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Deng M.-J.,National Chung Hsing University | Tsai D.-C.,National Chung Hsing University | Ho W.-H.,Taiwan Textile Research Institute | Li C.-F.,Phoenix Silicon International Corporation | Shieu F.-S.,National Chung Hsing University
Applied Surface Science | Year: 2013

Deposited of crystalline tin (Sn) coatings on mesocarbon microbead (MCMB) powder as anodes of lithium ion (Li-ion) battery was conducted in the SnSO 4 solution by a cathodic electrochemical synthesis. The Sn-coated MCMB specimens were characterized by X-ray diffraction, scanning electron microscopy, and charge/discharge tests. The synthesis condition of Sn-coated MCMB was optimized by considering the agglomeration, size, and adhesion of the samples to the current collectors in the battery. The Sn-coated MCMB electrodes exhibit increased reversible capacity without sacrificing its cycling behavior, compared with bare MCMB electrodes. It is concluded that electrolysis-deposited Sn-coated MCMB electrodes may emerge as a practical and promising anode material for secondary Li-ion batteries. © 2013 Elsevier B.V. All rights reserved.


Chen C.-C.A.,National Taiwan University of Science and Technology | Young H.-T.,National Taiwan University | Chiou C.-H.,National Taiwan University of Science and Technology | Xue M.-Y.,National Taiwan University of Science and Technology | Pan C.-L.,Phoenix Silicon International Corporation
China Semiconductor Technology International Conference 2016, CSTIC 2016 | Year: 2016

This paper aims to study the chemical mechanical polishing (CMP) of glass wafer with effect of colloidal silica (SiO2) abrasive in different CMP process parameters. Conventional glass polishing usually adopts ceria (CeO2) abrasive due to its high material removal rate (MRR). However, with the development of 3D stacking integrated circuits (3DS-IC), the demand of glass wafer for trench-glass-via (TGV) instead of trench-silicon-via (TSV) has very tight specification of surface roughness and near-free-defects by CMP for next step of lithography process. Thus the ceria abrasive may not satisfy the surface quality as required in applications of glass wafer or TGV. The colloidal silica of SiO2 abrasive is considered because of its uniform particle size and familiar application in CMP for silicon wafer and thin film devices. In this study, viscosity and pH value of SiO2 slurry have been tested to characterize slurry properties. Some 40 × 40mm sliced substrates from 200mm (8) glass wafers have been used for polishing characteristics and evaluation of CMP process. Relationship between the process parameters, including down pressure, platen speed and slurry flow rate have been investigated. Performance of CMP tests including MRR, surface roughness and non-uniformity have been obtained for concluding the slurry performance for CMP of glass wafers. © 2016 IEEE.


Tang C.-W.,National Taiwan University | Chuang L.-C.,Aviation Safety Council | Young H.-T.,National Taiwan University | Yang M.,Phoenix Silicon International Corporation | Liao H.-C.,Phoenix Silicon International Corporation
Applied Mechanics and Materials | Year: 2012

The robust design of chemical etching parameters is dealing with the optimization of the through-silicon via (TSV) roundness error and TSV lateral etching depth in the etching of silicon for laser drilled TSVs. The considered wet chemical etching parameters comprise the HNO3 molarity, HF molarity, and etching time. Grey-Taguchi method is combining the orthogonal array design of experiments with Grey relational analysis (GRA), which enables the determination of the optimal combination of wet chemical etching parameters for multiple process responses. The concept of Grey relational analysis is to find a Grey relational grade, which can be used for the optimization conversion from a multiple objective case to a single objective case. Also, GRG is used to investigate the parameter effects to the overall quality targets. © (2012) Trans Tech Publications, Switzerland.


Tang C.-W.,National Taiwan University | Li K.-M.,National Taiwan University | Yang M.,Phoenix Silicon International Corporation | Liao H.-C.,Phoenix Silicon International Corporation | Young H.-T.,National Taiwan University
Microelectronics Reliability | Year: 2013

This study investigated the feasibility of conventional nanosecond (ns) laser drilling strategy and a new hybrid ns laser drilling strategy for the formation of through-silicon via (TSV), adopted in light-emitting-diode (LED) sub-mount application. In this research work, the most widely known technique, namely, the voltage ramp, was applied to measure the dielectric breakdown voltage of LED sub-mount with 1-μm-thick silicon dioxide deposited on TSV surface and sidewall. The greater value of dielectric breakdown field indicates the performance of better dielectric step coverage on TSV and better reliability of LED sub-mount. Experimental results show that the hybrid TSV drilling strategy represents an improvement of 623% dielectric breakdown field over conventional ns laser drilling method with the same oxidation process condition. The improved breakdown voltage relies on the obtained of smooth TSV sidewall and without wafer surface debris fabricated with the new drilling strategy. The mechanism of how the hybrid drilling strategy achieves smooth TSV sidewalls is also explained. Through this study, it has been demonstrated that with the new hybrid ns laser drilling strategy, it is feasible to achieve a spike-free TSV sidewall to ensure good dielectric step coverage by subsequent oxidation process. © 2012 Elsevier Ltd. All rights reserved.


