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Munich, Germany

OSRAM Licht AG is a multinational lighting manufacturer headquartered in Munich, Germany. It is a world-leading lighting manufacturer.OSRAM was founded in 1919 by the merger of the lighting businesses of Auergesellschaft, Siemens & Halske and Allgemeine Elektrizitäts-Gesellschaft . On 5 July 2013, OSRAM was spun off from Siemens, the listing of the stocks began on 8 July 2013 on Frankfurt Stock Exchange. Wikipedia.


Patent
Osram | Date: 2015-01-12

A headlight module comprising separate phosphors which can be excited by electromagnetic radiation to emit light, and at least one radiation source for exciting the phosphors. Each phosphor is associated with an optical device, so that light emitted by the optical devices is merged into an overall image. Beam splitter devices and beam directing devices are disposed such that electromagnetic radiation emitted by the at least one radiation source is directed on the phosphors. A control device is provided for controlling operation of the at least one radiation source and the beam directing devices.


Various embodiments relate to a drive circuit for an illumination device and an illumination device. The drive circuit includes a first drive module, wherein the first drive module is configured to convert an alternating current signal from a power supply to a constant current drive signal supplied to a light-emitting unit of the illumination device, and wherein the drive circuit further includes a second drive module, and wherein the second drive module is in series connection with the first drive module and the light-emitting unit and is configured to hold a voltage which is applied across the second drive module by the constant current drive signal, and the second drive module further includes a first switch means which is driven by the held voltage to turn on such that a current signal output from the second drive module is a direct current signal.


Various embodiments may relate to a lens couplable to a light radiation source, e.g. a LED source, so as to be traversed by the light radiation produced by the latter. The lens includes, embedded in the lens itself, at least one electrically conductive line adapted to enable the electrical supply of the light radiation source.


A method for producing a thin-film semiconductor body is provided. A growth substrate is provided. A semiconductor layer with funnel-shaped and/or inverted pyramid-shaped recesses is epitaxially grown onto the growth substrate. The recesses are filled with a semiconductor material in such a way that pyramid-shaped outcoupling structures arise. A semiconductor layer sequence with an active layer is applied on the outcoupled structures. The active layer is suitable for generating electromagnetic radiation. A carrier is applied onto the semiconductor layer sequence. At least the semiconductor layer with the funnel-shaped and/or inverted pyramid-shaped recesses is detached, such that the pyramid-shaped outcoupling structures are configured as projections on a radiation exit face of the thin-film semiconductor.


Grant
Agency: Cordis | Branch: H2020 | Program: RIA | Phase: ICT-29-2014 | Award Amount: 3.99M | Year: 2015

LEO ambitions innovative manufacturing concept & routes towards high performance bendable and low cost OLEDs for general and mood lighting, merging conventional and proven technologies with disruptive approaches (e.g. substrate, architecture, hybrid processing, layouts). R&D activities will be ramped-up from lab scale feasibility to pilot line scale demonstration, delivering show off lighting systems with the help of external lighting manufacturers (Artemide, Technology Luminaires). The project targets the introduction of novel materials combinations (conformable & functionalized metallic substrate, Indium free electrodes and solution-processable organic materials) in large area colour tuneable top emission white OLEDs. Besides dry processing of large area tandem stacks (> 500 cm2), a novel hybrid process flow will be set-up whereby stacks will be wet processed up to the 1st emitting layer prior device completion by dry processing. With common and innovative building blocks (substrate with integrated interconnecting, 80 % transparent top electrode, 1E-6 g/m/day WVTR scratch resistant thin film encapsulation, 50 % out-coupling efficiency), these two complementary approaches will lead to demonstrations of large area warm/cold white macro-pixels and hybrid full colours RGB OLEDs. LEO will address cost reduction at materials and process levels which represent more than 80% of the total cost of OLED lighting devices, according to a recent study. Leverage will be sought at mostly all layers of the stack with cost impacts at materials, device and system scales. In order to combine necessary and complementary capacities to reach its ambitious goals, LEO has gathered all stakeholders of the OLED lighting device fabrication value chain (except equipment supplier), including substrate and organic materials suppliers (AC&CS, Cynora), an OLED manufacturer (OSRAM) and recognized research centres in the field of OLEDs and life cycle analysis (CEA, CNR, Gaiker).

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