Nimbic Inc.

Mountain View Acres, CA, United States

Nimbic Inc.

Mountain View Acres, CA, United States
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Oikawa R.,Renesas Electronics Corporation | Gope D.,Indian Institute of Science | Gope D.,Nimbic Inc. | Jandhyala V.,Nimbic Inc.
IEEE Transactions on Components, Packaging and Manufacturing Technology | Year: 2012

A return-path decomposition method that eliminates artificial return-path discontinuities is presented. The methodology is applied to over 2 Gb/s simultaneous switching output analysis of a low-cost wire-bonding-type ball grid array package with a 32-bit double-data rate interface. The analysis is based on true transistor-level signal-power simulation and a large-scale, full-wave full 3-D boundary element method field solver package model. The simulation results suggest that in a weak return-path system, such as a wire-bonding-type package, the I/O performance is mainly dominated by the signal channel design rather than the power supply design in over 2-Gb/s region. The power supply acts as a secondary signal return path rather than as a noise source. The power supply design should be more focused on the main driver/predriver power supply noise interference in those systems. © 2012 IEEE.

Murugan R.,Texas Instruments | Mukherjee S.,Texas Instruments | Mi M.,Texas Instruments | Pauc L.,Texas Instruments | And 5 more authors.
Proceedings - Electronic Components and Technology Conference | Year: 2012

As System-on-Chip (SoC) designs migrate to 28nm process node and beyond, the electromagnetic (EM) co-interactions of the Chip-Package-Printed Circuit Board (PCB) becomes critical and require accurate and efficient characterization and verification. In this paper a fast, scalable, and parallelized boundary element based integral EM solutions to Maxwell equations is presented. The accuracy of the full-wave formulation, for complete EM characterization, has been validated on both canonical structures and real-world 3-D system (viz. Chip + Package + PCB). Good correlation between numerical simulation and measurement has been achieved. A few examples of the applicability of the formulation to high speed digital and analog serial interfaces on a 45nm SoC are also presented. © 2012 IEEE.

Ghaffari-Miab M.,University of Tehran | Valdes F.,Nimbic Inc. | Faraji-Dana R.,University of Tehran | Michielssen E.,University of Michigan
IEEE Transactions on Antennas and Propagation | Year: 2014

A simple, highly accurate, and efficient 2D finite-difference technique for computing the direct convolution of time-domain Green's functions (TDGFs) of layered media with temporal interpolators is presented. The proposed TDGFs are incorporated into a recently developed marching-on-in-time (MOT)-based time-domain integral equation (TDIE) solver based on noncausal high-order B-Spline temporal interpolators without requiring the prediction of future unknowns. Numerical results demonstrating the applicability of the technique to the analysis of various microwave structures are presented. © 2014 IEEE.

Valdes F.,Nimbic Inc. | Ghaffari-Miab M.,University of Tehran | Andriulli F.P.,Telecom Bretagne | Cools K.,University of Nottingham | Michielssen,University of Michigan
IEEE Transactions on Antennas and Propagation | Year: 2013

Two high-order accurate Calderón preconditioned time domain electric field integral equation (TDEFIE) solvers are presented. In contrast to existing Calderón preconditioned time domain solvers, the proposed preconditioner allows for high-order surface representations and current expansions by using a novel set of fully-localized high-order div-and quasi curl-conforming (DQCC) basis functions. Numerical results demonstrate that the linear systems of equations obtained using the proposed basis functions converge rapidly, regardless of the mesh density and of the order of the current expansion. © 1963-2012 IEEE.

