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Baton Rouge, LA, United States

Dussault D.,ProSys Inc. | Fournel F.,CEA Grenoble | Dragoi V.,EV Group
ECS Transactions | Year: 2012

The increased complexity of microelectronic and sensor applications that have emerged over the past decade have driven wafer bonding to mature as a production technology for both MEMS and 3D stacked die manufacturing. The use of CMOS device wafers has restricted the types of viable bonding processes to low temperature fusion bonding, adhesive bonding and metal bonding. Due to the specific requirements of CMOS technology the allowed bonding processes had to be adapted in order to fulfill the specific CMOS-compatibility demands. This paper presents a novel single wafer Megasonic based cleaning method with enhanced process control capabilities. This cleaning process is integrated in low temperature fusion bonding process and enables higher bonding yields and a reduction in process fluid usage. © The Electrochemical Society. Source


Logerot D.,ProSys Inc.
AFPM Annual Meeting 2012 | Year: 2012

Sulfur Recovery in a Refinery entails collecting sour vent gases (containing H2S) from a number of process sources, including Hydrotreating Units, Hydrocracking Units, Crude Units, and others, then converting the H2S to a more useable form such as sulfuric acid or elemental sulfur. The feed rates and compositions to the Sulfur Recovery Units (SRUs) are not controllable at the SRU. In addition, most Refineries employ multiple SRUs operating in parallel. This gives rise to a number of process control challenges, including: Load balancing among the various units Response to changing loads (total feed load cannot be controlled) Response to variable compositions Air/Oxygen load controls Response to one SRU shutdown (rapid load increase for the remaining SRUs) This paper will present the ramifications of these control problems along with the methodology used for successful implementation of the advanced control scheme for each. Source


Trademark
ProSys Inc. | Date: 2008-02-05

Graphical user interface software.


Dussault D.,ProSys Inc. | Liebscher E.,ProSys Inc. | Fournel F.,CEA Grenoble | Dragoi V.,EV Group
Proceedings of SPIE - The International Society for Optical Engineering | Year: 2013

A pre-bond cleaning process was developed utilizing a unique, radially uniform, large area proximity type Megasonic transducer. In prior work this new cleaning method was investigated for PRE (particle removal efficiency) as well as particle neutrality. These tests yielded higher values than those achieved with the processes of record. Subsequently, this process was integrated into an industrial volume low temperature fusion bonding process and enabled higher bonding yields. In the above process flow the process fluid was dispensed to fill the gap between the Megasonic transducer surface and the substrate using an atmospheric free flow stream applied to the substrate. Current work describes development, testing and operational verification of a process fluid management device used in conjunction with the wide area proximity Megasonic transducer. The goals of this development were reduction of process fluid amount required, increase the operating substrate rotation speed, and provide better control of process fluid parameters. The design criteria and process flow as well as test results demonstrating the benefits of the new system are presented. © 2013 SPIE. Source


Beebe D.,ProSys Inc. | Harleaux K.,ProSys Inc.
Global Congress on Process Safety 2012 - Topical Conference at the 2012 AIChE Spring Meeting and 8th Global Congress on Process Safety | Year: 2012

This presentation illustrates the need and solution for operators viewing and making changes to set points and outputs in context. It shows the penalty and risks of operators shifting focus to faceplates and performing other window management tasks when trying to operate an industrial process. In-situ (In Place) modification improves the speed of operator response, reduces entry errors and operator loading. For the industrial process, this means fewer spurious trips due to operator entry and more reliable and efficient plant operation. The presentation will cover how to incorporate items normally displayed in the faceplate directly into the operator display. The illustrated examples will be running ProSys' Interface Dynamics display library, but concepts in the presentation are applicable to any industrial HMI and can be achieved in almost any control system. Source

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