Eindhoven, Netherlands

NXP Semiconductors

www.nxp.com
Eindhoven, Netherlands

NXP Semiconductors is a Dutch semiconductor manufacturer. It is one of the worldwide top 20 semiconductor sales leaders and was founded in 1953, when the Philips Board started a semiconductor operation with manufacturing and development in Nijmegen, Netherlands. Formerly known as Philips Semiconductors, the company was sold by Philips to a consortium of private equity investors in 2006. The new name, NXP, stood for the consumer's "next experience", according to then-CEO Frans van Houten. On August 6, 2010, NXP completed its IPO, with shares trading on NASDAQ under the ticker symbol NXPI. On December 23, 2013, NXP Semiconductors was added to the NASDAQ 100.NXP Semiconductors provides mixed signal and standard product solutions based on its RF, analog, power management, interface, security and digital processing expertise. These semiconductors are used in a wide range of "smart" automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. Headquartered in Eindhoven, Netherlands, the company has approximately 24,000 employees working in more than 25 countries—including 3,300 employees in Research & Development—and reported sales of $4.358 billion in 2012. NXP's shipment-based revenue in Greater China is twice as big compared to Europe, and 8,000 of the company's employees are based in China.NXP is the co-inventor of near field communication technology along with Sony and supplies NFC chip sets which enable mobile phones to be used to pay for goods, and store and exchange data securely. NXP manufactures chips for eGovernment applications such as electronic passports; RFID tags and labels; and transport and access management, with the chip set and contactless card for MIFARE used by many major public transit systems worldwide.In addition, NXP manufactures automotive chips for in-vehicle networking, passive keyless entry and immobilization, and car radios. NXP invented the I²C interface over 30 years ago and is a supplier of I²C solutions. NXP is also a volume supplier of standard logic devices, and celebrated its 50 years in logic in March 2012.NXP currently owns approximately 11,000 issued or pending patents. Wikipedia.


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Patent
NXP Semiconductors | Date: 2017-05-24

A controller for an audio system. The audio system comprising an audio processor and an amplifier. The controller is configured to: receive an amplifier-operating-condition-signal representative of an operating condition of the amplifier; receive a maximum-threshold-value; and generate control signalling based on the amplifier-operating-condition-signal and the maximum-threshold-value, wherein the control signalling is configured to set an operating parameter of the audio processor.


Patent
NXP Semiconductors | Date: 2017-05-24

A magnetic field sensor (120) is disclosed for providing an output signal (174) in response to an external magnetic field (H). The sensor (120) comprises a primary magnetic field transducer (130) for producing a primary signal (131) in response to the external magnetic field (H) and having a first magnetic field saturation characteristic; a secondary magnetic field transducer (140) for producing a secondary signal (141) in response to the external magnetic field ( H ) and having a second magnetic field saturation characteristic. The first magnetic field saturation characteristic is different from the second magnetic field saturation characteristic. The sensor (120) is configured to use the secondary signal (140) to correct for errors in the output signal (174) arising from saturation of the primary transducer (130).


Patent
NXP Semiconductors | Date: 2017-05-24

A summing node (200) is provided for summing a first (Vin+, Vin-) and second (Veld+,Veld-) differential signals. Each of the first and second differential signals comprise respective direct (Vin+, Veld+) and inverse (Vin-, Veld-) signal components. The summing node (200) comprises a first differential transistor pair (M1, M2) comprising a first (201a) and second (202a) input and coupled to a first (330) and second (340) output. The summing node (200) further comprises a second differential transistor pair (M3, M4) comprising a third (202b) and fourth (201b) input and coupled to the first (330) and second (340) output. The first (201a) and fourth (201b) inputs are respectively coupled to the direct (Vin+) and inverse (Vin-) signal components of the first differential signal and the second (202a) and third (202b) inputs are respectively coupled to the direct (Veld+) and inverse (Veld-) signal components of the second differential signal.


