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Brecksville, OH, United States

Patent
Promerus Llc and Sumitomo Bakelite | Date: 2015-08-17

A series of vinyl addition block polymers derived from functionalized norbornene monomers are disclosed and claimed. Specifically, a series of diblock and triblock polymers derived from norbornene monomers are disclosed. Also disclosed are the method of preparation of such block polymers, and their use in the fabrication of membranes which exhibit unique separation properties.


Patent
Promerus Llc and Sumitomo Bakelite | Date: 2015-08-17

A pervaporation membrane formed from a series of vinyl addition block polymers derived from functionalized norbornene monomers are disclosed and claimed. Also disclosed are the fabrication of membranes which exhibit unique separation properties, and their use in the separation of organic volatiles from biomass and/or organic waste, including butanol, phenol, and the like.


Embodiments in accordance with the present invention are directed to a method of fabricating a semiconductor device wherein a device wafer substrate is coated with a composition encompassing a surface energy modifier and a thermally stable polymer which is then bonded to a carrier wafer substrate coated with a composition encompassing a crosslinkable polymer composition. The polymer composition allows thinning of a device wafer before separating from the carrier wafer at room temperature.


Patent
Merck Patent GmbH and Promerus LLC | Date: 2015-11-10

The invention relates to organic electronic devices containing polycycloolefin planarization layers between the substrate and a functional layer such as a semiconducting layer, dielectric layer, or electrode; to the use of polycycloolefins as a planarization layer on the substrate of an organic electronic device; and to processes for preparing such polycycloolefin planarization layers and organic electronic devices.


Patent
Merck Patent GmbH and Promerus LLC | Date: 2015-08-11

Embodiments in accordance with the present invention provide for the use of polycycloolefins in electronic devices and more specifically to the use of such polycycloolefins as interlayers applied to fluoropolymer layers used in the fabrication of electronic devices, the electronic devices that encompass such polycycloolefin interlayers and processes for preparing such polycycloolefin interlayers and electronic devices.

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