Tsurumi ku, Japan
Tsurumi ku, Japan

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Patent
Okuno Chemical Industries Co. | Date: 2015-06-15

An object is to provide a novel composition for blackening treatment that can sufficiently blacken copper circuits of printed wiring boards, circuits made of silver paste, and other various articles containing a copper-based metal, such as copper or a copper alloy, or a silver-based metal, such as silver or a silver alloy, without impairing the smoothness of the copper-based metal or silver-based metal. A composition is provided for blackening treatment of a copper-based metal or a silver-based metal, the composition comprising an aqueous solution containing:


Patent
Toyota Jidosha Kabushiki Kaisha and Okuno Chemical Industries Co. | Date: 2010-09-14

A production method of an electroless plating material of the present invention is a method for the production of an electroless plating material that has a surface to be plated by electroless plating, and includes an ozone treatment step in which a material body that is made of a resin is brought into contact with a solution that contains ozone to form a modified layer in a surface of the material body, and a superficial layer removal step in which, after the ozone treatment step, the surface of the material body is irradiated with ultraviolet rays to remove a superficial layer of the modified layer.


Patent
Okuno Chemical Industries Co. | Date: 2013-04-18

The present invention provides a blackening treatment method for a black CrCo alloy plating film, the method comprising bringing a black CrCo alloy plating film having a Cr content of 1 to 15 wt. % into contact with a blackening treatment solution comprising an aqueous solution with a pH value of 1 to 5. According to the present invention, the blackish color of a less blackish plating film formed from a plating bath containing trivalent chromium is enhanced to further improve decorativeness. Furthermore, the corrosion resistance of the film can be more improved by performing electrolytic chromate treatment after blackening treatment.


Patent
Okuno Chemical Industries Co. | Date: 2013-12-17

This invention relates to a conductive-coating bath comprising an aqueous solution containing (A) a copper compound, (B) a complexing agent, (C) an alkali metal hydroxide, (D) a C_(2-5 )aliphatic polyalcohol compound, and (E) at least one compound selected from the group consisting of reducing compounds having a COOM group, wherein M is hydrogen, an alkali metal, or a NH_(4 )group, and reducing saccharides having six or more carbon atoms. The present invention provides a composition for forming a conductive coating having excellent properties as a base layer for electroplating, which is effectively used to form a uniform decorative coating having excellent appearance by electroplating on a non-conductive plastic molding.


The present invention provides a pretreatment process for electroless plating of a resin molded article, comprising etching the resin molded article using a manganate salt-containing etching solution, and then bringing the resin molded article into contact with an aqueous solution containing a reducing compound and an inorganic acid; and a plating process of a resin molded article comprising the pretreatment process. Further, the present invention provides various treatment agents for use in the plating process. According to the present invention, a plating layer with sufficient adhesion can be formed when an etching treatment is performed using a manganate salt-containing etching solution in an electroless plating treatment of a resin molded article.


Patent
Okuno Chemical Industries Co. | Date: 2015-10-28

The present invention provides a composition for etching treatment of a resin material, the composition comprising an aqueous solution having a permanganate ion concentration of 0.2 mmol/L or more and a total acid concentration of 10 mol/L or more, and the aqueous solution satisfying at least one of the following conditions (1) to (3):(1) containing an organic sulfonic acid in an amount of 1.5 mol/L or more,(2) setting the divalent manganese ion molar concentration to 15 or more times higher than the permanganate ion molar concentration, and(3) setting the addition amount of an anhydrous magnesium salt to 0.1 to 1 mol/L. The composition for etching treatment of the present invention is a composition containing no hexavalent chromium and having excellent etching performance and good bath stability.


Patent
Okuno Chemical Industries Co. | Date: 2014-11-18

An object of the present invention is to provide a novel conductive film-forming bath comprising an alkaline aqueous solution that can be used to form a film by electroplating on a non-conductive plastic material, the conductive film-forming bath being capable of forming a film by electroplating that has an excellent appearance and that does not suffer from reduced adhesiveness with respect to a non-conductive plastic material. The present invention relates to a conductive film-forming bath comprising an aqueous solution containing a copper compound, a complexinq agent, an alkali metal hydroxide, and a water-soluble polymer having a polyoxyalkylene structure.


Patent
Okuno Chemical Industries Co. | Date: 2014-10-16

The present invention provides a composition for etching treatment of a resin material, the composition comprising an aqueous solution having a permanganate ion concentration of 0.2 mmol/L or more and a total acid concentration of 10 mol/L or more, and the aqueous solution satisfying at least one of the following conditions (1) to (3): (1) containing an organic sulfonic acid in an amount of 1.5 mol/L or more, (2) setting the divalent manganese ion molar concentration to 15 or more times higher than the permanganate ion molar concentration, and(3) setting the addition amount of an anhydrous magnesium salt to 0.1 to 1 mol/L. The composition for etching treatment of the present invention is a composition containing no hexavalent chromium and having excellent etching performance and good bath stability.


Patent
Okuno Chemical Industries Co. | Date: 2016-09-21

An object of the present invention is to provide a novel conductive film-forming bath comprising an alkaline aqueous solution that can be used to form a film by electroplating on a non-conductive plastic material, the conductive film-forming bath being capable of forming a film by electroplating that has an excellent appearance and that does not suffer from reduced adhesiveness with respect to a non-conductive plastic material. The present invention relates to a conductive film-forming bath comprising an aqueous solution containing a copper compound, a complexing agent, an alkali metal hydroxide, and a water-soluble polymer having a polyoxyalkylene structure.


Patent
Okuno Chemical Industries Co. | Date: 2015-10-28

This invention relates to a conductive-coating bath comprising an aqueous solution containing (A) a copper compound, (B) a complexing agent, (C) an alkali metal hydroxide, (D) a C_(2-5) aliphatic polyalcohol compound, and (E) at least one compound selected from the group consisting of reducing compounds having a -COOM group, wherein M is hydrogen, an alkali metal, or a -NH_(4) group, and reducing saccharides having six or more carbon atoms. The present invention provides a composition for forming a conductive coating having excellent properties as a base layer for electroplating, which is effectively used to form a uniform decorative coating having excellent appearance by electroplating on a non-conductive plastic molding.

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