Peregrine Semiconductor is a San Diego-based manufacturer of high-performance RF CMOS integrated circuits. The company's products are used in aerospace and defense, broadband, industrial, mobile wireless device, test and measurement equipment and wireless infrastructure markets. Peregrine's UltraCMOS technology is a proprietary implementation of silicon on sapphire and silicon on insulator substrates that enables high levels of monolithic integration. Wikipedia.
Peregrine Semiconductor | Date: 2016-03-23
Systems, methods, and apparatus for an improved body tie construction are described. The improved body tie construction is configured to have a lower resistance body tie exists when the transistor is off (Vg approximately 0 volts). When the transistor is on (Vg>Vt), the resistance to the body tie is much higher, reducing the loss of performance associated with presence of body tie. Space efficient Body tie constructions adapted for cascode configurations are also described.
Peregrine Semiconductor | Date: 2015-11-18
Systems, methods, and apparatus for an improved body tie construction that produces all the benefits of conventional body tie (H-gate, T-gate), without the limitations and degradations associated with those constructions are described. The improved body tie construction is configured to have a lower resistance body tie when the transistor is off (Vg approximately 0 volts). When the transistor is on (Vg>Vt), the resistance to the body tie is much higher, reducing the loss of performance associated with presence of body tie.
Soitec and Peregrine Semiconductor | Date: 2017-03-22
The invention relates to a structure (100) for radiofrequency applications comprising:- a monocrystalline substrate (1),- a polycrystalline silicon layer (2) directly on the monocrystalline substrate (1),- an active layer (3) on the polycrystalline silicon layer (2), intended to receive radiofrequency components,characterized in that at least a first portion (2a) of the polycrystalline silicon layer (2) extending from the interface (I) of the polycrystalline silicon layer (2) with the monocrystalline layer includes carbon and/or nitrogen atoms located at the grain boundaries of the polycrystalline silicon. The invention further relates to a process for manufacturing such a structure.
Peregrine Semiconductor | Date: 2017-01-04
A novel RF switch circuit and method for switching RF signals is described. The RF switch circuit is fabricated in a silicon-on-insulator (SOI) technology. The RF switch includes pairs of switching and shunting transistor groupings used to alternatively couple RF input signals to a common RF mode. The switching and shunting transistor grouping pairs are controlled by a switching control voltage (SW) and its inverse (SW). The switching and shunting transistor groupings comprise one or more MOSFET transistors connected together in a stacked or serial configuration. The stacking of transistor grouping devices, and associated gate resistors, increase the breakdown voltage across the series connected switch transistors and operate to improve RF switch compression. A fully integrated RF switch is described including digital control logic and a negative voltage generator integrated together with the RF switch elements. In one embodiment, the fully integrated RF switch includes a built-in oscillator, a charge pump circuit, CMOS logic circuitry, level-shifting and voltage divider circuits, and an RF buffer circuit. Several embodiments of the charge pump, level-shifting voltage divider, and RF buffer circuits are described. The inventive RF switch provides improvements in insertion loss, switch isolation, and switch compression.
Peregrine Semiconductor | Date: 2016-11-15
An apparatus for detecting an operating characteristic mismatch at an output of an amplifier by using a replica circuit is presented. In one exemplary case, a detected voltage difference at the output of the two circuits is used to drive a tuning control loop to minimize an impedance mismatch at the output of the amplifier. In another exemplary case, the replica circuit is used to detect a fault in operation in a corresponding main circuit. A method for detecting a load mismatch in a main RF circuit using the replica circuit is also presented.
Peregrine Semiconductor | Date: 2016-09-28
A method and apparatus for use in a digitally tuning a capacitor in an integrated circuit device is described. A Digitally Tuned Capacitor DTC is described which facilitates digitally controlling capacitance applied between a first and second terminal. In some embodiments, the first terminal comprises an RF+ terminal and the second terminal comprises an RF terminal. In accordance with some embodiments, the DTCs comprise a plurality of sub-circuits ordered in significance from least significant bit (LSB) to most significant bit (MSB) sub-circuits, wherein the plurality of significant bit sub-circuits are coupled together in parallel, and wherein each sub-circuit has a first node coupled to the first RF terminal, and a second node coupled to the second RF terminal. The DTCs further include an input means for receiving a digital control word, wherein the digital control word comprises bits that are similarly ordered in significance from an LSB to an MSB.
Peregrine Semiconductor | Date: 2017-02-01
An amplifier with switchable and tunable harmonic terminations and a variable impedance matching network is presented. The amplifier can adapt to different modes and different frequency bands of operation by appropriate switching and/or tuning of the harmonic terminations and/or the variable impedance matching network.
Peregrine Semiconductor | Date: 2017-02-07
An RF signal switch circuit that allows connection of any of N radio frequency (RF) input terminals to a switch output port, either in an in-circuit mode or in a bypass mode. Embodiments of the invention allow for both a single switch in the series input path while still having the ability to isolate the bypass path from an input matching network. In both modes, the circuit simultaneously exhibits low input insertion loss (and thus a low noise factor) and high bypass mode isolation.
Soitec and Peregrine Semiconductor | Date: 2016-09-14
The invention relates to a structure for radiofrequency applications comprising: a monocrystalline substrate, a polycrystalline silicon layer directly on the monocrystalline substrate, and an active layer on the polycrystalline silicon layer intended to receive radiofrequency components. At least a first portion of the polycrystalline silicon layer extending from the interface of the polycrystalline silicon layer with the monocrystalline layer includes carbon and/or nitrogen atoms located at the grain boundaries of the polycrystalline silicon at a concentration of between 2% and 20%. A process for manufacturing such a structure includes, during deposition of at least a first portion of such a polycrystalline silicon layer located at the interface with the monocrystalline substrate, depositing carbon and/or atoms in the portion.
Peregrine Semiconductor | Date: 2017-02-24
Devices and methods for improving voltage handling and/or bi-directionality of stacks of elements when connected between terminals are described. Such devices and method include use of symmetrical compensation capacitances, symmetrical series capacitors, or symmetrical sizing of the elements of the stack.