Processing Technology

Nellore, India

Processing Technology

Nellore, India
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News Article | May 4, 2017
Site: www.businesswire.com

LISLE, Ill.--(BUSINESS WIRE)--Molex will showcase its tooling solutions in booth #1655 at the National Electrical Wire Processing Technology Expo, to be held May 10–11 at the Wisconsin Center in Milwaukee. Designed to ensure high-quality electrical connections, Molex tooling equipment helps prevent unnecessary downtime while ensuring customers meet industry standards and maintain warranties in multiple applications, including automotive, industrial, commercial, contract manufacturer, assembly and design/engineering. Molex also provides application tooling services that help customers during equipment setup and throughout the product’s lifecycle. “Molex solves the ongoing challenge that customers face when achieving superior connections in demanding conditions,” said Larry Schultz, global product manager, Molex. “We not only provide excellent application tooling solutions, but also top-of-the-line customer service and technical support at no additional cost.” While at the National Electrical Wire Processing Technology Expo, Molex experts will showcase several of its semi-automatic crimping machines, which are ideal for mid-to-high range production volumes in booth #1655: TM-3000 Universal Crimp Press System: Delivers an effective method of applying a wide range of side-feed and rear-feed terminals to pre-stripped discrete wire or cable. This press system accepts Molex Mini-Mac and FineAdjust applicators and uses most industry-standard applicators, which reduces tooling costs and provides design flexibility. The direct-drive, split-cycle press accepts Molex air-feed applicators that process terminals mounted on Mylar tape. TM-4000 Universal Crimp Press System: The only industry-standard, bench-top press on the market that terminates large lug products up to 4 AWG, the Molex TM-4000 Universal Crimp Press applies a wide range of side- and rear-feed terminals to heavy gauge wires. It accepts the most common industry-standard applicators and any Molex applicator, including air-feed applicators that process terminals mounted on Mylar tape. Tape-Terminal Crimp Modules (Tape Base Unit): Provides an effective method of applying a wide range of side-feed, tape-mounted terminals to pre-stripped discrete wire from 4 to 30 AWG. The crimp module operates only in the TM-4000 and TM-3000 Universal Presses and uses quick-change modular tooling, which accepts all existing ATP-201 and ATP-301 die sets, reducing tooling investment. Molex will offer a 10% discount if you buy a TM-3000 Universal Crimp Press System or TM-4000 Universal Crimp Press System from Heilind at the expo. For application tooling support from Molex, please call 402.458.TOOL (8665), e-mail applicationtooling@molex.com, or visit www.molex.com/link/semiautomatictooling.html. Molex brings together innovation and technology to deliver electronic solutions to customers worldwide. With a presence in more than 40 countries, Molex offers a full suite of solutions and services for many markets, including data communications, consumer electronics, industrial, medical, automotive and commercial vehicle. For more information, please visit www.molex.com. Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners.


News Article | May 4, 2017
Site: www.prweb.com

Heilind Electronics, a leading global distributor of electronic components, will be showcasing its electrical wire and cable processing products on May 10 and May 11 at the Electrical Wire Processing Technology Expo -- the world’s largest event dedicated to the electrical wire and cable processing industry, held in Milwaukee, WI. Heilind will be featuring items from leading manufacturers such as 3M, Amphenol, HARTING, Hirose, JAE, JST, Molex, Panduit, TE Connectivity, and WAGO. Among the many items on display will be the Molex ML-XT™ Sealed Connection System, along with temperature and pressure sensors from Amphenol Advanced Sensors and TE Sensor Solutions. “We are excited to be a part of the Electrical Wire Processing Technology Expo again this year,” said David Goforth, Heilind’s North American Director of Supplier Relations. “As a world leader in interconnect products, we provide the cutting-edge technology required in today’s electrical wire and cable applications. This includes a full range of tooling -- from cut, strip, and terminate equipment to springs, anvils, and punches. We look forward to seeing how we can best fulfill the needs of electrical wire and cable processing companies.” Heilind Electronics, which serves customers ranging from start-ups to multinational OEMs, will have representatives at booth #1651 for the duration of the show. The Expo takes place May 10 and May 11 at Wisconsin Center in Milwaukee, Wisconsin. Founded in 1974, Heilind Electronics, Inc. (http://www.heilind.com) is one of the world's leading distributors of connectors, relays, sensors, switches, thermal management and circuit protection products, terminal blocks, wire and cable, wiring accessories, and insulation and identification products. Heilind has locations throughout the U.S., Canada, Mexico, Brazil, Germany, Singapore, Hong Kong, and China. Follow Heilind on Facebook at facebook.com/Heilind and on Twitter at twitter.com/Heilind.


