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Saskatoon, Canada

Berthelot C.,University of Saskatchewan | Podborochynski D.,PSI Technologies Inc | Anthony A.,Saskatchewan Ministry of Highways and Infrastructure | Marjerison B.,Saskatchewan Ministry of Highways and Infrastructure
Transportation Research Record | Year: 2011

The Saskatchewan, Canada, Ministry of Highways and Infrastructure is investigating integrated structural asset management to help optimize investment in the rural low-volume road (LVR) network. Integrated ground-penetrating radar (GPR) and heavyweight deflectometer (HWD) testing were found to be very effective structural assessment tools that might be used to strategically rehabilitate, maintain, and upgrade Saskatchewan's LVR network, which accounts for 80% of the ministry's total network. This paper demonstrates this integration at a project level to assess the pre- and postconstruction structural condition of two LVRs in Saskatchewan. The preconstruction GPR survey applied in this study showed locations of trapped moisture within the road structure's granular materials. The postconstruction HWD assessed the end product structural integrity of the road after its rehabilitation treatment. The ability to strategically allocate limited financial resources across the extensive in-service LVR system in Saskatchewan on the basis of accurate structural asset management infrastructure performance data was essential for this project, given the high variability in Saskatchewan LVR structures. Source


Patent
PSI Technologies Inc. | Date: 2012-09-10

The present invention provides a power semiconductor package. The power semiconductor package comprises a dual lead frame assembly comprising a bottom lead frame having a first heat sink pad at its bottom surface and a top lead frame having a second heat sink pad at its bottom surface. The top lead frame is coupled to the bottom lead frame by an isolation layer, wherein the isolation layer is a thermal conductive, but electrical isolative, material. The power semiconductor package further comprises a power semiconductor device coupled to the top lead frame of the dual lead frame assembly and an encapsulation member encapsulating the dual lead frame assembly and the power semiconductor device, while exposing the first heat sink pad at the bottom surface of the bottom lead frame.


The present invention provides a Scalable Heat Dissipating Microelectronic Integration Platform (SHDMIP) LED package having excellent heat dissipation and protection to the LED, thus extending the lifespan of the LED. Each of the SHDMIP LED package comprises a dual lead frame assembly comprising bottom and top lead frame, protection and driver circuit electrically connected to the top or bottom lead frame and a LED electrically connected to the top lead frame. The bottom lead frame comprises heat sink pad for heat dissipation purpose. Plurality of SHDMIP LED packages of the present invention can be configured in a matrix or row, forming a SHDMIP LED array for various lighting solutions.


Patent
Psi Technologies Inc. | Date: 2013-03-14

The present invention provides a light-emitting diode (LED) lamp (


The present invention provides a Scalable Heat Dissipating Microelectronic Integration Platform (SHDMIP) LED Package having excellent heat dissipation and protection to LED, thus extending the lifespan of the LED. The SHDMIP LED package comprises a dual lead frame assembly comprising bottom and top lead frame, protection and driver circuits conductively attached to the bottom lead frame and a LED conductively attached to the top lead frame. The bottom lead frame comprises heat sink pad for heat dissipation purpose. Plurality of SHDMIP LED packages of the present invention can be configured in a matrix or row, forming a SHDMIP LED array for various lighting solutions. A method to manufacture the SHDMIP LED array of the present invention is provided herein.

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