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Patent
Nippon Avionics Co. and NEC Corp | Date: 2013-02-08

A camera generates a light source control signal for controlling a light source to turn the light source on and off, acquires a plurality of items of first image data and a plurality of items of second image data obtained by picking up the measured wave, and transfers the plurality of items of acquired first image data and the plurality of items of acquired second image data to an external storage and processing device as digital data with an identifying number for identifying a frame in which the image data is acquired attached every frame. The external storage and processing device determines whether each frame of the digital data is an item of the first image data or an item of the second image data on the basis of the identifying number, and subtracts the plurality of items of determined second image data from the plurality of items of determined first image data to produce difference image data.


Patent
NEC Corp, Osaka University and NIPPON Avionics Co. | Date: 2014-02-19

Provided is an imaging system, including: a light source; an imaging device; a first optical system for irradiating an imaging object with light from the light source; a second optical system for causing one of light reflected from the imaging object and light transmitted through the imaging object to enter the imaging device; a control device for controlling the light source to irradiate the light with a predetermined period; and a processing device for acquiring time-series image data over a plurality of frames by controlling the light source to irradiate the light with the predetermined period, and allocating a maximum pixel intensity among the time-series pixel data of each pixel as pixel data of the each pixel to thereby obtain first image data when the light source irradiates the light.


Patent
NEC Corp and Nippon Avionics Co. | Date: 2013-08-14

A camera generates a light source control signal for controlling a light source to turn the light source on and off, acquires a plurality of items of first image data and a plurality of items of second image data obtained by picking up the measured wave, and transfers the plurality of items of acquired first image data and the plurality of items of acquired second image data to an external storage and processing device as digital data with an identifying number for identifying a frame in which the image data is acquired attached every frame. The external storage and processing device determines whether each frame of the digital data is an item of the first image data or an item of the second image data on the basis of the identifying number, and subtracts the plurality of items of determined second image data from the plurality of items of determined first image data to produce difference image data.


DUBLIN--(BUSINESS WIRE)--Research and Markets has announced the addition of the "Thermal Imaging Market by Component, Application for Military & Defense, Industrial, Residential, and Commercial End-Users- Global Industry Perspective, Comprehensive Analysis, Size, Share, Growth, Segment, Trends and Forecast, 2015 - 2021" report to their offering. Global thermal imaging market report includes comprehensive and profound analysis on the global and regional level. The study gives historic data of the year 2015 and forecast for 2016-2021 on the basis of revenue (USD Million). Assessment of market dynamics gives a brief thought about the drivers, restraints, and opportunities of global thermal imaging market. The report provides an extensive competitive analysis of key vendors in the market. The report provides company market share analysis in order to give a broader overview of the key players in the market. Additionally, the report also covers strategic developments of the market including collaborations & joint ventures, new product launch, acquisitions & mergers, agreements, partnerships, research & development, product and regional expansion of major participants involved in the market on the global and regional level. Moreover, the study covers patent analysis (2011-2016) bifurcated into the patent share by company, patent trend, and patent analysis according to the region. The study provides a decisive view on the thermal imaging market by segmenting the market based on component, applications, end-user and regions. All the segments have been analyzed based on present and future trends and the market is estimated from 2015 to 2021. Based on the component the market is segmented into software, hardware, and services. Key application market covered under this study includes surveillance & security, maintenance & monitoring, automotive, traffic monitoring, healthcare, and others. Some of the key players in thermal imaging market include Flir Systems, Danaher, L-3 Communications Holdings, Inc., Drs Technologies, Raytheon, Bullard, BAE Systems Inc., Axis, Thermoteknix, Sofradir Group, Testo Ag, CI Infrared Cameras, Inc., Nippon Avionics Co. Ltd., Honeywell International, Inc., and Infratec. For more information about this report visit http://www.researchandmarkets.com/research/7xb67g/thermal_imaging


Patent
Nippon Avionics Co. and MItsubishi Electric | Date: 2011-02-23

On a printed wiring board obtained by a method of manufacturing a printed board, a predetermined component is to be mounted on at least one of a front surface side and a back surface side. The manufacturing method includes preparing a CFRP core, forming a through hole so as to penetrate the CFRP core from the front surface side to the back surface side and include a region in which the component is to be mounted when viewed in a plan view, and embedding a GFRP core having insulating properties within the through hole by filling the through hole with a resin having insulating properties and curing the resin. According to the manufacturing method, the component mounted on the printed board is not affected by a stray capacitance due to a CFRP, and it is not difficult to form a circuit.


