Rio Dell, CA, United States
Rio Dell, CA, United States

Time filter

Source Type

A simple method to resolve the features that are characteristic of hydroxyl radicals in sonoluminescence (SL) spectra from aqueous solutions has been developed. Using a modified version of cavitation threshold (CT) cell in which single band filters were sandwiched between the UV grade fused silica window and the photomultiplier tube (PMT) in the cell, photon emission in the wavelength range of 280 to 400 nm was measured. Four different single band filters, 280-305.5 nm, 300-340 nm, 335-375 nm and 374.5-397.5 nm were used. The results for air and Ar saturated DI water are consistent with those reported in the literature and obtained using expensive spectrometers. The SL signal collected in ammonium hydroxide solutions indicated that at higher power densities the signal intensity may not be relatable to the generation rate of hydroxyl radicals in their ground state. © The Electrochemical Society.


Dussault D.,Product Systems Inc. | Dragoi V.,EV Group
Materials Research Society Symposium Proceedings | Year: 2012

The use of non-standard materials (e.g. specific substrates shapes and dimensions or polymer materials) for MEMS applications imposed a requirement for the development of new techniques for even well-established processes. Acoustic energy in the MHz frequency range has been used in the semiconductor industry for various processes such as photoresist development, substrate cleaning and electro-plating enhancement. The work presented here is focusing on single wafer cleaning and on photoresist development. The cleaning process developed addresses mainly wafer cleaning prior to wafer bonding processes, in which particle contamination is of crucial importance. The photoresist development process was developed mainly for thick resist layers development (few hundreds of μm) in order to improve definition of high aspect ratio features but was used as well as a significant process time reduction factor for development of regular thickness resists (few μm). © 2012 Materials Research Society.


Dragoi V.,EV Group | Mittendorfer G.,EV Group | Flotgen C.,EV Group | Dussault D.,Product Systems Inc. | Wagenleitner T.,EV Group
Proceedings of the International Semiconductor Conference, CAS | Year: 2011

Wafer bonding is a very attractive technology for applications in wafer-level 3D integration. However, most of the bonding processes are not compatible with CMOS technology in terms of process temperature and contamination levels. A low temperature fusion bonding process is presented as an example of how the wafer bonding issues were successfully solved and applied to manufacturing processes. © 2011 IEEE.


Dussault D.,Product Systems Inc. | Dragoi V.,EV Group
Proceedings of the International Semiconductor Conference, CAS | Year: 2011

MEMS-specific processes have had to adapt standard IC manufacturing technologies in order to accommodate its custom requirements. Photolithography is one of the standard techniques which had to adopt the use of thick resists (between few tens and up to few hundreds of m) needed for high aspect ratio features fabrication, and to adapt to the specific high volume manufacturing yield requirements demanded by developing new processing techniques. This paper introduces a new development technique based on the use of a megasonic transducer for yield improvement and process time reduction. © 2011 IEEE.


Dragoi V.,EV Group | Bartel J.,EV Group | Dussault D.,Product Systems Inc.
ECS Transactions | Year: 2010

MEMS-specific processes required to adapt standard IC manufacturing technologies in order to accommodate its custom requirements. Photolithography is one of the standard techniques which had to adapt particularly to the use of thick resists needed for high aspect ratio features fabrication. In order to work with resist thickness varying between few tens and up to few hundreds of micrometers the standard process flow had to be changed to multiple-layers coating, customized (and very long) baking times, special exposure techniques and development. This paper introduces a megasonic-enhanced method used for developing resists. In case of MEMS applications this method brings not only a major yield improvement (better quality features) but also a major decrease of process time. ©The Electrochemical Society.


Dragoi V.,EV Group | Mittendorfer G.,EV Group | Flotgen C.,EV Group | Dussault D.,Product Systems Inc. | Wagenleitner T.,EV Group
Romanian Journal of Information Science and Technology | Year: 2011

Wafer bonding proved to be a valuable MEMS manufacturing technology during past years, when bonding-based applications moved to high volume production. Due to its ability to allow for building 3D architectures wafer bonding became very attractive also for applications using wafer-level 3D integration. However, most of the bonding processes are not compatible with CMOS technology in terms of process temperature and contamination levels. A low temperature fusion bonding process is presented as an example of how the wafer bonding issues were successfully solved and applied to manufacturing processes.


Han Z.,University of Arizona | Keswani M.,University of Arizona | Liebscher E.,Product Systems Inc. | Beck M.,Product Systems Inc. | Raghavana S.,University of Arizona
ECS Journal of Solid State Science and Technology | Year: 2014

A simple method to resolve the features that are characteristic of hydroxyl radicals in sonoluminescence (SL) spectra from aqueous solutions has been developed. Using a modified version of cavitation threshold (CT) cell in which single band filters were sandwiched between the UV grade fused silica window and the photomultiplier tube (PMT) in the cell, photon emission in the wavelength range of 280 to 400 nm was measured. Four different single band filters, 280-305.5 nm, 300-340 nm, 335-375 nm and 374.5-397.5 nm were used. The results for air and Ar saturated DI water are consistent with those reported in the literature and obtained using expensive spectrometers. The SL signal collected in ammonium hydroxide solutions indicated that at higher power densities the signal intensity may not be relatable to the generation rate of hydroxyl radicals in their ground state. © 2014 The Electrochemical Society. All rights reserved.


Yang W.,Product Systems Inc. | Li Y.H.,General Electric | Sellars C.M.,University of Sheffield
Journal of Testing and Evaluation | Year: 2012

Simple cantilever bend testing to assess mechanical descaling of industrial hot-rolled steel rods has been developed and analysed. This test method has no contact damage to the scale, and produces a range of strains along the rod, which always include those for scale behaviour from crack initiation to complete spallation. A series of methods has been used to assess the variation of the plastic strain along the bent rods and the results have been compared with finite element modelling. Using a cyclone scanner for these measurements provides an accurate and efficient testing procedure. To compare with industrial practice, constrained bending around cylinders was also carried out. Copyright © 2012 by ASTM Int'l all rights reserved.


Roach S.,Product Systems Inc.
143rd Technical Conference and Exhibition | Year: 2016

This paper presents an alternative use for Standard video pipelines and transport layers. It suggests taking advantage of SMPTE 292m serial digital video connections for highspeed data transport within a traditional video environment and its subsequent use, storage and transfer with non-traditional platforms. A new transport medium for film data images is introduced. The proposal includes how data images can be viewed, stored, and processed, and how standard video connections can move the data transparently. The format is described as a video-compliant data structure with variable resolutions and aspect ratios. Existing installations are described as application examples. © 2001 Society of Motion Picture and Television Engineers, Inc.

Loading Product Systems Inc. collaborators
Loading Product Systems Inc. collaborators