Orbotech Ltd. is an international developer and producer of automated optical inspection and related imaging and computer-aided manufacturing systems. The company's imaging tools are used in the manufacturing of printed circuit board, flat panel displays, and IC packaging, among other applications. These systems aid manufacturers by providing highly accurate, high-speed, and automated optical inspection, allowing faster production speeds with less waste and at lower cost. The company is headquartered in Yavne, Israel and operates in North America, Europe, Japan and Asia-Pacific. Wikipedia.
Orbotech | Date: 2014-07-28
A distance measuring system is provided for auto focusing a camera of an inspection system for inspecting a planar surface that is patterned. The system includes a pattern generator, an image sensor, an optical element(s) and a processor. The pattern generator projects a spatially random pattern toward the planar surface at an oblique angle. The optical element(s) forms the image of the reflected pattern on the image sensor and the image sensor captures an image of the spatially random pattern reflected off the planar surface. The processor processes the image of the spatially random pattern and provides auto-focus information.
Orbotech | Date: 2014-04-07
An optical inspection system including a first multiplicity of cameras operative to image a second multiplicity of regions on an object, a third multiplicity of illumination sources and at least one illumination manager operative to combine illumination from the third multiplicity of illumination sources and thereafter to direct illumination therefrom to the second multiplicity of regions, the at least one illumination manager including a beam distributor receiving a composite input beam of a multiplicity of non-mutually coherent, spatially concentrated laser pulses and directing a multiplicity of composite output beams of a plurality of the non-mutually coherent, spatially concentrated laser pulses to a corresponding plurality of spatially distinct locations corresponding to the second multiplicity of regions.
Agency: European Commission | Branch: H2020 | Program: RIA | Phase: FOF-13-2016 | Award Amount: 3.76M | Year: 2016
HIPERLAM is an SME driven Research and Innovation Action (RIA) well-aligned to the Factories of the Future (FoF) Initiative with a strong emphasis upon demonstrating superior cost and speed performance in end-to-end processes featuring laser-based additive manufacturing in two key applications requiring high resolution printed conductive metallic lines, namely laser printed RFID antenna and laser printed Fingerprint sensors. Existing subtractive top-down process will be replaced by HIPERLAMs additive process for both Applications. Process maps illustrate the existing multiple processing steps compared to HIPERLAMs significantly fewer steps. Real-time diagnostics are included and Modelling investigations will be undertaken to support optimisation. The promise of HIPERLAMs high resolution laser based additive manufacturing solutions is to transform the manufacturing processing speed by 10x for laser printed RFID antenna (Application 1) and 5x in the case of the lead-time for laser printed fingerprint sensor design (Application 2). Similarly, HIPERLAM promises to reduce costs by 20x and 50% respectively for Application 1 and Application 2. HIPERLAM features high resolution LIFT Printing and Laser Sintering utilising novel high viscous inks to achieve printed conductive metallic structures down to 10 m resolution over large areas (10 to 1000 cm2) suitable for scale-up to full production. The targeted applications address global market needs and will support mainstream adoption of AM processes in EU industry by displacing existing processes with smart, flexible, digitally enabled manufacturing technology. HIPERLAM business cases promise significant revenue growth in both application spaces and in the potential for consortium partners to establish themselves in pre-eminent positions in high resolution, low cost, high throughput AM technology.
In & Co Systems and Orbotech | Date: 2015-01-23
A direct imaging system comprises an illumination unit comprising a plurality of light sources, the plurality of light sources configured to emit a plurality of beams, an optical system for forming the plurality of beams to be aligned in position or angle, an acoustic optical modulator positioned to receive the plurality of beams aligned in one of position or angle and to consecutively diffract different portions of the plurality of beams as an acoustic wave propagates in an acoustic direction, and a scanning element adapted to scan an exposure plane with the plurality of beams modulated by the acoustic optical modulator at a scanning velocity, wherein the scanning velocity is selected to incoherently unite the different portions of the plurality of beams into a single exposure spot.
Orbotech | Date: 2015-12-10
An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.
Agency: European Commission | Branch: FP7 | Program: CP | Phase: FoF-ICT-2011.7.2 | Award Amount: 11.64M | Year: 2012
Organic Electroluminescence (OLED) is the most promising technology to deliver flexible, thin, light weight, power efficient and environment-friendly light sources. Currently glass based OLED devices are slowly entering the market place, opening new possibilities for lighting solutions. By adding flexibility and robustness at a lower price point, flexible OLEDs will change the lighting industry and revolution the way we all experience lighting.\n\nThe introduction of flexible OLED lighting is hampered by a lack of reliable series production technologies, flexible OLEDs exist in the lab but not yet in the fab. Roll-to-roll (R2R) manufacturing of these devices is seen by many as the future cost-efficient manufacturing technology for flexible OLEDs. However, complete roll to roll manufacturing of flexible OLED is still years away and will not be able to bring flexible OLEDs to the market place within 10 years.\n\nThe overall objective of the Flex-o-Fab project is the demonstration of a reliable manufacturing process for OLED lighting foils enabling market introduction within 3 years after the end of the project.\n\nFlex-o-Fab will take existing technologies in use for the manufacturing of glass based bottom emissive small molecule OLEDs and use these as a basis to develop a pilot series manufacturing process for flexible OLEDs. By doing so, the project will be allowed to focus on the roadblocks and bridge the gap between sheet-to-sheet (S2S) produced glass OLEDs and the future envisioned complete R2R lighting foils.\n\nFlex-o-Fab will strengthen and expand the leading position of the European lighting industry by making the shift from lab to fab and make flexible OLED devices an industrial reality. Furthermore, the new sustainable disruptive technologies will create long-term European manufacturing jobs due to their high degree of technical novelty and specialization. Finally, the intellectual property generated will protect these advances from Asian and US competition.