News Article | May 29, 2017
Site: www.techradar.com

At an event in New Delhi, Panasonic India has unveiled a new 2017 line-up of 4K Ultra HD TVs along with the UA7 sound system. The TV line-up comprises of EX750 and EX600 series, which consists of 4K TVs with screen sizes ranging from 43-icnh to 65-inch. With this launch, the Japanese conglomerate aims to capture 10% market share in the 4K TV segment by the end of FY17-18. Speaking about the particulars, the expensive and the most elegant of all is EX750 flagship model with 65-inch 4K Ultra HD screen. It will be selling for Rs. 3,10,000. Its new cinema display with 4K Hexa Chroma Drive Pro, Panasonic’s Original Revolutionary Colour Processing Technology, provides a vivid color reproduction with a wide color range, resulting in an ultimate 4K viewing experience as well as a theater experience. The EX750 is equipped with 550nits Super Bright Panel, HDR1000 and is powered by the same Studio Colour HCX2 processor. It consists of 4 HDMI Terminals, 3 USB ports. It comes with Bluetooth, Wi-Fi. The 'Switch Design,' with Swivel functionality, on the Panasonic 65” EX750 offers the perfect viewing angle and gives plenty of options of where you can place your television. Overall, watching on this 65-inch monster will be a treat to eyes. On the other hand, EX600 series consists of three models: 55-inch, 49-inch, and 43-inch screen sizes priced at Rs. 1,78,900, Rs. 1,41,000, Rs. 78,900 respectively. All of them are designed to provide Smartest user experience, allowing users to access all their entertainment content in one place. They house 3 HDMI ports and 2 USB terminals. The interior frame is elegantly crafted with a Switch Design pedestal that allows the stand width to be adjusted according to preference. On purchase of EX750 65-inch, EX600 55-inch, and Ex600 49-inch models, you will get a new UA7 all-in-one sound system for free.


Sravani K.,Processing Technology | Balasubramanian A.,Processing Technology | Vanitha M.,Processing Technology | Reddy G.V.S.,Processing Technology
Ecology, Environment and Conservation | Year: 2013

Quality of frozen Labeo rohita (Rohu) stored at -40°C was evaluated through proximate, biochemical, microbial and sensory analyses. After 90 days of storage, frozen fish were found with reduced moisture, lipid and protein content while the ash content fluctuated throughout the storage period. The organoleptic quality of the frozen stored fish was influenced by the Total Volatile Base Nitrogen (TVBN). Thiobarbutric acid (TBA), Free Fatty Acids (FFA) and microbial counts. Total Plate Count of mesophilic bacteria increased gradually from a log value of 2.85 cfu/gram of meat on 1st day of storage to 3.12 cfu/gram of meat on 30thday and decreased to 2.67 cfu/gram of meat on 90th day of frozen storage. Staphylococcus aureus count decreased from the first day storage count of 2.21 cfu/gram of meat to Est. < 1.0 cfu/gram of meat on 90thday. The psychrophilic count of rohu increased with storage period from an initial log value of 2.73 cfu/ gram of meat to 3.24 cfu/gram of meat up to 90th day of storage. Whereas the sulphur producing bacterial count increased up to 30th day of storage and then showed a decreasing trend. In the case of other mesophilic and psychrophilic bacteria such as E.coli, Faecal strepto cocci, Pseudomonas spp., Aeromonas spp., and other pathogenic microorganisms like Vibrio spp., Salmonella spp. and Listeria monocytogens were absent throughout the frozen storage period. The freshness based on over all sensory score decreased with increase in storage period. On correlating the overall sensory score with frozen storage period, the frozen stored fish was found acceptable for consumption upto 113 days. © EM International.


