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Trademark
Nitta Haas Incorporated | Date: 2015-06-02

Chemical slurries for polishing semiconductors; chemical slurries for polishing electronic substrates. Abrasive paper, namely, sand paper; abrasive cloth; abrasive sand; polishing paper; polishing, scouring and abrasive preparations. Holding devices for machines for semiconductor wafer surface polishing machines; holding devices for machines for semiconductor wafer surface polishing apparatus; machine templates for semiconductor wafer surface polishing machines; machine templates for semiconductor wafer surface polishing apparatus; blank machine templates for semiconductor wafer surface polishing machines; blank machine templates for semiconductor wafer surface polishing apparatus; mounting pads and sheets for semiconductor wafer surface polishing machines; mounting pads and sheets for semiconductor wafer surface polishing apparatus; polishing pads for semiconductor wafer surface polishing machines; polishing pads for semiconductor wafer surface polishing apparatus; semiconductor wafer surface polishing machines; semiconductor wafer surface polishing apparatus; semiconductor manufacturing machines; semiconductor manufacturing apparatus; holding devices for machines for glass polishing machines; holding devices for machines for glass polishing apparatus; templates for glass polishing machines; templates for glass polishing apparatus; blank templates for glass polishing machines; blank templates for glass polishing apparatus; mounting pads and sheets for glass polishing machines; mounting pads and sheets for glass polishing apparatus; polishing pads for glass polishing machines; polishing pads for glass polishing apparatus; glass polishing machines; glass polishing apparatus; holding devices for machines for glass substrate polishing machines; holding devices for machines for glass substrate polishing apparatus; templates for glass substrate polishing machines; templates for glass substrate polishing apparatus; blank templates for glass substrate polishing machines; blank templates for glass substrate polishing apparatus; mounting pads and sheets for glass substrate polishing machines; mounting pads and sheets for glass substrate polishing apparatus; polishing pads for glass substrate polishing machines; polishing pads for glass substrate polishing apparatus; glass substrate polishing machines; glass substrate polishing apparatus; holding devices for machines for glass disk polishing machines; holding devices for machines for glass disk polishing apparatus; templates for glass disk polishing machines; templates for glass disk polishing apparatus; blank templates for glass disk polishing machines; blank templates for glass disk polishing apparatus; mounting pads and sheets for glass disk polishing machines; mounting pads and sheets for glass disk polishing apparatus; polishing pads for glass disk polishing machines; polishing pads for glass disk polishing apparatus; glass disk polishing machines; glass disk polishing apparatus; holding devices for metal polishing machines for * manufacturing *hard disks; holding devices for metal polishing apparatus for * manufacturing * hard disks; templates for metal polishing machines for * manufacturing * hard disks; templates for metal polishing apparatus for * manufacturing * hard disks; blank templates for metal polishing machines for * manufacturing * hard disks; blank templates for metal polishing apparatus for hard disks; mounting pads and sheets for metal polishing machines for hard disks; mounting pads and sheets for metal polishing apparatus for * manufacturing * hard disks; polishing pads for metal polishing machines for * manufacturing * hard disks; polishing pads for metal polishing apparatus for * manufacturing * hard disks; metal polishing machines for * manufacturing * hard disks; metal polishing apparatus for * manufacturing * hard disks; holding devices for * electric * polishing machines; holding devices for * electric * polishing apparatus; templates for * electric * polishing machines; templates for * electric * polishing apparatus; blank templates for * electric * polishing machines; blank templates for * electric * polishing apparatus; mounting pads and sheets for * electric *polishing machines; mounting pads and sheets for * electric * polishing apparatus; polishing pads for * electric * polishing machines; polishing pads for * electric * polishing apparatus; * electric * polishing machines; * electric * polishing apparatus; polishing cloth for * electric * polishing machines.


Patent
Nitta Haas Incorporated, Rohm and Haas Electronic Materials CMP Holdings Inc. | Date: 2013-09-27

A chemical mechanical polishing composition for polishing silicon wafers is provided, containing: water, optionally, an abrasive; a cation according to formula (I); piperazine or a piperazine derivative according to formula (II); and, a quaternary ammonium compound; wherein the chemical mechanical polishing composition exhibits a pH of 9 to 12. Also provided are methods of making and using the chemical mechanical polishing composition.


A method of polishing a sapphire substrate is provided, comprising: providing a substrate having an exposed sapphire surface; providing a chemical mechanical polishing slurry, wherein the chemical mechanical polishing slurry comprises, as initial components: colloidal silica abrasive, wherein the colloidal silica abrasive has a negative surface charge; and, wherein the colloidal silica abrasive exhibits a multimodal particle size distribution with a first particle size maximum between 2 and 25 nm; and, a second particle size maximum between 75 and 200 nm; optionally, a biocide; optionally, a nonionic defoaming agent; and, optionally, a pH adjuster. A chemical mechanical polishing composition for polishing an exposed sapphire surface is also provided.


Patent
Nitta Haas Incorporated | Date: 2013-03-28

The polishing composition of the present invention is a polishing composition for polishing a tungsten-containing metal layer formed on an insulating layer, the polishing composition comprising: abrasive grains; one or more halogen acids selected from the group consisting of iodic acid, iodous acid, and hypoiodous acid; a strong acid; a hydrogen-ion-supplying agent; and water.


Patent
Nitta Haas Incorporated and Sumco Corporation | Date: 2014-12-04

Provided is a polishing composition that does not contain abrasives and that is used for polishing a silicon wafer, the polishing composition including a pH buffer, a polishing accelerator, a water-soluble polymer, and a block-type compound. By polishing a silicon wafer by using the polishing composition, a polishing speed of greater than 0.1 m/min can be achieved.

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