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Pva Tepla Ag, Plasma Systems Gmbh and Asyntis Gmbh | Date: 2005-03-08

Machines and machine tools for plasma treatment of silicon articles, namely, semiconductor wafer processing machines, semiconductor manufacturing machines, semiconductor substrate manufacturing machines; semiconductor substrate etching machines; grinding machines for grinding semiconductors, in particular for back grinding wafers, in particular silicon wafers; machines for transport and storage of silicon discs, namely grippers, wands, tweezers, chucks, robots, robot arms, lifts and cassettes; plasma etching machines; machines for processing gas plasma, gas plasma generator. Data processors; computer hardware and software for controlling plasma treatment equipment; apparatus and instruments for conducting, switching, transforming, accumulating, regulating and/or controlling electric current for operating plasma treatment equipment, namely, electrical conductors, electrical switches, electrical transformers, electric accumulators, voltage regulators for electric power. Services in the field of science and technology as well as corresponding research, development and designer services, namely, research and consulting in the field of plasma treatment of articles; industry analysis and research services, namely, providing technical, engineering, scientific and computer consultation services in the field of semiconductors; engineering; planning, leading and surveillance of projects, namely, conducting technical research, design and product development projects in the field of plasma technology; designing equipment and system controls for treatment and manufacture of silicon articles; adaptation and development of operating parameters for the field of plasma treatment equipment.

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