News Article | March 24, 2016
Site: www.scientificcomputing.com

In aerospace, automation and automotive technologies, smart electronic computer systems have to meet a number of security and real-time requirements. In case of critical incidents, for instance, the software’s response time has to be very short. Programming of the corresponding applications is time- and cost-consuming. Partners of industry and research are now developing a tool chain for efficient, standardized, and real-time-capable programming under the EU consortium ARGO that is coordinated by Karlsruhe Institute of Technology (KIT). Development is based on the open source software Scilab. More and more safety-critical embedded electronic solutions are based on rapid, energy-efficient multicore processors. “Two of the most important requirements of future applications are an increased performance in real time and further reduction of costs without adversely affecting functional safety,” Professor Jürgen Becker of the Institute for Information Processing Technology (ITIV) of KIT says, who coordinates ARGO. “For this, multicore processors have to make available the required performance spectrum at minimum energy consumption in an automated and efficiently programmed manner.” Multicore systems are characterized by the accommodation of several processor cores on one chip. The cores work in parallel and, hence, reach a higher speed and performance. Programming of such heterogeneous multicore processors is very complex. Moreover, the programs have to be tailored precisely to the target hardware and to fulfill the additional real-time requirements. The ARGO EU research project, named after the very quick vessel in Greek mythology, is aimed at significantly facilitating programming by automatic parallelization of model-based applications and code generation. So far, a programmer had to adapt his code, i.e. the instructions for the computer, to the hardware architecture, which is associated with a high expenditure and prevents the code from being transferred to other architectures. “Under ARGO, a new standardizable tool chain for programmers is being developed. Even without precise knowledge of the complex parallel processor hardware, the programmers can control the process of automatic parallelization in accordance with the requirements. This results in a significant improvement of performance and a reduction of costs,” Becker says. In the future, the ARGO tool chain can be used to manage the complexity of parallelization and adaptation to the target hardware in a largely automated manner with a small expenditure. Under the project, real-time-critical applications in the areas of real-time flight dynamics simulation and real-time image processing are studied and evaluated by way of example. Eight project partners of science and industry cooperate under the project: Apart from KIT, the University of Rennes (France), the Technological Educational Institute of Western Greece, the German Aerospace Center, and the Fraunhofer Institute for Integrated Circuits IIS (Germany) as well as Recore Systems B.V. (the Netherlands), Scilab Enterprises (France), and AbsInt Angewandte Informatik GmbH (Germany) are involved in ARGO. “ARGO — WCET-aware Parallelization of Model-based Applications for Heterogeneous Parallel Systems” will be funded by the EU with EUR 3.9 million in the next three years. The project is coordinated by Professor Jürgen Becker, Head of the Institute for Information Processing Technology (ITIV) of KIT.


News Article | November 16, 2016
Site: www.prnewswire.co.uk

According to a new report published by Future Market Insights titled "PP Homopolymer Market: Global Industry Analysis and Opportunity Assessment, 2016-2026", the global PP homopolymer market was valued at US$ 42.87 Bn in 2015 and is anticipated to register a CAGR of 5.5% during the forecast period (2016 - 2026). The report throws light on the key drivers, trends, and restraints likely to impact the growth and performance of the global PP homopolymer market over the next 10 years and offers information on opportunities for PP homopolymer manufacturers operating in the global PP homopolymer market. According to Future Market Insights, an increasing consumption of PP homopolymer in the packaging industry along with a high growth of the retail sector is likely to boost the demand for PP homopolymer and subsequently drive market growth over the forecast period. PP homopolymer plays a major role in decreasing carbon emissions from vehicles and manufacturers around the world are increasingly using PP homopolymer in vehicle production to comply with various government and environmental regulations regarding the reduction of carbon emissions from vehicles. Use of PP homopolymer in automotive applications leads to reduced weight of the vehicle, consequently increasing its fuel efficiency.  This is another factor fuelling the growth of the global PP homopolymer market. In order to capitalise on the opportunities in the market, market players are introducing new grades of PP homopolymer for various new applications to increase their market share in the global market. Request a Sample Report and Table of Contents with Figures: http://www.futuremarketinsights.com/reports/sample/rep-gb-2122 However, in the last few years, automobile OEMs have been switching from PP homopolymer to PP copolymer and aluminium for manufacturing specific vehicle parts as PP copolymer and aluminium provide better toughness and durability than PP homopolymer. This is likely to restrict the growth of the global PP homopolymer market over the forecast period. The global PP homopolymer market is segmented on the basis of processing technology into Injection Moulding, Film, Other Extrusion, Fibre, and Others (blow moulding, sheet etc.); and on the basis of end use into Packaging (Flexible Packaging, Rigid Packaging), Electrical and Electronics, Textile, Automotive, Building and Construction, and Others. Preview Analysis on Global PP Homopolymer Market Segmentation By Processing Technology - Injection Moulding, Film, Other Extrusion and Fibre, By End Use - Packaging, Electrical And Electronics, Textile, Automotive, Building and Construction: http://www.futuremarketinsights.com/reports/pp-homopolymer-market The global PP homopolymer market is segmented into the seven key regions of North America, Latin America, Western Europe, Eastern Europe, Asia Pacific excluding Japan (APEJ), Japan, and Middle East & Africa (MEA). The APEJ regional market is estimated to dominate the global PP homopolymer market in terms of value and register a CAGR of 5.8% over the forecast period. The MEA homopolymer market is anticipated to witness a CAGR of 5.4% during the forecast period, making MEA the second largest market in terms of CAGR. Speak with Analyst for any Report Related Queries: http://www.futuremarketinsights.com/askus/rep-gb-2122 The global PP homopolymer market report features some of the top companies operating in this market. LyondellBasell Industries, Braskem S.A., The Dow Chemical Company, Reliance Industries Limited, L.C.Y. Chemical Corporation, Total Petrochemicals USA Inc., IRPC Public Company Limited., Sasol Limited., National Petrochemical Industrial Company, and The Polyolefin Company (Singapore) Pte Ltd. are the companies profiled in the report. Global manufacturers are introducing new grades of PP homopolymer in order to meet different technical and regulatory requirements for various end-use industries. Future Market Insights (FMI) is a leading market intelligence and consulting firm. We deliver syndicated research reports, custom research reports and consulting services which are personalized in nature. FMI delivers a complete packaged solution, which combines current market intelligence, statistical anecdotes, technology inputs, valuable growth insights and an aerial view of the competitive framework and future market trends.