Patent
NXP Semiconductors | Date: 2017-05-24

An apparatus is provided that includes first and second connection nodes and a communication circuit. The communication circuit is configured to communicate cell-status data of a cell over a bidirectional data path connected to the connection nodes. The communication circuit includes directional drive circuitry configured to communicate the cell-status data over the bi-directional data path by communicating the cell-status data via the first connection node to first-side circuitry in the one direction of the bi-directional data path and, in response to an indication that the bidirectional data path is faulty, by communicating via the second connection node to second-side circuitry along the other direction of the bi-directional data path. The communication circuit also includes a communication-protocol circuit configured to control the directional drive circuitry. The apparatus may be connected in-series with other like apparatuses in the bi-directional data path.


Patent
NXP Semiconductors | Date: 2017-05-24

A speaker driver (100) comprising an amplifier (104), configured to receive a test signal that comprises a plurality of equivalent test-blocks, and provide measurement-signalling for a speaker (102) at the amplifier output. The measurement-signalling comprising a plurality of measurement-blocks, wherein each of the measurement-blocks corresponds to the output of the amplifier for one of the plurality of test-blocks. The speaker driver also includes an output-current-sensor (130) configured to: measure a current level of the measurement-signalling, and provide sensed-signalling that comprises a plurality of sensed-blocks, wherein each of the plurality of sensed-blocks corresponds to one of the plurality of measurement-blocks of the measurement-signalling. The speaker driver further includes a processor (120) configured to either: (a) combine the plurality of sensed-blocks to provide a time-averaged-block; and determine a frequency-spectrum of the time-averaged-block; or (b) determine a frequency-spectrum of each of the plurality of sensed-blocks to provide a plurality of frequency-spectrum-sensed-blocks; and combine the plurality of frequency-spectrum-sensed-blocks to provide a time-averaged-frequency-spectrum-block.


There is disclosed a single-wire Interface bus transceiver system comprising: an I2C master, a master transceiver, a signal wire, a slave transceiver and an I2C slave, wherein the master transceiver is adapted to encode master data SDA and master clock SCL received from I2C master using Manchester code, generate master single wire signal and transfer it to the slave transceiver through the signal wire, the master transceiver is also adapted to decode Manchester-encoded slave signal received from the signal wire and transfer the decoded slave data to I2C master; the slave transceiver is adapted to encode slave data received from I2C slave using Manchester code, generate slave single wire signal and transfer it to the master transceiver through the signal wire, the slave transceiver is also adapted to decode Manchester-encoded master signal received from the signal wire, generate the recovered master clock and transfer the decoded master data and recovered master clock to I2C slave.


Grant
Agency: European Commission | Branch: H2020 | Program: IA | Phase: PILOTS-01-2016 | Award Amount: 8.10M | Year: 2017

The project targets the incorporation of advanced functional materials to deliver customised conductive inks and flexible adhesives compatible with high volume manufacturing platforms. Specifically the development of these enabling materials will support high speed roll to roll integration of hybrid and large area electronics to address internet of things opportunities. The consortium will integrate materials development with end application requirements in terms of technical performance (thermal/electrical conductivity, processing conditions, materials integrity and adhesion) and unit cost of production to facilitate market adoption. The project will utilise and build on existing CPI pilot facilities (R2R print line) to demonstrate technology integration, manufacturability and produce components for end user evaluation to enable the direct comparison of production techniques. The project delivers a supply chain to support future commercialisation: incorporating materials suppliers of inks and adhesives, supporting RTO in Formulation and nano-particle production, established high fidelity print equipment manufacturers, electronic device manufacturers, established pilot line facilities and potential end users from the apparel, packaging and healthcare sector relating to the internet of things.


Grant
Agency: European Commission | Branch: H2020 | Program: IA | Phase: IoT-01-2016 | Award Amount: 25.43M | Year: 2017

