Novatek is Russia's largest independent natural gas producer, and the country's second largest gas producer after state-controlled Gazprom. The US government imposed sanctions on the firm in July 2014 as Washington sought to increase pressure on the Kremlin for its perceived support of for separatist rebels in eastern Ukraine. The company was originally known as OAO FIK Novafininvest. Novatek is based in the Yamalo-Nenets Autonomous Region in West Siberia, and maintains a sales office in Moscow. The major shareholders of Novatek are Leonid Michelson, the CEO, with around 28% of the shares, Volga Group, the Luxembourg-based fund controlled by oil trader Gennady Timchenko, with 23% of shares and Gazprom with 10%. A 9.4% stake is owned by Gazprombank, while Novatek's CEO Leonid Mikhelson and Gennady Timchenko have an option to buy this stake. In 2013 Total SA increased its stake in Novatek to 16%. Wikipedia.
Novatek | Date: 2017-01-19
A source driver, a driving circuit using the same and a display apparatus using the same are provided. The display apparatus includes a display panel, a timing controller and a source driver. The timing controller is configured to receive an external image signal to provide a compressed image signal. The source driver is configured to receive the compressed image signal, and has a decompressor configured to convert the compressed image signal into restored image data and provide a plurality of source driving signals to drive the display panel according to a plurality of display data of the restored image data.
Novatek | Date: 2017-01-23
An integrated circuit device including a semiconductor substrate, a first bonding pad structure, a second bonding pad structure, a third bonding pad structure, a first internal bonding wire, and a second internal bonding wire is provided. The first bonding pad structure is disposed on a surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The second bonding pad structure is disposed on the surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The third bonding pad structure is disposed on the surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The first bonding pad structure is electrically coupled to the third bonding pad structure via the first internal bonding wire. The third bonding pad structure is electrically coupled to the second bonding pad structure via the second internal bonding wire.
Novatek | Date: 2016-10-14
An optical device including a first substrate, a light source, a second substrate, an image capturing device, a microstructure layer, and an infrared pass layer is provided. The light source is disposed on the first substrate. The second substrate is disposed above the first substrate. The second substrate includes a first surface and a second surface opposite to the first surface. The image capturing device is disposed on the first substrate to receive a light beam, which is originated from scattered light beams scattered by an object touching the first surface of the second substrate. The microstructure layer is disposed on the first surface of the second substrate. The microstructure layer is adapted to increase a light beam, which is scattered by the object and transmitted to the image capturing device. The infrared pass layer is adapted to pass the infrared light.
Novatek | Date: 2016-03-11
An optical apparatus adapted to contact an object is provided. The optical apparatus includes an optical device and a processing circuit. The optical device includes a reflection structure and a transmission structure. The optical device senses light signals of the object via the reflection structure and the transmission structure. The processing circuit is electrically connected to the optical device. The processing circuit is configured to identify the object according to the light signals. In addition, a method for identifying an object is also provided.
Novatek | Date: 2016-06-23
An apparatus for processing a source image to generate a target image is provided. The target image includes a plurality of target pictures. The apparatus includes a first image processing circuit and a second image processing circuit. The first image processing circuit separates the source image into a first image including a first part of the source image and a second image including a second part of the source image. The second image processing circuit processes the first image to obtain a plurality of target first pictures according to a first setting, process the second image to obtain a plurality of target second pictures according to a second setting, and combine each of the target first pictures with a corresponding one of the target second pictures to obtain the plurality of target pictures. A method for processing a source image to generate a target image is also provided.
Novatek | Date: 2016-10-28
A chip on film package includes a base film, a chip and a heat-dissipation sheet. The base film includes a first surface. The chip is disposed on the first surface and having a chip length along a first axis of the chip. The heat-dissipation sheet includes a covering portion and a first extending portion connected to the covering portion and attached to first surface. The covering portion at least partially covers the chip and having a first length along the first axis. The first extending portion has a second length along the first axis substantially longer than the first length of the covering portion, and the covering portion exposes a side surface of the chip, wherein the side surface connects a top surface and a bottom surface of the chip.
Novatek | Date: 2016-12-09
A display device with a force sensing device is provided. The display device with the force sensing device includes a display layer and a non-display layer. The display layer is configured to display an image. The non-display layer is disposed below the display layer. The non-display layer includes a first signal transmission layer and a first signal transmission layer. The deformable layer is disposed on a surface of the first signal transmission layer. The force sensing device includes the deformable layer, the first signal transmission layer and a second signal transmission layer. The second signal transmission layer is disposed above the first signal transmission layer. One of the first signal transmission layer and the second signal transmission layer receives a driving signal and the other of the first signal transmission layer and the second signal transmission layer receives a sensing signal.
Novatek | Date: 2017-04-05
The driving system for driving a display panel includes a timing controller and a source driving circuit. The source driving circuit includes a plurality of output channels and a plurality of shift registers respectively corresponding to the output channels. The plurality of shift registers are classified into a plurality of shift register series, among which a first shift register series includes a first shift register being as one end and a second shift register being as the other end, and a second shift register series includes a third shift register being as one end and a fourth shift register being as the other end. The timing controller is connected to the first shift register, the second shift register, the third shift register, and the fourth shift register, and transmits a first start pulse to the first shift register and a second start pulse to the third shift register.
Novatek | Date: 2016-02-05
A display apparatus, a gate driver and an operation method thereof are provided. The gate driver includes a first input buffer and a gate line driving circuit. An input terminal of the first input buffer is configured to receive a timing control signal from the outside of the gate driver. The gate line driving circuit is coupled to an output terminal of the first input buffer. The gate line driving circuit is configured to scan a plurality of gate lines of the display panel based on the control of the timing control signal. An output impedance of the first input buffer is correspondingly adjusted according to the coupling noise of the gate driver.
Novatek | Date: 2016-01-28
A touch sensing circuit including a plurality of touch sensing channels is provided. Each of the touch sensing channels includes at least one operational amplifier circuit and a demodulating circuit. The operational amplifier circuit is configured to receive a touch sensing signal, and amplify the touch sensing signal. The operational amplifier circuit includes an operational amplifier. The operational amplifier has an inverting end, and the inverting end is coupled to a direct-current voltage. The demodulating circuit is coupled to the operational amplifier circuit. The demodulating circuit is configured to demodulate the amplified touch sensing signal by mixing the amplified touch sensing signal with a demodulating signal. A waveform of the demodulating signal includes a flat region. In addition, a signal demodulating method is also provided.