News Article | December 7, 2016
Site: marketersmedia.com

— According to a new report published by Future Market Insights titled “PP Homopolymer Market: Global Industry Analysis and Opportunity Assessment, 2016–2026”, the global PP homopolymer market was valued at US$ 42.87 Bn in 2015 and is anticipated to register a CAGR of 5.5% during the forecast period (2016 – 2026). The report throws light on the key drivers, trends, and restraints likely to impact the growth and performance of the global PP homopolymer market over the next 10 years and offers information on opportunities for PP homopolymer manufacturers operating in the global PP homopolymer market. According to Future Market Insights, an increasing consumption of PP homopolymer in the packaging industry along with a high growth of the retail sector is likely to boost the demand for PP homopolymer and subsequently drive market growth over the forecast period. PP homopolymer plays a major role in decreasing carbon emissions from vehicles and manufacturers around the world are increasingly using PP homopolymer in vehicle production to comply with various government and environmental regulations regarding the reduction of carbon emissions from vehicles. Use of PP homopolymer in automotive applications leads to reduced weight of the vehicle, consequently increasing its fuel efficiency. This is another factor fuelling the growth of the global PP homopolymer market. In order to capitalise on the opportunities in the market, market players are introducing new grades of PP homopolymer for various new applications to increase their market share in the global market. However, in the last few years, automobile OEMs have been switching from PP homopolymer to PP copolymer and aluminium for manufacturing specific vehicle parts as PP copolymer and aluminium provide better toughness and durability than PP homopolymer. This is likely to restrict the growth of the global PP homopolymer market over the forecast period. The global PP homopolymer market is segmented on the basis of processing technology into Injection Moulding, Film, Other Extrusion, Fibre, and Others (blow moulding, sheet etc.); and on the basis of end use into Packaging (Flexible Packaging, Rigid Packaging), Electrical and Electronics, Textile, Automotive, Building and Construction, and Others. The Injection Moulding processing technology segment is anticipated to hold the largest market value share throughout the forecast period and is expected to create total incremental opportunity of US$ 14.62 Bn between 2016 and 2026 Preview on PP Homopolymer Market Segmentation By Processing Technology - Injection Moulding, Film, Other Extrusion and Fibre, By End Use - Packaging, Electrical And Electronics, Textile, Automotive, Building and Construction: http://www.futuremarketinsights.com/reports/pp-homopolymer-market The Packaging end use segment is estimated to dominate the global PP homopolymer market throughout the forecast period due to high demand in North America and Western Europe. This segment is expected to create total incremental opportunity of US$ 15.16 Bn by the end of 2026 The global PP homopolymer market is segmented into the seven key regions of North America, Latin America, Western Europe, Eastern Europe, Asia Pacific excluding Japan (APEJ), Japan, and Middle East & Africa (MEA). The APEJ regional market is estimated to dominate the global PP homopolymer market in terms of value and register a CAGR of 5.8% over the forecast period. The MEA homopolymer market is anticipated to witness a CAGR of 5.4% during the forecast period, making MEA the second largest market in terms of CAGR. The global PP homopolymer market report features some of the top companies operating in this market. LyondellBasell Industries, Braskem S.A., The Dow Chemical Company, Reliance Industries Limited, L.C.Y. Chemical Corporation, Total Petrochemicals USA Inc., IRPC Public Company Limited., Sasol Limited., National Petrochemical Industrial Company, and The Polyolefin Company (Singapore) Pte Ltd. are the companies profiled in the report. Global manufacturers are introducing new grades of PP homopolymer in order to meet different technical and regulatory requirements for various end-use industries. For more information, please visit http://www.futuremarketinsights.com/reports/pp-homopolymer-market


