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Eindhoven, Netherlands

NXP Semiconductors is a Dutch semiconductor manufacturer. It is one of the worldwide top 20 semiconductor sales leaders and was founded in 1953, when the Philips Board started a semiconductor operation with manufacturing and development in Nijmegen, Netherlands. Formerly known as Philips Semiconductors, the company was sold by Philips to a consortium of private equity investors in 2006. The new name, NXP, stood for the consumer's "next experience", according to then-CEO Frans van Houten. On August 6, 2010, NXP completed its IPO, with shares trading on NASDAQ under the ticker symbol NXPI. On December 23, 2013, NXP Semiconductors was added to the NASDAQ 100.NXP Semiconductors provides mixed signal and standard product solutions based on its RF, analog, power management, interface, security and digital processing expertise. These semiconductors are used in a wide range of "smart" automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. Headquartered in Eindhoven, Netherlands, the company has approximately 24,000 employees working in more than 25 countries—including 3,300 employees in Research & Development—and reported sales of $4.358 billion in 2012. NXP's shipment-based revenue in Greater China is twice as big compared to Europe, and 8,000 of the company's employees are based in China.NXP is the co-inventor of near field communication technology along with Sony and supplies NFC chip sets which enable mobile phones to be used to pay for goods, and store and exchange data securely. NXP manufactures chips for eGovernment applications such as electronic passports; RFID tags and labels; and transport and access management, with the chip set and contactless card for MIFARE used by many major public transit systems worldwide.In addition, NXP manufactures automotive chips for in-vehicle networking, passive keyless entry and immobilization, and car radios. NXP invented the I²C interface over 30 years ago and is a supplier of I²C solutions. NXP is also a volume supplier of standard logic devices, and celebrated its 50 years in logic in March 2012.NXP currently owns approximately 11,000 issued or pending patents. Wikipedia.


Patent
NXP Semiconductors | Date: 2015-03-25

A Doherty amplifier for amplifying an input signal to an output signal, the Doherty amplifier comprising: a main amplifier for receiving a first signal and for amplifying the first signal to generate a first amplified signal; a first peak amplifier for receiving a second signal and for generating a second amplified signal, the first peak amplifier only operating when the second signal has reached a first threshold power, the first and second signal split from the input signal; and output circuitry to combine the first and second amplified signals to generate an output signal having an operating bandwidth, the output circuitry comprising inductors arranged in the format of a branch line coupler, the inductors coupled to the output parasitic capacitances of the main and peak amplifier.


Patent
NXP Semiconductors | Date: 2015-08-07

A voice coil motor controller configured to determine a voltage across and a current through a voice coil motor having an input signal supplied thereto and determine its impedance therefrom, the controller further configured to identify asymmetry in variations of said impedance over time to determine an asymmetry value, the controller further configured to provide for control of said voice coil motor using said asymmetry value.


Patent
NXP Semiconductors | Date: 2016-01-07

Embodiments of a packaged semiconductor device with interior polygon pads are disclosed. One embodiment includes a semiconductor chip and a package structure defining a rectangular boundary and having a bottom surface that includes interior polygonal pads exposed at the bottom surface of the package structure and located on a centerline of the bottom surface of the package structure and edge polygonal pads exposed at the bottom surface of the package structure, located at an edge of the rectangular boundary, and including one edge polygonal pad in the vicinity of each corner of the rectangular boundary. The interior polygonal pads are configured such that a line running between at least one vertex of each of the interior polygonal pads is parallel to an edge of the rectangular boundary of the package structure.


Patent
NXP Semiconductors | Date: 2015-10-28

There is disclosed a metal-insulator-metal, MIM, capacitor. The MIM capacitor comprises a MIM stack formed within an interconnect metal layer. The interconnect metal layer is utilised as an electrical connection to a metal layer of the MIM stack.


Patent
NXP Semiconductors | Date: 2015-03-25

A semiconductor device including an RF power transistor in a semiconductor package is described. The semiconductor device comprises a gate lead frame, a drain lead frame, a die including a power transistor having a gate and a drain and a flange. A gate impedance matching network is connected between the gate lead frame and the gate. A drain impedance matching network is connected between the drain lead frame and the drain and includes a drain lead frame bond wire between the drain lead frame and the drain. A first conducting element is connected between the die and the flange and is arranged to provide a current path along which a return current can flow in use to lower an inductance associated with the drain lead frame bond wire.

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