Agency: European Commission | Branch: FP7 | Program: CP | Phase: ICT-2011.3.2 | Award Amount: 13.04M | Year: 2011
Smart systems consist of heterogeneous subsystems and components providing different functionalities; they are normally implemented as Multi-Package on a Board. To fully exploit the potential of current nanoelectronics technologies, as well as to enable the integration of existing/new IPs and More than Moore devices, smart system miniaturization and Multi-Chip in a Package implementation are unavoidable. Such goals are only achievable if a flexible software platform (i.e., the SMAC platform) for smart subsystems/components design and integration is made available to designers and system integrators.\nThe platform must include methodologies and EDA tools enabling multi-disciplinary and multi-scale modeling and design, simulation of multi-domain systems, subsystems and components at all levels of abstraction, system integration and exploration for optimization of specific metrics, such as power, performance, reliability and robustness.\nKey ingredients for the construction of the SMAC platform include: (1) The development of a cosimulation and co-design environment which is aware (and thus considers) the essential features of the basic subsystems and components to be integrated. (2) The development of modeling and design techniques, methods and tools that, when added to the platform, will enable multi-domain simulation and optimization at various levels of abstraction and across different technological domains.\nThe SMAC platform will allow to successfully address the following grand challenges related to the design and manufacturing of miniaturized smart systems: (1) Development of innovative smart subsystems and components demonstrating advanced performance, ultra low power and the capability of operating under special conditions (e.g., high reliability, long lifetime). (2) Design of miniaturized and integrated smart systems with advanced functionality and performance, including nanoscale sensing systems, possibly operating autonomously and in a networked fashion
Agency: European Commission | Branch: FP7 | Program: CP | Phase: ICT-2013.3.1 | Award Amount: 5.85M | Year: 2014
Modular interposer architecture providing scalable heat removal, power delivery and communicationCarrICool will deliver a game-changing 3D packaging platform for scale-up of future, many-core, Exascale computing systems. The project will also develop a strategic supplier base in Europe for high-end HPC components and systems integration capabilities in the Exascale era. In CarrICool, advanced More-than-Moore components required to scale to energy efficient ExaFLOP computing performance will be developed and integrated into a modular and multifunctional interposer. Four critical packaging elements are implemented on the CarrICool interposer: i) Improved structural and electrical performance will be provided by expansion matching and high wiring density. ii) low thermal gradients for Beyond-CMOS and silicon photonic devices will be provided by integrated, single-phase, water-cooling cavities. iii) High granularity, distributed Buck-converters using integrated, high-quality power inductors will support energy-efficient power delivery to heterogeneous chip stacks. iv) Off-chip bandwidth will be enabled through low-cost and low-loss passive optical coupling to silicon photonic wave guides. CarrICool is targeting 2-fold improvement in heat removal, 10-fold higher voltage granularity and a 10-fold cost reduction in photonic packaging.Advanced characterization and simulation techniques will be implemented using physics-of-failure-based lifetime modelling to provide design-rules for improved system architecture. The performance of the four packaging elements of the modular interposer will be validated on three separate demonstrators and then integrated on the main CarrICool demonstrator. The CarrICool consortium pools interdisciplinary excellence, uniting ten partners from global companies (2), European SMEs (3), institutes (3) and academia (2) across seven European countries. An Advisory Board ensures the alignment of the project goals with user needs.