News Article | April 6, 2016
Site: phys.org

A touchscreen is an essential feature of many modern devices, but the material that gives most screens their touch sensitivity is in short supply. By adapting newspaper printing technology, A*STAR researchers have developed a low-cost alternative capable of printing conductive metal ink in lines so thin that they are invisible to the naked eye. A film of this fine metal mesh could potentially form the touch-sensing layer of future smartphone screens. Most touchscreens rely on an electrically conductive material called indium tin oxide (ITO). As skin is conductive, touching the screen alters its electric field, which is detected as a tap. Crucially for a surface layer of a screen, ITO is also optically transparent. Very few materials possess this combination of properties. Industry has responded to the spike in indium prices accompanying the rising demand for ITO by intensifying the search for alternative transparent conductive materials. XinQuan Zhang from the Singapore Institute of Manufacturing Technology and his co-workers are working on a promising alternative touch-sensitive film: a printed, mesh-like pattern of ultra-fine metal lines, created using roll-to-roll gravure printing. Gravure printing traditionally uses an etched mold to transfer ink on to paper. Here, the etched cylindrical mold instead transfers a precise pattern of conductive metal ink on to the touch-sensing substrate. Light from the screen passes through the holes in the printed mesh. Before this study, the finest lines that could be printed this way were approximately 50 micrometers wide, which blocked more than a third of the screen's light. Zhang and his co-workers have overcome this limitation through diamond micro engraving. Instead of using a laser to etch the grid-like pattern of tiny inkwells into the printer's cylindrical mold, Zhang uses a tiny diamond-tipped cutting tool to pattern the roller using ultraprecision machining technology. Originally developed to manufacture lenses and optical components, "ultraprecision machining has never been used for gravure printing," Zhang says. His team successfully adapted the machine to cut tiny inkwells on the roller, two and a half times smaller than a laser could etch. Using this roller, the team printed a mesh of metal lines just 19 micrometers across. More than 80 per cent of visible light passed through this mesh, matching ITO's optical performance. Although ultraprecision machining can produce very finely patterned rollers, the process is slow, says Zhang. "This is one disadvantage compared to lasers," he says. Next the team will "improve the process of ultraprecision machining to make it faster, so the roller mold will be affordable to industry." Explore further: Collecting the sun's energy: Novel electrode for flexible thin-film solar cells More information: XinQuan Zhang et al. Diamond micro engraving of gravure roller mould for roll-to-roll printing of fine line electronics, Journal of Materials Processing Technology (2015). DOI: 10.1016/j.jmatprotec.2015.05.032