Agency: European Commission | Branch: FP7 | Program: CP-IP | Phase: NMP.2011.1.4-2 | Award Amount: 10.43M | Year: 2012
While nanotechnology was originally limited to small areas of a few cm2, the quest for lower costs has been the latest years the drive for developing processes utilising larger substrate sizes at increasing throughputs. A typical example is the flat panel display industry where the push to larger gen size and faster processing has resulted in a significant cost reduction. The next challenge here is the move to smaller feature sizes. Large area processing at high speeds is optimal when using roll-to-roll (R2R) processing, able to deliver the ultimate cost reduction. Flexible innovative thin film devices, like organic light emitting diodes (OLEDs) for lighting, photo voltaic (PV) and organic photo voltaic (OPV) modules, organic circuitry, printed electronics and thin film batteries, are currently developed using this kind of processing. The overall objective of Clean4Yield is the development and demonstration of technologies and tools for nano-scale detection, cleaning, prevention and repair of defects and contaminations in nano-scale layers. The R2R production processes for OLED, OPV, and high-end moisture barrier layers on flexible substrates will serve as development platform for the various methods. Clean4Yield will demonstrate that the developed methods increase yield, reduce production costs, and improve performance and operational device lifetimes of these applications. The developed technologies will be easy to adapted for other large-scale production technologies of other nano layer applications.
Agency: European Commission | Branch: H2020 | Program: IA | Phase: NMP-04-2014 | Award Amount: 7.89M | Year: 2015
The EU is well placed to exploit printed electronic technologies to create greater economic and social benefits for the EU, but only if we are able to commercialise innovative technologies created within the EU. Ink jet printing technologies are at the forefront of printed electronic developments. However, Ink jet printing has only been able to achieve a resolution of >=10um and the viscosity of printable inks is limited to <40 centipoise, this further limits the solids content of inks to <30-Vol% and the size of the nano-fillers to <50nm typically. These factors limit the range of functional inks that can be printed as well as the resolution and final properties of the resultant printed/sintered structures and components. The HI-RESPONSE project is based on highly innovative, patented Electro-static printing technology (ESJET) that has already been proven on TRL 4 to print to a resolution of 1um and be able to print inks with a viscosity of up to 40.000 cP. The resultant printed/sintered structures will therefore be able to achieve a high resolution and increase final component properties through enabling the printing of highly filled nano-inks and functional organic materials. This technology will be further developed to TRL 6 within the project to allow for the design and assembly of a multi-head system that can achieve resolution, speeds and cost that far surpassed that of current ink-jet systems. The resultant system will be demonstrated at TRL 6 for a wide range of materials, including: nano-Cu and nano-ceramic filled inks and organic polymers. Each of these materials will be printed to create components specifically defined and specified by the industrial organisations within the consortium: Infineon, Ficosa, Piher (Meggitt) and Zytronic. The specific end-user defined applications are: Automotive aerials and sensors, metal meshed for OLED and touch screens, conductive through silicon vias and mechanical strengthening ribs for thin Si-wafers.
Agency: European Commission | Branch: H2020 | Program: IA | Phase: ICT-03-2014 | Award Amount: 9.73M | Year: 2015
General X-ray image sensing is undergoing a major transition away from analog solutions towards Direct Radiography using digital Flat-Panel Detector (FPD) technology, offering immediate imaging, large productivity, lower dose and portability. LORIX will develop, prototype and demonstrate large area X-ray FPD detectors enabled by TOLAE technology by combining a printed Organic Photo Diode (OPD) with existing Thin Film Transistors active matrices (TFT), in security, health and Non Destructive Testing applications. LORIX will consider two complementary technology routes for effective market introduction: - The short term (2020), low risk route, based on Organic Detector On Glass (oDOG) concept, integrates printed OPD layer on a-Si active matrix on glass, used for displays. This will result in highly competitive organic FPDs with higher performance at lower manufacturing cost. - The medium (2022) term route, relying on Organic Detector On Foil (oDOF) concept, integrates a printed OPD on an organic TFT active matrix on foil. This full organic sensor on foil with improved mechanical robustness and lightweight will enable an easier penetration into nomadic X-ray markets and later will pave the way for dynamic, curved and flexible image sensors. LORIX partners are complementary and cover the full TOLAE value chain: material supplier, equipment manufacturers, companies & research organisations for OPD & OTFT design & integration, companies for production of sensors and full systems. Major OLAE European pilot facilities, PICTIC in Grenoble, Plastic Logic in UK & Germany, will be used for effective industrial exploitation of the products in Europe. Entering an existing business, LORIX will have direct access to end users in the targeted applications. LORIX innovations will strengthen the European industries leadership on X-ray market and will contribute to build a complete value chain with manufacturing capabilities in Europe for large area organic sensors applications.
Orbotech | Date: 2014-02-18
A method for manufacturing includes coating a substrate (22) with a matrix (28) containing a material to be patterned on the substrate. A pattern (42) is fixed in the matrix by directing an energy beam to impinge on the coated substrate so as to fix the pattern in the matrix without fully sintering the pattern. The matrix remaining on the substrate outside the fixed pattern is removed, and after removing the matrix, the material in the pattern is sintered.