Agency: European Commission | Branch: FP7 | Program: CP | Phase: ICT-2013.3.2 | Award Amount: 10.08M | Year: 2013
ACTPHAST is a unique one-stop-shop European access centre for photonics innovation solutions and technology support (Access CenTre for PHotonics innovAtion Solutions and Technology support). ACTPHAST will support and accelerate the innovation capacity of European SMEs by providing them with direct access to the expertise and state-of-the-art facilities of Europes leading photonics research centres, enabling companies to exploit the tremendous commercial potential of applied photonics. Technologies available within the consortium range from fibre optics and micro optics, to highly integrated photonic platforms, with capabilities extending from design through to full system prototyping. ACTPHAST has been geographically configured to ensure all of Europes SMEs can avail of timely, cost-effective, and investment-free photonics innovation support, and that the extensive range of capabilities within the consortium will impact across a wide range of industrial sectors, from communications to consumer-related products, biotechnology to medical devices. The access of predominantly SMEs to top-level experts and leading photonics technology platforms provided by the ACTPHAST consortium will be realised through focused innovation projects executed in relatively short timeframes with a critical mass of suitably qualified companies with high potential product concepts. As a result of these projects, the programme is expected to deliver a substantial increase in the revenues and employment numbers of the supported companies by supporting the development of new product opportunities and addressing emerging markets. Furthermore, through its extensive outreach activities, the programme will ensure there is an increased level of awareness and understanding across European industries of the technological and commercial potential of photonics.
Agency: European Commission | Branch: FP7 | Program: CP | Phase: ICT-2013.3.2 | Award Amount: 3.88M | Year: 2014
PHASTFLEX proposes the development of a fully automated, high precision, cost-effective assembly technology for next generation hybrid photonic packages. In hybrid packages, multiple Photonic ICs (PICs) are assembled, combining the best of different material platforms for a wide range of applications and performance. In PHASTFlex, InP PICs with active functions are combined with passive TriPleX PICs.PIC fabrication can now be done in a generic foundry-based process, bringing PIC cost within the scope of many applications (~10-100). However, current assembly and packaging technology leads to custom-engineered solutions; packaging is an order of magnitude more expensive, and this, is a major bottle-neck to market penetration. The EU Photonics21s SRA calls new approaches to packaging a key challenge.The most demanding assembly task for multi-port PICs is the high-precision (0.1m) alignment and fixing of waveguides. PHASTFlex proposes an innovative concept, in which the waveguides in the TriPleX PIC are released during fabrication to make them movable. Actuators and fixing functions, integrated in the same PIC, place and fix the flexible waveguides in the optimal position (peak out-coupled power).The project aims to develop a complete assembly process and tooling to implement this concept, including pre-assembly using solder reflow and automated handling, and on-chip micro-fabricated fine-alignment and fixing functions. Fully automated cost-effective and high-performance solutions will also encourage photonic packaging to be carried out in EU economies. Proof of the concept will be given by assembly of prototypes for end-user applications.The consortium consists of 9 partners (7 industrial, of which 2 provide applications, 2 are universities), and are all recognised leading industrial and research entities in the photonics components and systems industry. The project duration is 36 months, the total cost is ~3.9M, the requested EU contribution is ~2.8M
Oclaro | Date: 2013-08-07
Optical devices are disclosed consisting of optical chips (planar lightwave circuits) which have optically symmetric or matching designs and properties and optical components which create asymmetry in the optical devices. The devices find application in detection in coherent and non-coherent optical communications systems.
Oclaro | Date: 2013-06-18
An assembly includes an etalon assembly for dynamically locking a frequency of an optical beam to a set frequency, the etalon assembly being external to a laser source assembly that outputs the optical beam. The etalon assembly includes an etalon that receives the optical beam and generates via interference effects a transmission beam, the etalon having a thermal tuning range greater than one half of a free spectral range of the etalon. The etalon assembly also includes an etalon heater mounted to the etalon such that the etalon heater is configured to adjust the temperature of the etalon. The assembly includes a controller configured to retrieve calibration data based on the set frequency, calculate a set temperature for the etalon using a thermal tuning algorithm and the calibration data, and control the etalon heater such that the etalon has a temperature equal to the calculated set temperature.