Automated driving is expected to increase safety, provide more comfort and create many new business opportunities for mobility services. The market size is expected to grow gradually reaching 50% of the market in 2035. The IoT is about enabling connections between objects or things; its about connecting anything, anytime, anyplace, using any service over any network. There is little doubt that these vehicles will be part of the IoT revolution. Indeed, connectivity and IoT have the capacity for disruptive impacts on highly and fully automated driving along all value chains towards a global vision of Smart Anything Everywhere. In order to stay competitive, the European automotive industry is investing in connected and automated driving with cars becoming moving objects in an IoT ecosystem eventually participating in BigData for Mobility. AUTOPILOT brings IoT into the automotive world to transform connected vehicles into highly and fully automated vehicle. The well-balanced AUTOPILOT consortium represents all relevant areas of the IoT eco-system. IoT open vehicle platform and an IoT architecture will be developed based on the existing and forthcoming standards as well as open source and vendor solutions. Thanks to AUTOPILOT, the IoT eco-system will involve vehicles, road infrastructure and surrounding objects in the IoT, with a particular attention to safety critical aspects of automated driving. AUTOPILOT will develop new services on top of IoT to involve autonomous driving vehicles, like autonomous car sharing, automated parking, or enhanced digital dynamic maps to allow fully autonomous driving. AUTOPILOT IoT enabled autonomous driving cars will be tested, in real conditions, at four permanent large scale pilot sites in Finland, France, Netherlands and Italy, whose test results will allow multi-criteria evaluations (Technical, user, business, legal) of the IoT impact on pushing the level of autonomous driving.


Grant
Agency: European Commission | Branch: H2020 | Program: RIA | Phase: NMBP-02-2016 | Award Amount: 7.43M | Year: 2017

Power electronics is the key technology to control the flow of electrical energy between source and load for a wide variety of applications from the GWs in energy transmission lines, the MWs in datacenters that power the internet to the mWs in mobile phones. Wide band gap semiconductors such as GaN use their capability to operate at higher voltages, temperatures, and switching frequencies with greater efficiencies. The GaNonCMOS project aims to bring GaN power electronic materials, devices and systems to the next level of maturity by providing the most densely integrated materials to date. This development will drive a new generation of densely integrated power electronics and pave the way toward low cost, highly reliable systems for energy intensive applications. This will be realized by integrating GaN power switches with CMOS drivers densely together using different integration schemes from the package level up to the chip level including wafer bonding between GaN on Si(111) and CMOS on Si (100) wafers. This requires the optimization of the GaN materials stack and device layout to enable fabrication of normally-off devices for such low temperature integration processes (max 400oC). In addition, new soft magnetic core materials reaching switching frequencies up to 200 Mhz with ultralow power losses will be developed. This will be assembled with new materials and methods for miniaturised packages to allow GaN devices, modules and systems to operate under maximum speed and energy efficiency. A special focus is on the long term reliability improvements over the full value chain of materials, devices, modules and systems. This is enabled by the choice of consortium partners that cover the entire value chain from universities, research centers, SMEs, large industries and vendors that incorporate the developed technology into practical systems such as datacenters, automotive, aviation and e-mobility bikes


Grant
Agency: European Commission | Branch: H2020 | Program: IA | Phase: IoT-01-2016 | Award Amount: 34.71M | Year: 2017

The IoF2020 project is dedicated to accelerate adoption of IoT for securing sufficient, safe and healthy food and to strengthen competitiveness of farming and food chains in Europe. It will consolidate Europes leading position in the global IoT industry by fostering a symbiotic ecosystem of farmers, food industry, technology providers and research institutes. The IoF2020 consortium of 73 partners, led by Wageningen UR and other core partners of previous key projects such as FIWARE and IoT-A, will leverage the ecosystem and architecture that was established in those projects. The heart of the project is formed by 19 use cases grouped in 5 trials with end users from the Arable, Dairy, Fruits, Vegetables and Meat verticals and IoT integrators that will demonstrate the business case of innovative IoT solutions for a large number of application areas. A lean multi-actor approach focusing on user acceptability, stakeholder engagement and sustainable business models will boost technology and market readiness levels and bring end user adoption to the next stage. This development will be enhanced by an open IoT architecture and infrastructure of reusable components based on existing standards and a security and privacy framework. Anticipating vast technological developments and emerging challenges for farming and food, the 4-year project stays agile through dynamic budgeting and adaptive decision-making by an implementation board of representatives from key user organizations. A 6 M mid-term open call will allow for testing intermediate results and extending the project with technical solutions and test sites. A coherent dissemination strategy for use case products and project learnings supported by leading user organizations will ensure a high market visibility and an increased learning curve. Thus IoF2020 will pave the way for data-driven farming, autonomous operations, virtual food chains and personalized nutrition for European citizens.

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