PSI Technologies Inc

Saskatoon, Canada

PSI Technologies Inc

Saskatoon, Canada
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Berthelot C.,University of Saskatchewan | Soares R.,PSI Technologies Inc. | Haichert R.,PSI Technologies Inc. | Podborochynski D.,PSI Technologies Inc. | And 2 more authors.
Transportation Research Record | Year: 2012

In recent years, many City of Saskatoon (COS), Canada, roads have experienced premature failures. High water tables, increased precipitation, and poor surface drainage have caused increased moisture infiltration in road structures. Further deterioration of these aged pavements is attributable to heavy year-round loadings in urban traffic. To address these issues, COS piloted subsurface drainage and strain dissipation layers in some roads. These drainage systems were constructed with crushed portland cement concrete (PCC) rock and conventional virgin crushed rock. Given the empirical nature of conventional road design methods currently used by COS, the structural benefits of drainage systems are difficult to quantify. Therefore, a reliable method that directly incorporates recycled materials, substructure drainage systems, and diverse field conditions is needed. A mechanistic analysis of the drainage systems was piloted in rehabilitated COS pavement structures with a three-dimensional (3-D) nonlinear orthotropic computational road structural model. The 3-D mechanistic model was used to predict peak surface deflections and normal and shear strains in the structure. Modeling results showed that constructing pavement structures with a substructure drainage layer of crushed PCC rock improved the structural performance of the road system in terms of strains under applied traffic loads. The road model provided primary response predictions that correlated with deflections measured by a heavy weight deflectometer, before and after construction. Therefore, the road model used is a reliable pavement engineering analysis tool able to predict the in-field structural behavior of various road structures under diverse field state conditions.


Allen D.H.,Texas A&M University | Little D.N.,Texas A&M University | Soares R.F.,PSI Technologies Inc. | Berthelot C.,PSI Technologies Inc.
International Journal of Pavement Engineering | Year: 2015

A computational multi-scale procedure for designing flexible roadways is developed in this part, the third of a three-part series. In this study, a two-way coupled multi-scale algorithm was developed and utilised to predict the effects on pavement performance caused by variations in local and global design variables. The model is constructed by utilising the finite element method at two simultaneous and two-way coupled length scales, thereby creating a multi-scale algorithm that is capable of accounting for the effects of variations in design parameters on both length scales. Energy dissipation mechanisms such as viscoelasticity in the asphalt mastic, plasticity in the base layer and crack propagation in the asphalt concrete are incorporated within the model for the purpose of predicting permanent deformations in typical roadways subjected to cyclic tyre loadings. The algorithm is briefly described herein, including the experimental properties required to deploy the computational scheme for the purpose of pavement design. The algorithm is subsequently utilised to predict the effects on pavement performance of variations in design variables on the global length scale (metres) such as asphalt concrete layer thickness and base layer yield point as well as design variables on the local length scale (centimetres) such as aggregate volume fraction and asphalt mastic fracture toughness. These demonstrative examples elucidate the power of this new technology for the purpose of designing more sustainable roadways. © 2015 Taylor & Francis


Allen D.H.,Texas A&M University | Little D.N.,Texas A&M University | Soares R.F.,PSI Technologies Inc. | Berthelot C.,PSI Technologies Inc.
International Journal of Pavement Engineering | Year: 2015

A computational multi-scale procedure for designing flexible pavement is developed in this, the first of a three part series. In this paper, computational analyses are performed on sequentially larger length scales, termed expanding multi-scaling. The model is constructed by the finite element method at each length scale, thereby creating a one-way coupled multi-scale algorithm that is capable of accounting for the effects of variations in design parameters at each length scale on the performance of flexible pavements. For example, the algorithm can be utilised to predict the effects of small-scale design variables such as volume fractions of additives, fines and aggregate, as well as the effects of large-scale design variables such as asphalt concrete thickness and degree of base layer compaction on rutting due to cyclic loading. The computational procedure is briefly herein, including the experimental properties required to deploy the computational scheme for the purpose of pavement design. The paper concludes with several demonstrative examples intended to elucidate the power of this predictive technology for the purpose of designing more sustainable pavements. © 2015 Taylor & Francis


Allen D.H.,Texas A&M University | Little D.N.,Texas A&M University | Soares R.F.,PSI Technologies Inc | Berthelot C.,PSI Technologies Inc
International Journal of Pavement Engineering | Year: 2015

A computational multi-scale procedure for designing flexible pavements is developed in this, the second of a three-part series. In this study, computational analyses are performed on sequentially smaller length scales, termed contracting multi-scaling. The model is constructed by utilising the finite element method on each length scale, thereby creating a one-way coupled multi-scale algorithm that is capable of accounting for the effects of cyclic loading on the initiation and evolution of cracks on multiple length scales within the roadway. For example, the algorithm can be utilised to predict the effects of small-scale design variables such as aggregate volume fraction, as well as the effects of large scale design variables such as asphalt concrete thickness on pavement cracking due to external loading. The model for predicting roadway cracking is briefly described herein, including the experimental properties required to deploy the cracking model within a computational framework. The article concludes with demonstrative examples intended to elucidate the power of this predictive technology for the purpose of designing more sustainable roadways. © 2015 Taylor & Francis


