Billerica, MA, United States
Billerica, MA, United States

Orbotech Ltd. is an international developer and producer of automated optical inspection and related imaging and computer-aided manufacturing systems. The company's imaging tools are used in the manufacturing of printed circuit board, flat panel displays, and IC packaging, among other applications. These systems aid manufacturers by providing highly accurate, high-speed, and automated optical inspection, allowing faster production speeds with less waste and at lower cost. The company is headquartered in Yavne, Israel and operates in North America, Europe, Japan and Asia-Pacific. Wikipedia.

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Patent
Orbotech | Date: 2015-08-02

Printing apparatus (20) includes a donor supply assembly (30), which provides a transparent donor substrate (26) having opposing first and second surfaces and a donor film formed on the second surface so as to position the donor film in proximity a target area (28) on an acceptor substrate (22). An optical assembly (24) directs multiple output beams of laser radiation simultaneously in a predefmed spatial pattern to pass through the first surface of the donor substrate and impinge on the donor film so as to induce ejection of material from the donor film onto the acceptor substrate according, thereby writing the predefined pattern onto the target area of the acceptor substrate.


Patent
Orbotech | Date: 2017-03-15

A method for manufacturing includes coating a substrate (22) with a matrix (28) containing a material to be patterned on the substrate. A pattern is fixed in the matrix by directing a pulsed energy beam to impinge on a locus of the pattern so as to cause adhesion of the material to the substrate along the pattern without fully sintering the material in the pattern. The matrix remaining on the substrate outside the fixed pattern is removed, and after removing the matrix, the material in the pattern is sintered.


Patent
Orbotech | Date: 2017-06-14

Printing apparatus (20) includes a donor supply assembly (30), which provides a transparent donor substrate (26) having opposing first and second surfaces and a donor film formed on the second surface so as to position the donor film in proximity to a target area (28) on an acceptor substrate (22). An optical assembly (24) directs multiple output beams of laser radiation simultaneously in a predefined spatial pattern to pass through the first surface of the donor substrate and impinge on the donor film so as to induce ejection of material from the donor film onto the acceptor substrate according, thereby writing the predefined pattern onto the target area of the acceptor substrate.


Patent
Orbotech | Date: 2015-04-05

A method for manufacturing includes coating a substrate (22) with a matrix (28) containing a material to be patterned on the substrate. A pattern is fixed in the matrix by directing a pulsed energy beam to impinge on a locus of the pattern so as to cause adhesion of the material to the substrate along the pattern without fully sintering the material in the pattern. The matrix remaining on the substrate outside the fixed pattern is removed, and after removing the matrix, the material in the pattern is sintered.


Patent
Orbotech and In & Co Systems | Date: 2017-10-04

A beam-forming optical system comprising:an illumination unit (100) comprising a plurality of light sources (50) configured to emit a plurality of beams (65), the plurality of light sources (50) comprising at least four laser diodes;an optical arrangement (60) configured to transmit all of the plurality of beams (65) onto anacoustic optical modulator (AOM) (70);the AOM positioned to receive all of the plurality of beams (65) transmitted by the optical arrangement (60) and configured to modulate all of the plurality of beams (65) incident thereon.


Grant
Agency: European Commission | Branch: H2020 | Program: RIA | Phase: FOF-13-2016 | Award Amount: 3.76M | Year: 2016

HIPERLAM is an SME driven Research and Innovation Action (RIA) well-aligned to the Factories of the Future (FoF) Initiative with a strong emphasis upon demonstrating superior cost and speed performance in end-to-end processes featuring laser-based additive manufacturing in two key applications requiring high resolution printed conductive metallic lines, namely laser printed RFID antenna and laser printed Fingerprint sensors. Existing subtractive top-down process will be replaced by HIPERLAMs additive process for both Applications. Process maps illustrate the existing multiple processing steps compared to HIPERLAMs significantly fewer steps. Real-time diagnostics are included and Modelling investigations will be undertaken to support optimisation. The promise of HIPERLAMs high resolution laser based additive manufacturing solutions is to transform the manufacturing processing speed by 10x for laser printed RFID antenna (Application 1) and 5x in the case of the lead-time for laser printed fingerprint sensor design (Application 2). Similarly, HIPERLAM promises to reduce costs by 20x and 50% respectively for Application 1 and Application 2. HIPERLAM features high resolution LIFT Printing and Laser Sintering utilising novel high viscous inks to achieve printed conductive metallic structures down to 10 m resolution over large areas (10 to 1000 cm2) suitable for scale-up to full production. The targeted applications address global market needs and will support mainstream adoption of AM processes in EU industry by displacing existing processes with smart, flexible, digitally enabled manufacturing technology. HIPERLAM business cases promise significant revenue growth in both application spaces and in the potential for consortium partners to establish themselves in pre-eminent positions in high resolution, low cost, high throughput AM technology.


