanced high precision and high quality 3D micro systems, the EU industry is facing the following MIDs bottlenecks: - to be able to manufacture high precision 3D micro-parts integration plastics and electronics, including 3D plastic system carrier, 3D-conductive tracks and 3D electronics component assembly - to be able to reduce the manufacturing cost by 50% in order for EU industry to be competitive with low-wage countries, - to provide the industry with reliable, robust and in-line controlled manufacturing processes for plastics and electronics converging technologies. 3D-HiPMAS will overcome these challenges by providing the EU industry with a pilot factory based on 4 key technological building blocks enabling the manufacturing of low costs and high precision 3D multi-materials parts: A. 3D high precision plastics micro-parts B. 3D high definition conductive tracks C. 3D precision electronics components assembly D. 3D reliable and robust online monitoring and quality inspection system E. These 4 technologies will be integrated in order to launch the future EU pilot factory The consortium is composed of all key actors from the value chain, from the material manufacturer to the end-user
Radiall | Date: 2015-05-21
The inventive assembly comprises a hyperfrequency component of the surface-mounted component type including at least one first hyperfrequency transmission line, as well as a printed circuit board including at least one second hyperfrequency transmission line able to be put in contact with the first hyperfrequency transmission line. The component comprises an enclosure with a face in contact with the printed circuit board, which includes at least one cavity for confining a hyperfrequency signal, delimited by conductive surfaces of the enclosure, and by a conductive zone of the second hyperfrequency transmission line.