Valdes F.,University of Michigan | Valdes F.,Nimbic Inc. | Andriulli F.P.,Telecom Bretagne | Bagci H.,King Abdullah University of Science and Technology | Michielssen E.,University of Michigan
IEEE Transactions on Antennas and Propagation | Year: 2013

Single-source time-domain electric-and magnetic-field integral equations for analyzing scattering from homogeneous penetrable objects are presented. Their temporal discretization is effected by using shifted piecewise polynomial temporal basis functions and a collocation testing procedure, thus allowing for a marching-on-in-time (MOT) solution scheme. Unlike dual-source formulations, single-source equations involve space-time domain operator products, for which spatial discretization techniques developed for standalone operators do not apply. Here, the spatial discretization of the single-source time-domain integral equations is achieved by using the high-order divergence-conforming basis functions developed by Graglia alongside the high-order divergence-and quasi curl-conforming (DQCC) basis functions of Valdés The combination of these two sets allows for a well-conditioned mapping from div-to curl-conforming function spaces that fully respects the space-mapping properties of the space-time operators involved. Numerical results corroborate the fact that the proposed procedure guarantees accuracy and stability of the MOT scheme. © 2012 IEEE.

Camposano R.,Nimbic Inc. | Gope D.,Nimbic Inc. | Grivet-Talocia S.,Polytechnic University of Turin | Jandhyala V.,University of Washington
Proceedings -Design, Automation and Test in Europe, DATE | Year: 2012

Moore's Law has driven the semiconductor revolution enabling over four decades of scaling in frequency, size, complexity, and power. However, the limits of physics are preventing further scaling of speed, forcing a paradigm shift towards multicore computing and parallelization. In effect, the system is taking over the role that the single CPU was playing: high-speed signals running through chips but also packages and boards connect ever more complex systems. © 2012 EDAA.

Cui W.,University of Washington | Chakraborty S.,Nimbic Inc. | Jandhyala V.,University of Washington
IEEE Antennas and Propagation Society, AP-S International Symposium (Digest) | Year: 2012

Although electromagnetic (EM) simulators are able to simulate systems and devices with a larger number of design parameters, the next challenge is to use such simulators in order to provide parametric simulation and optimization in a high-dimensional design space, while minimizing the number of calls to the EM simulator. This paper presents an optimization approach which can significantly reduce the number of calls to the EM simulator through a case study of a high-dimensional parametric system which contains 127 design factors. Unlike traditional simulated annealing (SA) and particle swarm optimization (PSO) which randomly select values to create all of the combinations of the variables, the proposed optimization approach uses Taguchi's method which employs large orthogonal arrays (OAs) to create a test set that has an even distribution of all combinations. Therefore, it is more efficient, concise and the global optimum can be guaranteed. To further shorten the simulation time, sensitivity analysis is first conducted and unveils that the top 20 most volatile design factors attribute to 80% of the performance variation. Therefore, the 20 parameters are optimized using a large OA of 361 rows and 20 columns. The results show that the proposed optimization approach is capable of optimizing high-dimensional parametric systems swiftly and may potentially have a wide range of applications. © 2012 IEEE.

Nimbic Inc. | Date: 2013-04-08


Gope D.,Nimbic Inc. | Gope D.,Indian Institute of Science | Chatterjee S.,Indian Institute of Science | De Araujo D.,Nimbic Inc. | And 3 more authors.
2013 IEEE International 3D Systems Integration Conference, 3DIC 2013 | Year: 2013

Three dimensional integrated circuits (3DICs) are generating considerable interest as a way to increase speed and density while reducing power and form factor. Among the different forms of 3D integration, the use of Through Silicon Vias (TSV) with micro-bumps in a passive interposer is a popular choice in applications ranging from wide IO memory to heterogeneous integration. Current compact modeling strategy aims at modeling TSVs with circuit elements whose values are typically computed from analytical expressions. This technique therefore does not capture system level coupling effects like TSV-Redistribution Layer (RDL) coupling. This paper presents a device physics aware 3D electromagnetic modeling of TSV structures with the capability of modeling full systems including coupling between conventional package-board layers and TSV embedded passive interposers, towards accurate signal and power integrity analysis and design. © 2013 IEEE.

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