Patent
In & Co Systems and Orbotech | Date: 2015-01-23

A direct imaging system comprises an illumination unit comprising a plurality of light sources, the plurality of light sources configured to emit a plurality of beams, an optical system for forming the plurality of beams to be aligned in position or angle, an acoustic optical modulator positioned to receive the plurality of beams aligned in one of position or angle and to consecutively diffract different portions of the plurality of beams as an acoustic wave propagates in an acoustic direction, and a scanning element adapted to scan an exposure plane with the plurality of beams modulated by the acoustic optical modulator at a scanning velocity, wherein the scanning velocity is selected to incoherently unite the different portions of the plurality of beams into a single exposure spot.


An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.


Grant
Agency: European Commission | Branch: H2020 | Program: IA | Phase: NMP-04-2014 | Award Amount: 7.89M | Year: 2015

The EU is well placed to exploit printed electronic technologies to create greater economic and social benefits for the EU, but only if we are able to commercialise innovative technologies created within the EU. Ink jet printing technologies are at the forefront of printed electronic developments. However, Ink jet printing has only been able to achieve a resolution of >=10um and the viscosity of printable inks is limited to <40 centipoise, this further limits the solids content of inks to <30-Vol% and the size of the nano-fillers to <50nm typically. These factors limit the range of functional inks that can be printed as well as the resolution and final properties of the resultant printed/sintered structures and components. The HI-RESPONSE project is based on highly innovative, patented Electro-static printing technology (ESJET) that has already been proven on TRL 4 to print to a resolution of 1um and be able to print inks with a viscosity of up to 40.000 cP. The resultant printed/sintered structures will therefore be able to achieve a high resolution and increase final component properties through enabling the printing of highly filled nano-inks and functional organic materials. This technology will be further developed to TRL 6 within the project to allow for the design and assembly of a multi-head system that can achieve resolution, speeds and cost that far surpassed that of current ink-jet systems. The resultant system will be demonstrated at TRL 6 for a wide range of materials, including: nano-Cu and nano-ceramic filled inks and organic polymers. Each of these materials will be printed to create components specifically defined and specified by the industrial organisations within the consortium: Infineon, Ficosa, Piher (Meggitt) and Zytronic. The specific end-user defined applications are: Automotive aerials and sensors, metal meshed for OLED and touch screens, conductive through silicon vias and mechanical strengthening ribs for thin Si-wafers.


Grant
Agency: European Commission | Branch: H2020 | Program: IA | Phase: ICT-03-2014 | Award Amount: 9.73M | Year: 2015

General X-ray image sensing is undergoing a major transition away from analog solutions towards Direct Radiography using digital Flat-Panel Detector (FPD) technology, offering immediate imaging, large productivity, lower dose and portability. LORIX will develop, prototype and demonstrate large area X-ray FPD detectors enabled by TOLAE technology by combining a printed Organic Photo Diode (OPD) with existing Thin Film Transistors active matrices (TFT), in security, health and Non Destructive Testing applications. LORIX will consider two complementary technology routes for effective market introduction: - The short term (2020), low risk route, based on Organic Detector On Glass (oDOG) concept, integrates printed OPD layer on a-Si active matrix on glass, used for displays. This will result in highly competitive organic FPDs with higher performance at lower manufacturing cost. - The medium (2022) term route, relying on Organic Detector On Foil (oDOF) concept, integrates a printed OPD on an organic TFT active matrix on foil. This full organic sensor on foil with improved mechanical robustness and lightweight will enable an easier penetration into nomadic X-ray markets and later will pave the way for dynamic, curved and flexible image sensors. LORIX partners are complementary and cover the full TOLAE value chain: material supplier, equipment manufacturers, companies & research organisations for OPD & OTFT design & integration, companies for production of sensors and full systems. Major OLAE European pilot facilities, PICTIC in Grenoble, Plastic Logic in UK & Germany, will be used for effective industrial exploitation of the products in Europe. Entering an existing business, LORIX will have direct access to end users in the targeted applications. LORIX innovations will strengthen the European industries leadership on X-ray market and will contribute to build a complete value chain with manufacturing capabilities in Europe for large area organic sensors applications.

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