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Smith D.G.,Nikon Research Corporation of America
Proceedings of SPIE - The International Society for Optical Engineering | Year: 2012

Typical focus sensors in conventional integrated circuit lithographic equipment have long been known to exhibit errors due to the nature of patterns printed on the wafer1. One such error can be characterized as being derived from thin film effects where the derivative of the phase on reflection by the wafer introduces a shift in the beam that is basically identical to a shift that would be generated by a change in wafer height. In this paper we present a theoretical investigation into the nature and magnitude of the focus offset produced by this wafer effect under current typical process parameters. © 2012 SPIE. Source

Sakamoto J.A.,University of Arizona | Sakamoto J.A.,Nikon Research Corporation of America | Barrett H.H.,University of Arizona
Optics Express | Year: 2012

A method for determining the pupil phase distribution of an optical system is demonstrated. Coefficients in a wavefront expansion were estimated using likelihood methods, where the data consisted of multiple irradiance patterns near focus. Proof-of-principle results were obtained in both simulation and experiment. Large-Aberration wavefronts were handled in the numerical study. Experimentally, we discuss the handling of nuisance parameters. Fisher information matrices, Crameér-Rao bounds, and likelihood surfaces are examined. ML estimates were obtained by simulated annealing to deal with numerous local extrema in the likelihood function. Rapid processing techniques were employed to reduce the computational time. © 2012 Optical Society of America. Source

Binnard M.,Nikon Research Corporation of America
Proceedings - ASPE 2016 Spring Topical Meeting: Precision Mechatronic System Design and Control | Year: 2016

Linear motors with exceptional performance are required to meet the demanding requirements of modern semiconductor lithography machines. This paper describes the design, analysis, simulation, and experimental verification of a novel linear motor capable of creating controlled forces in two orthogonal directions. Force ripple, coupling, and linearity are improved by applying compensation for motor imperfections caused by manufacturing variations and assembly tolerances. Source

Tyminski J.K.,Nikon Research Corporation of America
Proceedings of SPIE - The International Society for Optical Engineering | Year: 2015

This report presents a model to predict, analyze, and monitor pattern edge placements errors occurring during integrated circuit manufacture. The edge placement errors are driven by overlay and imaging capabilities of scanners and pattering tools. The model can be used to analyze the impact of various imaging strategies on pattern placement statistics of layers composing ICs. Such analysis is essential to both, IC designers and lithography engineers, striving to successfully fabricate complex designs at economical manufacture yields. The report discusses key contributors to the image edge placement errors and presents examples of edge placement predictions based on scanner records. The edge placement error examples presented in this report are based on scanner overlay and CD uniformity performance for the current generation of integrated circuit designs. © 2015 SPIE. Source

Renwick S.P.,Nikon Research Corporation of America
Proceedings of SPIE - The International Society for Optical Engineering | Year: 2014

Directed self-assembly (DSA) of various polymers is a potential next-generation lithography component. Lithographers can use an ArF scanner to print guide structures with pitches accessible with current technology. The DSA materials, in a non-exposure step, perform pitch multiplication of 1-D and 2-D guide structures. While research has investigated defects inherent to the DSA material, ArF scanner effects have received little attention. This work uses DSA models and scanner models to assess requirements for ArF immersion scanners for DSA complementary lithography. © 2014 SPIE. Source

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