Berthelot C.,University of Saskatchewan | Podborochynski D.,PSI Technologies Inc | Anthony A.,Saskatchewan Ministry of Highways and Infrastructure | Marjerison B.,Saskatchewan Ministry of Highways and Infrastructure
Transportation Research Record | Year: 2011

The Saskatchewan, Canada, Ministry of Highways and Infrastructure is investigating integrated structural asset management to help optimize investment in the rural low-volume road (LVR) network. Integrated ground-penetrating radar (GPR) and heavyweight deflectometer (HWD) testing were found to be very effective structural assessment tools that might be used to strategically rehabilitate, maintain, and upgrade Saskatchewan's LVR network, which accounts for 80% of the ministry's total network. This paper demonstrates this integration at a project level to assess the pre- and postconstruction structural condition of two LVRs in Saskatchewan. The preconstruction GPR survey applied in this study showed locations of trapped moisture within the road structure's granular materials. The postconstruction HWD assessed the end product structural integrity of the road after its rehabilitation treatment. The ability to strategically allocate limited financial resources across the extensive in-service LVR system in Saskatchewan on the basis of accurate structural asset management infrastructure performance data was essential for this project, given the high variability in Saskatchewan LVR structures.


Patent
Psi Technologies Inc. | Date: 2013-03-14

The present invention provides a light-emitting diode (LED) lamp (100, 100a, 100b, 100c). The LED lamp (100, 100a, etc.) comprises a plug (110, 110a, 110b) having two contacts for electrical connections to two respective electric power supply conductors, a fixture (120, 120a, 120b, 120c, 120d) connected to the plug and a plurality of LEDs (11) mounted onto the fixture (120, 120a, etc.), so that heat is conducted directly away from the LEDs (11) through the fixture and plug. When the LED lamp is connected to a lamp holder (20) and electric power is supplied from the power supply conductors, heat generated from operation of the LEDs (11) is conducted away through the fixture, plug and power supply conductors to the ambience.


The present invention provides a Scalable Heat Dissipating Microelectronic Integration Platform (SHDMIP) LED Package having excellent heat dissipation and protection to LED, thus extending the lifespan of the LED. The SHDMIP LED package comprises a dual lead frame assembly comprising bottom and top lead frame, protection and driver circuits conductively attached to the bottom lead frame and a LED conductively attached to the top lead frame. The bottom lead frame comprises heat sink pad for heat dissipation purpose. Plurality of SHDMIP LED packages of the present invention can be configured in a matrix or row, forming a SHDMIP LED array for various lighting solutions. A method to manufacture the SHDMIP LED array of the present invention is provided herein.


The present invention provides a Scalable Heat Dissipating Microelectronic Integration Platform (SHDMIP) LED Package having excellent heat dissipation and protection to LED, thus extending the lifespan of the LED. The SHDMIP LED package comprises a dual lead frame assembly comprising bottom and top lead frame, protection and driver circuits conductively attached to the bottom lead frame and a LED conductively attached to the top lead frame. The bottom lead frame comprises heat sink pad for heat dissipation purpose. Plurality of SHDMIP LED packages of the present invention can be configured in a matrix or row, forming a SHDMIP LED array for various lighting solutions. A method to manufacture the SHDMIP LED array of the present invention is provided herein.


Patent
PSI Technologies Inc. | Date: 2012-09-10

The present invention provides a power semiconductor package. The power semiconductor package comprises a dual lead frame assembly comprising a bottom lead frame having a first heat sink pad at its bottom surface and a top lead frame having a second heat sink pad at its bottom surface. The top lead frame is coupled to the bottom lead frame by an isolation layer, wherein the isolation layer is a thermal conductive, but electrical isolative, material. The power semiconductor package further comprises a power semiconductor device coupled to the top lead frame of the dual lead frame assembly and an encapsulation member encapsulating the dual lead frame assembly and the power semiconductor device, while exposing the first heat sink pad at the bottom surface of the bottom lead frame.


The present invention provides a Scalable Heat Dissipating Microelectronic Integration Platform (SHDMIP) LED package having excellent heat dissipation and protection to the LED, thus extending the lifespan of the LED. Each of the SHDMIP LED package comprises a dual lead frame assembly comprising bottom and top lead frame, protection and driver circuit electrically connected to the top or bottom lead frame and a LED electrically connected to the top lead frame. The bottom lead frame comprises heat sink pad for heat dissipation purpose. Plurality of SHDMIP LED packages of the present invention can be configured in a matrix or row, forming a SHDMIP LED array for various lighting solutions.

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