Hsu C.-W.,National Chung Hsing University | Su F.-C.,National Chung Hsing University | Peng P.-Y.,Phoenix Silicon International Corporation | Young H.-T.,National Taiwan University | And 2 more authors.
Sensors and Actuators, B: Chemical | Year: 2016

In this study, a novel non-enzymatic glucose biosensor based on a simple photolithographic process is proposed. To fabricate the sensor, photoresist AZ-1518 was spin-coated onto a reclaimed silicon wafer, and then, a mask with a hexagonal close-packed circle array was employed for exposure and development to generate a hexagonal close-packed column array of AZ-1518. The diameter of each circle was set as 3 μm. Subsequently, a thermal melting process was employed to convert each photoresist column into a photoresist hemisphere. A gold thin film was then sputtered onto the hemisphere array of AZ-1518 to form the sensing electrode. Finally, gold nanoparticles were deposited onto the gold thin film using a self-assembly monolayer method to enhance the sensing area. Measurements showed a 10.2-fold enhancement of the sensing area in comparison with a plain gold electrode. Actual detection of glucose demonstrated that the proposed non-enzymatic glucose biosensor can operate in a linear range of 55.6 μM-13.89 mM. It had a sensitivity of 749.2 μA mM-1 cm-2 and a detection limit of 9 μM. The novel glucose biosensor proposed here has several advantages such as being enzyme free, simple to fabricate, low cost, and easy to preserve on a long-term basis. Thus, it can feasibly be used for future clinical applications. © 2016 Elsevier B.V. All rights reserved.


Hsu C.-W.,National Chung Hsing University | Su F.-C.,National Chung Hsing University | Peng P.-Y.,Phoenix Silicon International Corporation | Young H.-T.,National Chung Hsing University | And 2 more authors.
Proceedings of the ASME Design Engineering Technical Conference | Year: 2015

Diabetes is a severe public health problem globally. There are about 387 million people worldwide suffer from this medical condition. Regular detection of a diabetes patient's blood glucose is essential to maintain the blood sugar level. In this study, a novel non-enzyme glucose biosensor based on a simple lithographic process is proposed. Photoresist AZ-1518 is spinning-coated on a silicon wafer. Exposure and development using a mask with hexagonal close-packed circle array is than conducted to generate a hexagonal close-packed column array of the AZ-1518. The diameter of each circle is set as 4 μm. A thermal melting process is than employed to convert each photoresist column into a photoresist hemisphere. Finally, a gold thin film is then sputtered onto the hemisphere array of AZ-1518 to form the sensing electrode. The sensing area is measured to be enhanced by 8.8 folds. Actual glucose detections demonstrated that the proposed simple non-enzyme glucose biosensor can operate in a linear range of 2.8 mM?27.8 mM and a sensitivity of 18.7 μA mM?1cm?2. A detection limit of 9 mM (S/N = 3) was measured. The proposed novel glucose biosensor possesses advantages of enzyme free, simple fabrication process, low cost, and easy to long-Term preservation. It is feasible for future clinical applications. © Copyright 2015 by ASME.


Yang M.,Phoenix Silicon International Corporation
2013 IEEE 6th International Conference on Advanced Infocomm Technology, ICAIT 2013 | Year: 2013

This paper presents a Lithium Iron Phosphate Battery for Cloud Data Storage System and Telecom Uninterruptible Power System with the following characteristics: free of lead and sulfuric acid pollution, free of unsafe Lithium-Cobalt, very long calendar life, projected cycle life of more than 10 years, tolerant of high operating temperature, impressive high-rate charge and discharge performance, 66% lighter than lead-acid given identical capacity, compatible with existing lead-acid charger provided with the same charging voltage. These features meet the energy requirement of the cloud data storage system and telecom uninterruptible power system. © 2013 IEEE.


Patent
Phoenix Silicon International Corporation | Date: 2010-01-29

The present invention discloses a coating layer removing apparatus and a method for the same. The apparatus of the present invention comprises a transport device displacing an electrode plate; a laser device having a laser head arranged above the displacement path of the electrode plate; and a control center electrically connected to the transport device and the laser device. The method of the present invention comprises mounting an electrode plate on the transport device; using the control center to set the speed of displacing the electrode plate, and program the time interval, count and penetration depths of the laser beams; and using the device of the present invention to form exposed areas equidistantly on the electrode plate. The apparatus of the present invention automatically removes a coating layer with a laser beam without directly contacting the electrode plate. Therefore, the present invention can fast form exposed areas of high quality.


Patent
Phoenix Silicon International Corporation | Date: 2010-08-09

An intelligent power saving system, disposed between a Utility Power Supply and at least a load, comprising: at least an energy storage device; at least a power supply line, connected to said Utility Power Supply and said load; at least an energy-storage-device-parallel-connection circuit, connecting said energy storage device electrically to said power supply line; and a power monitor, connected electrically to said Utility Power Supply, said energy storage device, and said energy-storage-device-parallel-connection circuit, thus determining whether said energy storage device is required to join in providing power to said load through said energy-storage-device-parallel-connection circuit, thus regulating percentage of total power supplied by said Utility Power Supply, preventing overload of said Utility Power Supply, hereby saving expense of the electric utility bills.


Patent
Phoenix Silicon International Corporation | Date: 2010-01-22

The present invention discloses a protection structure for cutting an electrode strip, which comprises an electrode strip having at least one cutting channel; and two adhesive tapes respectively stuck to the upper and lower surfaces of the cutting channel, and which can effectively prevent from the formation of burrs and the shattering of solidified compounds in cutting the electrode strips, whereby are promoted the quality, stability and reliability of products. Further, the protection structure for cutting an electrode strip of the present invention also functions as an indicator to identify the cutting site.

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