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Toronto, Canada

A wireless receiver automatic gain control system includes: a coarse amplification subsystem that receives and amplifies a carrier-modulated signal; a demodulator that generates a baseband signal from the amplified carrier-modulated signal; a fine amplification subsystem that amplifies the baseband signal; and a controller connected to the amplification subsystems. The controller: obtains a unified gain value for the amplification subsystems; based on the unified gain value, selects (i) one of a plurality of coarse gain values defining a set of coarse gain steps each spanning a plurality of unified gain steps, and (ii) one of a plurality of fine gain values defining a set of fine gain steps each spanning a single unified gain step; and sets (i) the gain of the coarse amplification subsystem to the selected coarse gain value, and (ii) the gain of the fine amplification subsystem to the selected fine gain value.

Peraso Technologies | Date: 2012-05-08

A microstrip antenna is formed on a multilayer substrate. The microstrip antenna includes a dipole formed of two dipole halves. Each of the dipole halves is formed in one of at least two layers of the multilayer substrate. Optionally, at least one passive reflector is located proximate the dipole in one of the layers, or a third layer of the substrate.

Peraso Technologies | Date: 2015-03-09

A method and apparatus for group owner (GO) renegotiation are provided. For example, the method and apparatus may be used for GO renegotiation in a wireless personal network (WPAN), for example, a 60-gigahertz (60 GHz) peer-to-peer (P2P) wireless network. The incumbent group owner (e.g., personal base station set (PBSS) control point (PCP)) controls the operation of the group. GO renegotiation can occur, for example, when a newly arriving device (e.g., a prospective group owner) is trying to connect to the PBSS and/or, for example, with PCP rearrangement among members of an existing group. As an example, after the formation of the group, the PCP may want to relinquish the role of being the PCP. A procedure is described for deciding among clients and the PCP which device will assume the role of group owner from the existing PCP in the event the role of group owner is to be reassigned.

An antenna apparatus comprises a lower assembly and an upper assembly, which together forming a cavity to contain an RF circuit device. The upper assembly comprises a waveguide flange interface at an external surface of the upper assembly. The waveguide flange interface comprises a waveguide channel extending from the external surface to an internal surface forming a surface of the cavity. An opening of the waveguide channel at the internal surface is substantially centered about a first centerline of the upper assembly parallel with the external surface and offset from a second centerline of the upper assembly parallel with the external surface, whereby the second centerline perpendicular is to the first centerline. The upper assembly is removably attachable to the lower assembly in either of a first orientation or a second orientation, whereby the second orientation represents a 180 degree rotation of the upper assembly relative to the first orientation.

Peraso Technologies | Date: 2013-04-25

An apparatus includes an IC package comprising a substrate having a first metal layer, a second metal layer, and a dielectric layer disposed between the first and second metal layers. The IC package further comprises an IC die disposed at a surface of the substrate and comprising RF circuitry. The first metal layer comprises a microstrip feedline extending from a pin of the IC die. The microstrip feedline includes a conductive trace having a probe element at a tip distal from the pin. The first metal layer further comprises a waveguide opening comprising a region surrounding the probe element, the region being substantially devoid of conductive material. The substrate further comprises a plurality of metal vias disposed at the perimeter of the region, the metal vias extending from the first metal layer to the second metal layer.

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