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Orlando, FL, United States

Agency: Department of Defense | Branch: Defense Advanced Research Projects Agency | Program: SBIR | Phase: Phase I | Award Amount: 98.99K | Year: 2010

The nScrypt/UTEP team proposes to develop a revolutionary 3Df monolithic cyber manufacturing process that holds great promise for transforming printed manufacturing. This new approach of cyber manufacturing leverages and pushes the limits of graphical design and digital additive manufacturing. We are truly in the digital age in which the youth are savvy with digital technology. Through the latest iPod to the most advanced cyber gaming, the youth in the U.S. can visualize in 3D, move through virtual space and manage communication and data all through the latest digital gadget. These are the next generation designers and manufacturers. A cyber design and manufacturing system is well suited for the generation to follow. The 3Df manufacturing system will fabricate based on the mission requirements of the customer. Since this technology will be cyber based, the design can occur in one location while the manufacturing can occur elsewhere. Ideally, this capability enables the DoD to build anywhere, build anytime and build anything.

Agency: Department of Defense | Branch: Air Force | Program: SBIR | Phase: Phase I | Award Amount: 100.00K | Year: 2008

If we could translate the benefits of 2-D integrated circuits into the third (vertical) dimension, it may be possible to extend Moore’s Law to the year 2060, creating dramatic new possibilities in missile and space systems. By tightly integrating a Field Gate Programmable Array (FPGA) with an often large population of peripheral components into a miniaturized 3D structure, the development and fabrication timeframe of the overall system will be reduced by concealing the complexity of the FPGA from system designers. Through miniaturization and reduced trace lengths resulting from 3D form, parasitic impedances will be reduced and consequently will improve the system by 1) reducing ground bounce and voltage droop in the FPGA’s power network, 2) reducing losses in high speed data buses, and 3) improving Electro-Static Discharge (ESD) performance of the overall system. By eliminating the complexity of the hundreds or thousands of peripheral components from the system designer, reconfigurable devices will be deployed in DoD and military applications with a dramatic reduction in both time and effort.

nScrypt, Inc. | Date: 2015-07-29

An apparatus for use in 3D fabrication includes a heat sink, a melt tube extending through the heat sink, the melt tube having a first end and an opposite second end and adapted for melting filament or other material as the material is conveyed from the first end to the second end, a pen tip having an opening therein for ejecting melted material, the pen tip at the second end of the melt tube, and a pen tip holder for securely holding the pen tip during printing, the pen tip holder having a heater element associated therewith.

Agency: National Aeronautics and Space Administration | Branch: | Program: SBIR | Phase: Phase I | Award Amount: 99.93K | Year: 2011

The proposed effort will make a dramatic improvement in a) size, weight and power based on a transformative approach to manufacturer 3D electronics as well as 2) ease of integration by exploiting standards efforts in the Space community and specifically CubeSat. The most significant contribution we will make is in next generation packaging through the use of Additive Manufacturing of Structural Electronics. The concept of "Plug and Play" implies simple and compatible, but it also implies traditional modular packaging for a specific form factor. By eliminating solder, wire bonds, connector, excess silicon and excess substrate, the possibility exists to shrink an electronic system by more than 100 times. This 100 fold shrinkage will apply to both size and weight and the newly available volume could be applied to power generation and storage. By extending the plug and play concept to "3D Print and Play"Â? in which entire satellites will be fabricated layer-by-layer into a monolithic, intelligent, conformal structure. Consequently, the development time is radically reduced, not from "months to days" but rather "days to hours," by automating the manufacturing component of development.

nScrypt, Inc. | Date: 2013-01-31

A method of building a three dimensional (3D) structure includes micro-dispensing a layer comprising a material using a syringe-based micro-dispensing tool, curing the layer, and repeating the steps of micro-dispensing and curing a plurality of times in order to build the three-dimensional structure. The material may be loaded with nano to micron sized particles, tubes, or strings.

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