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Bazu M.,IMT Bucharest | Ilian V.E.,IMT Bucharest | Varsescu D.,IMT Bucharest | Galateanu L.,IMT Bucharest | And 4 more authors.
European Solid-State Device Research Conference | Year: 2013

A procedure of reliability testing for discriminating between various technological variants is described. This procedure is used for choosing the most reliable variant of QFN packaging, the competitors being the conventional oven curing against three variants of microwave curing. The results, based on failure analysis and statistical processing of data, clearly show that the best choice is one of the variants of microwave curing. © 2013 IEEE. Source

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