Nuvotronics, LLC | Date: 2016-07-25
Nuvotronics, LLC | Date: 2016-11-02
Structures, materials, and methods to control the spread of a solder material or other flowable conductive material in electronic and/or electromagnetic devices are provided.
Nuvotronics, LLC | Date: 2017-01-12
Connectors and interconnects for high power connectors which may operate at frequencies up to approximately 110 GHz and fabrication methods thereof are provided.
Nuvotronics, LLC | Date: 2017-01-13
Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.
Nuvotronics, LLC | Date: 2016-03-18
Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.
Agency: Department of Defense | Branch: Navy | Program: SBIR | Phase: Phase II | Award Amount: 999.72K | Year: 2016
High-power-handling, low-loss (1 dB) microwave phase shifters hold the key to affordable electronically steerable apertures for radar and communications, eliminating the need for active TR modules. Nuvotronics is developing a solid-state approach providing loss performance equal to the best demonstrated MEMS phase shifters, reliably handling five watts peak power with near-zero gain compression, and nanosecond switching time. Using state-of-the-art MMIC processes, our new bit architectures provide flat phase states and low loss over wide bandwidth. In Phase I of this program Nuvotronics developed circuit models of four-bit solid-state phase shifters at S and X-band to show feasibility. Our Phase I program culminated in brassboard demonstration of a C-band 180 degree phase shifter bit with 10 watts power handling using production-released MMIC technology. During Phase II we will demonstrate a four-bit design at X-band that meets power and loss objectives with production cost target of
Nuvotronics, LLC | Date: 2016-08-08
Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages having cooling structures, and methods of bonding a first component to a second component.
Agency: National Aeronautics and Space Administration | Branch: | Program: SBIR | Phase: Phase II | Award Amount: 1.50M | Year: 2015
This proposed program addresses the need for a spaceborne phased array radar system that operates simultaneously at multiple frequency bands for future NASA remote sensing missions dedicated to answering emerging fundamental questions associated with aerosols, clouds, air quality and ecosystems. We will deliver active, electronically scanned array tiles at Ku- and Ka-band utilizing the Nuvotronics PolyStrata® technology for integration alongside an electronically scanned W-band array to form a tri-band system. The PolyStrata® wafer-scale microfabrication process, with capabilities to monolithically integrate dielectric-free antennas with air-coax feed networks in 3D, is a key enabler for achieving state-of-the art performance requirements and manufacturing scalability. Unprecedented power levels will be achieved by integrating state-of-the art GaN MMICs into the PolyStrata front-end architecture.
Agency: National Aeronautics and Space Administration | Branch: | Program: SBIR | Phase: Phase II | Award Amount: 749.99K | Year: 2016
To meet the needs of future NASA Earth science objectives, significant advancements in the overall level of integration and functional density that is achievable in multi-band microwave radar and radiometer instruments are proposed. The targeted system is the Wideband Instrument for Snow Measurements (WISM), which is a technology development effort to measure Snow Water Equivalent that targets the requirements of the proposed Snow and Cold Land Processes Mission. During Phase I, we developed concepts for enhancing the WISM by incorporating signal multiplexing and active devices in the PolyStrata antenna feed that are not present in the baseline version of the instrument. On the Phase II program, we propose to demonstrate these enhancements to the WISM with deliverable hardware prototypes of such active multi-band feed antennas. Drastic improvements in system noise figure and overall size are made possible by integrating the first stage of LNAs into the PolyStrata feed antenna, eliminating additional cable and diplexer losses that occur in the current modular system.
Agency: National Aeronautics and Space Administration | Branch: | Program: SBIR | Phase: Phase II | Award Amount: 1.50M | Year: 2016
Traditional millimeter wave designs use split block or waveguide components and large planar filter banks. This implementation is large in mass and size which are at a premium on CubeSats. Nuvotronics proposes to reduce size and weight of these systems by leveraging low-loss PolyStrata-integrated component and interconnects. The PolyStrata process enables highly accurate, repeatable, compact, low loss filters which can stack to further reduce footprint. With savings in weight and size Nuvotronics will increase the total functionality by increasing the number of frequency bands served by a single CubeSat. A recent advancement in switches will be implemented eliminating the need for a motor to control the reflector, creating further reductions in power and weight. A novel interconnect structure will be showcased that can be implemented on any MMICs to provide a manufacturable, low loss, impedance matched method of launching onto MMICs in bands up to 300 GHz.