Agency: European Commission | Branch: FP7 | Program: CSA | Phase: ICT-2011.9.5 | Award Amount: 1.71M | Year: 2011
Guardian Angels (GA) are future zero-power, intelligent, autonomous systems-of-systems featuring sensing, computation, and communication beyond human aptitudes. GA will assist humans from their infancy to old age in complex life situations and environments. Zero-power reflects system-of-systems ability to scavenge energy in dynamic environments by disruptive harvesting techniques. The project prepares zero-power technologies based on future energy-efficient technologies, heterogeneous design, and disruptive energy scavengers.\nThree zero-power generations of GAs are foreseen: Physical Guardian Angels are zero-power, on-body networks or implantable devices that monitor vital health signals and take appropriate actions to preserve human health. Environmental Guardian Angels extend monitoring to dynamic environments, using disruptive scavengers, personalized data communication, and first thinking algorithms. They are personal assistants that protect their wearers from environment dangers. Emotional Guardian Angels are intelligent personal companions with disruptive zero-power, manmachine interfaces deployed at large scale. They sense and communicate using non-verbal languages playing an important role in health, education, and security worldwide. This project addresses the following scientific challenges for energy-efficient visionary Guardian Angel autonomous systems: (i) energy-efficient computing (down to E=10-100kT), (ii) and communication (approaching the limit of 1pJ/bit), (iii) low-power sensing, (iv) disruptive scavenging (bio-inspired, thermoelectric, etc, targeting energy densities of tens of mW/cm2), and (v) zero-power man-machine interfaces. A selection of emerging technologies based on energy efficiency is proposed. We will also develop design tools that integrate electrical, mechanical, optical, thermal, and chemical simulation tools over length and time scales currently not achievable.
Agency: European Commission | Branch: FP7 | Program: CP | Phase: ICT-2009.3.9 | Award Amount: 15.49M | Year: 2010
Best-Reliable Ambient Intelligent Nanosensor Systems e-BRAINS represent a giant leap for outstanding future applications in the area of ambient living with the ultimate need for integration of heterogeneous technologies, high-performance nanosensor devices, miniaturization, smart wireless communication and best-reliability.\ne-BRAINS with minimum volume and weight as well as reduced power consumption can be utilized in ambient living systems. Successful market entry of such innovative ambient intelligence products will be determined by the performance improvement achieved and the cost advantage in relation to the total system cost.\nThe basic requirement for robustness and reliability of the heterogeneous integration technologies and the nanosensor layers is in the focus of all e-BRAINS developments.\nThe designated nanosensor systems represent a very promising innovative approach with the potential to enable high-performance and precise functions in new products. The application of nanotechnology will allow large improvements in functionality and will open a wide range of applications for European companies.\nFuture e-BRAINS applications require significantly higher integration densities. Performance, multi-functionality and reliability of such complex heterogeneous systems will be limited mainly by the wiring between the subsystems. Suitable 3D integration technologies create a basis to overcome these drawbacks with the benefit of enabling minimal interconnection lengths. In addition to enabling high integration densities, 3D integration is a very promising cost-effective approach for the realization of heterogeneous systems.\nBesides the heterogeneous system integration the main criteria of e-BRAINS is the need for miniaturized energy storage/delivery systems, low power consumption, smart communication and methodology for reliability and robustness.\ne-BRAINS benefits from the established European 3D technology platform as major result of the IP e-CUBES.
Agency: European Commission | Branch: FP7 | Program: CSA | Phase: ICT-2009.3.1 | Award Amount: 834.12K | Year: 2010
NANO-TEC seeks to build a community of academic researchers in nanoelectronics, addressing specifically research in Beyond CMOS from the combined technology and design perspectives. A methodology for continued consultation and analysis of research needs and trends will be developed. The main activity will be a workshop series with invited experts, preceded by a methodology-contents preparation phase and subsequent analysis and documentation, both by the consortium. Apart of determining what is relevant for Beyond CMOS devices and design, benchmarking and a SWT analysis will be performed. An end-of-the-project public dissemination event will present the results of the work of NANO-TEC to stake-holders, including the EC and relevant ETPs.\nTwo elements are crucial here. One is the access to the huge expertise in Europe, albeit fragmented, in the area of Beyond CMOS both in technology and in design. The other is a platform to carry out the work and document it. The former is inherent to the consortium, although non-exclusive, as partners come mainly from institutions which have a tradition of nanofabrication for nanoelectronics research and or are members of national consortia and as such have contacts to leading researcher in Beyond CMOS Nanoelectronics. The latter is part of the long-term community-building aim and is a web-platform that will enable documents and exchanges to take place, as well a be the place where the working groups can evolve into a Specialist Interest Group on the combined ecosystems of technology and design.