News Article | December 1, 2015
Site: phys.org

Dr. Komgrit Lawanwong and colleagues have engineered some subtle refinements to metal forming techniques that allowed them to prevent a difficult problem called "springback," which plagues the process of bending high-strength steel (HSS). Their results appear in the Journal of Materials Processing Technology. High-strength steel is widely used in automotive structural components to help them withstand impacts without increasing their body weight. This has potential environmental benefits, as lightweight cars burn less fuel, and therefore have lower emissions. The most serious problem in the press-forming of these steel sheets is their extremely large 'springback'—which is the tendency of a metal to return to its original shape after compression or stretching. A simple example of springback is the small gap that will remain if you fold a metal sheet in the middle with your fingers and then release it. On an industrial scale, springback causes defects when metals are press formed. "The problems become particularly acute when high-strength materials are used," Dr. Komgrit said. "So a new technique to eliminate springback is urgently needed in the stamping industry." To make a U-shaped channel, three geometrical qualities are important, he explains: a precise bending angle with no springback, a sharp corner bend, and a flat bottom. To avoid these problems, the Hiroshima group proposed a four-step process: clamping of a sheet between a punch and a counter punch; U-bending while maintaining constant clamping force; pushing up of the bottom section of the U-bend with a counter punch; and removing the sheet from the die. The new component of this process is the counterpunching. To study the effectiveness of this new technique the researchers compared it with the existing approach on 980Y steel—a high-strength metal. With the existing method, a large degree of springback was seen, and the bottom part of the U-bend remained curved. "On the other hand, the new method delivered the best result for the springback angle—almost zero—together with a flat bottom," the researchers note. "Springback is becoming more of a problem as we try to use high-strength materials in many applications," Dr. Komgrit said. "This method is a useful way to eliminate the springback of high-strength steel in press forming." Explore further: Rough times: NIST's new approach to surface profiling More information: L. Komgrit et al. Elimination of springback of high-strength steel sheet by using additional bending with counter punch, Journal of Materials Processing Technology (2016). DOI: 10.1016/j.jmatprotec.2015.08.029


News Article | February 15, 2017
Site: www.prweb.com

Canopy San Diego, Southern California's only seed-stage accelerator and investment program for technology and business infrastructure companies that support the legal cannabis industry, is pleased to announce the graduation of its inaugural accelerator program cohort. Each graduating company completed a 16-week cannabis-specific business accelerator program, designed to spur business development and prepare the companies to raise outside capital. Throughout the program, the participating companies were exposed to over 65 potential mentors, representatives from local venture firms, and key figures within the local entrepreneurial community. Additionally, Canopy San Diego hosted numerous public and private events to increase the participants’ exposure to early adopters and potential customers within the local cannabis community, as well as local early stage technology investors. The program culminated with “Demo Day,” a public event held on January 25th, which was attended by over 230 members of the San Diego entrepreneurial and cannabis communities. The event was emceed by former Heisman Trophy winner and local high school football legend Ricky Williams who played 11 seasons in the NFL (New Orleans Saints, Miami Dolphins and Baltimore Ravens) and featured a brief presentation by the Gridiron Cannabis Foundation. Each company participating in the accelerator program was given office space for up to four employees at the Canopy San Diego offices in San Diego and received $20,000 in seed capital. Four of the companies were selected to receive an additional $40,000 in follow-on funding prior to graduation. "The Canopy San Diego program was intense yet well-balanced, and gave the participants incredible access to mentors, investors, and industry contacts,” said Daniel Hopson, CEO of accelerator graduate LooseLeaf Tech. “It's like an accelerated MBA program for startups covering all topics from market research to financial projections. They even coached us on how to approach investors, and prepared us for more intensive investor due diligence efforts." The eight companies that graduated: “We are very pleased with the growth that each of the eight companies has achieved in the last four months,” said Eric Gomez, CEO of Canopy San Diego. “This is a challenging environment and we assumed there would be a distribution in performance; however, the entire cohort really came together and developed as a whole. We couldn’t be more pleased with the results.” Canopy San Diego is actively recruiting companies to participate in its spring cohort, launching in late March. Specifically, the firm is interested in early-stage technology-based companies that are developing solutions within the following sectors of the cannabis market: Agriculture Technology, Back Office Software Platforms, Certification & Standardization, Consumer Education, Data & Analytics, Digital & Social Media, Energy & Water Technology, Extraction & Processing Technology, Healthcare Technology Platforms, Packaging and Payments & Banking. Additionally, Canopy San Diego is seeking to support women-led and minority-led companies. Companies interested in applying for the spring cohort can submit an online application at http://canopysd.com/apply. Canopy San Diego is also seeking mentors and investors that are interested in being part of the Canopy team. Additional information for mentors and investors can be found on http://www.canopysd.com. About Canopy San Diego Canopy San Diego is Southern California's only seed-stage accelerator program for technology and business infrastructure companies that support the legal cannabis industry. As an accelerator, Canopy San Diego invests cash, mentorship, and services in their portfolio companies to 'accelerate' each company’s development. In return, they hold a 6-9.5% equity position in each company and their investors share in the success of the portfolio companies. As part of the greater Canopy ecosystem, along with business accelerators in Boulder and Berkeley, Canopy San Diego has a close partnership with The ArcView Group, which gives startups access to ArcView’s network of 625 investor members that have placed more than $103M million into 131 companies. Canopy San Diego does not invest in companies that directly grow or sell cannabis and its derivatives.

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