Patent
MItsubishi Electric and Nippon Avionics Co. | Date: 2013-01-02

On a printed wiring board obtained by a method of manufacturing a printed board, a predetermined component (90) is to be mounted on at least one of a front surface side and a back surface side. The manufacturing method includes the steps of preparing a CFRP core (10), forming a through hole (1) so as to penetrate the CFRP core (10) from the front surface side to the back surface side and include a region in which the component (90) is to be mounted when viewed in a plan view, and embedding a GFRP core (30) having insulating properties within the through hole (1) by filling the through hole (1) with a resin (24) having insulating properties and curing the resin (24). According to the manufacturing method, the component (90) mounted on the printed board is not affected by a stray capacitance due to a CFRP, and it is not difficult to form a circuit.


Trademark
Nippon Avionics Co. and NEC Avio Infrared Technologies Co. | Date: 2010-11-09

cameras, namely, photographic cameras, infrared cameras, cinematographic cameras; indicators, namely, temperature indicators; meters, namely, thermometers, luminous flux meters, photometers, illuminometers, and calorimeters.


Suganuma K.,Osaka University | Baated A.,Osaka University | Kim K.-S.,Osaka University | Hamasaki K.,Osaka University | And 3 more authors.
Acta Materialia | Year: 2011

Pure Sn plating on ceramic chip capacitors was tested by thermal cycling both in air and in vacuum for up to 3000 cycles and the whisker growth mechanism was clarified. A thin crystalline SnO layer is formed on the surface of Sn plating and whiskers, which exhibits a high level of cracking. Thermal cycling whiskers exhibit two distinct features: fine striation rings on the whisker side face vertical to the whisker growth axis; and deep grooves at the root of the whiskers. One ring of the fine striations corresponds to each thermal cycle. The formation of the grooves can be attributed to thermal cycle cracking along grain boundaries of Sn followed by oxidation and growth of whiskers from the root grains. The characteristic winding feature observed for thermal cycling whiskers can be attributed to the formation of root grooves with severe oxidation. Whisker growth in vacuum is faster than in air. Whiskers grown in vacuum are thinner and longer than whiskers grown in air, while the whisker density is not influenced by atmosphere. The interval of striation rings is wider for vacuum-grown whiskers as compared with air-grown whiskers. © 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.


Ohkubo S.,Nippon Avionics Co. | Tamura T.,Nippon Avionics Co.
Proceedings of SPIE - The International Society for Optical Engineering | Year: 2016

We have developed image processing technologies for resolving issues caused by the inherent UFPA (uncooled focal plane array) sensor characteristics to spread its applications. For example, large time constant of an uncooled IR (infra-red) sensor limits its application field, because motion blur is caused in monitoring the objective moving at high speed. The developed image processing technologies can eliminate the blur and retrieve almost the equivalent image observed in still motion. This image processing is based on the idea that output of the IR sensor is construed as the convolution of radiated IR energy from the objective and impulse response of the IR sensor. With knowledge of the impulse response and moving speed of the objective, the IR energy from the objective can be de-convolved from the observed images. We have successfully retrieved the image without blur using the IR sensor of 15 ms time constant under the conditions in which the objective is moving at the speed of about 10 pixels/60 Hz. The image processing for reducing FPN (fixed pattern noise) has also been developed. UFPA having the responsivity in the narrow wavelength region, e.g., around 8 μm is appropriate for measuring the surface of glass. However, it suffers from severe FPN due to lower sensitivity compared with 8-13 μm. The developed image processing exploits the images of the shutter itself, and can reduce FPN significantly. © 2016 SPIE.


Tanji E.,Nippon Avionics Co. | Ookubo S.,Nippon Avionics Co.
NEC Technical Journal | Year: 2015

As the cost of infrared cameras comes down and their performance goes up, demand is surging and user requirements are becoming ever more diversified. As the market for infrared cameras continues to expand, these cameras are now being widely deployed as non-destructive inspection devices to ensure public safety and security. This paper discusses the image processing technology used to obtain the higher resolution required for non-destructive inspection and looks at different examples of infrared camera applications.

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