Oclaro | Date: 2013-11-29
An optical switch for performing high extinction ratio switching of an optical signal includes a beam polarizing element and one or more optical elements. The optical elements are configured to direct an optical signal along a first or second optical path based on the polarization state of the optical signal as it passes through the optical elements. The optical switch performs high extinction ratio switching of the optical signal by preventing unwanted optical energy from entering an output port by using an absorptive or reflective optical element or by directing the unwanted optical energy along a different optical path.
Oclaro | Date: 2014-09-08
A monolithically integrated, tunable semiconductor laser with an optical waveguide, comprising a laser chip having epitaxial layers on a substrate and having first and second reflectors bounding an optical gain section and a passive section, wherein at least one of the reflectors is a distributed Bragg reflector section comprising a grating and configured to have a tunable reflection spectrum, wherein the laser is provided with a common earth electrode, wherein control electrodes are provided on the optical waveguide in at least the optical gain section and the at least one distributed Bragg reflector section, wherein the passive section is provided with an electrode or electrical tracking on the optical waveguide, the passive section is configured not to be drivable by an electrical control signal, and no grating is present within the passive section.
Oclaro | Date: 2014-09-10
A Bragg grating has a local reflection strength which varies with position along the length of the grating so as to generate a non-uniform wavelength reflection spectrum, enabling compensation for a non-uniform gain profile of the gain section of a tunable laser. In another aspect, a Bragg comb grating is modulated by an envelope function which can also compensate for a non-uniform gain profile. The comb grating may be a phase change grating, with the envelope function shape being controlled by the length between phase changes and/or size of the phase changes.
Oclaro | Date: 2015-03-05
Methods and apparatus for use in coherent transmission and reception of optical data signals. An integrated optics block (100) for use in a coherent optical transmitter comprising: a beam splitter (102) configured to split an input light signal into first and second input light signals, to output the first input light signal for use in an optical transmitter chip and to output the second input light signal for use as a local oscillator signal; a polarisation combiner (104) configured to combine first and second received modulated light signals to form an output; and a polarisation rotator (106) configured to rotate the polarisation of the second modulated light signal such that it is substantially orthogonal to the polarisation of the first modulated light signal prior to combining.
Oclaro | Date: 2014-12-08
Sacrificial optical test structures are constructed upon a wafer of pre-cleaved optical chips for testing the optical functions of the pre-cleaved optical chips. The sacrificial optical structures are disabled upon the cleaving the optical chips from the wafer and the cleaved optical chips can be used for their desired end functions. The test structures may remain on the cleaved optical chips or they may be discarded.
Agency: GTR | Branch: EPSRC | Program: | Phase: Research Grant | Award Amount: 1.48M | Year: 2016
The theme of this platform grant is electronic-photonic convergence. It underpins expertise in integrated photonics platforms such as silicon photonics, mid-IR photonics, non-linear photonics and high speed electronics, all of which make use of a common fabrication platform. The convergence of electronics and photonics underpins a host of technologies ranging from future internet to consumer products, and from biological and chemical sensing to communications. The integration of electronics and photonics is recognised as the only way to manage the massive data demands of the future, and is consequently crucial to the continuation of the digital age. Silicon Photonics is an example of an emerging technology that will bring photonics to mass markets via integration with electronics. Integrated silicon systems are projected to serve a market in excess of $700M by 2024 (Yole Development, 2014), but is reliant on photonics converging with electronics. Furthermore, some aspects of silicon photonics will encompass non-linear photonics in second generation devices for all optical processing in a fully integrated platform. Similarly, related technologies such as SiGe-on-Insulator and Ge-on-Insulator are poised to revolutionise the next generation of communications and integrated sensor technologies, all on an integrated platform with electronics and non-linear photonics. Underpinning a team in these crucial areas of expertise supported by a flexible funding platform will enable us to pioneer work in these technology areas, and to add value to ideas that emerge. The convergence of electronics and photonics will result in complex integrated systems, linked via fabrication technologies. Electronic-photonic integration has yet to be addressed in a meaningful way in silicon based technologies, and this team collectively have the essential skills to do so, at an institution that possesses the key fabrication equipment to facilitate success. Due to the complex nature of fabrication for research, existing RAs are fully utilised, and have little or no additional scope for strategic research. The platform grant will give us the opportunity to dedicate fabrication resource and RA skills to strategic projects, and specific innovation. We will do this by utilising the RAs within the project to deliver work of significant strategic importance to the portfolio of grants held by the group, whilst also developing the research and managerial skills of the RAs by giving them specific management responsibilities whilst being mentored by one of the investigators.