Agency: European Commission | Branch: FP7 | Program: MC-ITN | Phase: FP7-PEOPLE-2011-ITN | Award Amount: 3.01M | Year: 2011
Today, more than ever, the public demands credible and understandable information about the quality of the environment in which they live or work. However, the environmental parameters monitored by commercial sensors do not give information about pollutants presence but about general state of our surroundings. Accordingly, innovative and multidisciplinary methods are needed to carry out efficient information exchange across the various sectors involved in environmental monitoring. The SENSEIVER (SENSor/transcEIVER) proposal presents a joint effort to reinforce the relevant technical bases by providing excellent training opportunities to young researchers in the following fields: (1) innovative and cost-effective sensors and their fabrication in LTCC (Low-Temperature Co-fired Ceramics) technology, (2) new sensitive materials as coating layers for unique LTCC microsensors platforms, (3) highly energy-efficient UWB (ultra wideband) transceivers compatible with designed LTCC sensors, and (4) intelligent systems for acquisition, processing and displaying data relevant to soil, air and water quality. ITN is composed of five outstanding academic/research participants, three leading industrial partners (SMEs) and three associated partners, from six countries. This training network has significant potential to improve career perspectives of 19 early-stage and 6 experienced researchers from partnering institutions and to spread expertise, knowledge and skills to wider scientific, engineering and environmental communities. Moreover, this ITN will expose all participants to complementary schools of thought that will initiate research in new areas and new topics within curriculum, giving it fresh perspective to the market oriented applications of designed materials, sensors and transceivers.
Agency: European Commission | Branch: FP7 | Program: CP-FP | Phase: EeB.NMP.2013-1 | Award Amount: 4.95M | Year: 2013
There is a vastly growing demand for increased energy efficiency, safety and improved health of the buildings we live and work in. These demands need to be addressed by a mostly SME oriented building industry, which traditionally responds sluggish to technological advancement. This is partially due to restrictive building codes, which all too often delay new developments but also because the cost and time pressure on the building sector gives SMEs not much room for technological development and the implementation of innovation. The SESBE consortium, consisting of three SMEs, four industrial and five research partners, addresses this and will provide new solutions for lightweight, energy efficient and safe faade elements. For the first time nanomaterials and nanotechnology are suggested for this type of application. It will be used as a tool to custom design functional and performance properties of faade sandwich elements for new constructions and half elements for refurbishment of existing buildings as well as a new type of sealing tape and intumescent coating for fire protection. It is highly expected, the new solutions will have a significant impact on the building sector, not only commercially and societal but also giving impulses to SMEs to invest more in innovation and to partner-up with competent research partners whenever possible. This approach could be a role model for the partnership of research, industry and SMEs in achieving the mutual goal of making housing sustainable, energy efficient, affordable, safe and healthy.
Agency: European Commission | Branch: FP7 | Program: CP | Phase: ICT-2011.3.1 | Award Amount: 5.81M | Year: 2012
For advanced nano-devices or Beyond-CMOS structures (sub-40nm transistors, SETs, graphene structures etc.) there is a deep shortage of versatile, multidomain tools capable of analysing phenomena occurring at a nanoscale. The family of AFM-based techniques provides a various nanoscale observation capabilities restricted however to dedicated, particular phenomena. Moreover, available AFM systems do not allow for easy domain-mixing as well as for combination of large distance and nanoscale positioning precision. These techniques are not useful as a in-line monitoring tools.The principle goal of the NANOHEAT project is to develop, deliver and validate a miniaturized and integrated platform which provides a multidimensional nanoprobing platform for advanced thermal analysis at the nanoscale. The multi-functional system of independently controlled AFM-based nanoprobes, equipped with dedicated (FIB functionalized) tips and actuators will allow for multi-domain diagnostics of nanoelectronic, nanophotonic and bio-electronic devices. The proposed system will allow to observe thermal, electrical (e.g. potential) or even chemical (e.g. electrochemical) properties at the nanoscale. It will also have in-line (on wafer) diagnostics capabilities.The consortium is composed of 3 R&D institutes, 4 university teams and 2 SMEs providing a mixture of a complementary expertise related to micro-engineering, design and technology of micro/nano-devices and systems, design and manufacturing of measurement and control electronics, modelling and simulation, material science and physics. Besides, four partners has an expertise and potential required for validation of the developed system for specific applications. The Coordinator, ITE is a leading Polish research centre active in the micro/nanoelectronic, micro/nano-system and photonic domains.