Tokushima, Japan
Tokushima, Japan

Nichia Corporation is a Japanese chemical engineering and manufacturing company, headquartered in Tokushima, Japan with global subsidiaries, that specializes in the manufacturing and distribution of phosphors, including light-emitting diodes , laser diodes, battery materials, and calcium chloride. The Nichia Corporation comprises two divisions-Division 1, responsible for phosphors and other chemicals, and Division 2, responsible for LEDs.Nichia is the world’s largest supplier of LEDs. It designs, manufactures, and markets LEDs for display, LCD backlighting, automotive and general lighting applications with the many different leds across the entire visible spectrum. Nichia’s invention and development of white LEDs have spanned several accomplishments throughout the history of the company.With 6,600 employees and multiple subsidiaries worldwide, Nichia achieved sales of approximately US$2.3 billion in 2007. Wikipedia.


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A bonded magnet is provided which includes first and second components. The first and second components have first and second non-action surfaces, and first and second action surfaces that intersect the first and second non-action surfaces, respectively. First and second flux groups curve inside the first and second components from the first and second non-action surfaces to the first and second action surfaces, respectively. The areas of the first and second non-action surfaces are greater than the first and second action surfaces, respectively. The flux densities on the first and second action surfaces are higher than the first and second non-action surfaces, respectively. The pole on the first non-action surface is opposite to the second non-action surface. The first and second non-action surfaces are coupled to each other. The first flux groups continuously extend from one to another.


Patent
Nichia Corporation | Date: 2017-01-11

A light emitting device includes a light emitting element, a wavelength converter, a light transmissive member, a light guider, and a light transmitting layer. The light emitting element has an element upper surface, an element lower surface, and an element side surface. The wavelength converter has a converter lower surface. The wavelength is provided to be connected to the light emitting element such that the converter lower surface faces the element upper surface. The converter lower surface has an exposed region that does not face the element upper surface. The light guider guides light from the light emitting element to the wavelength converter. The light guider covers the element side surface and the exposed region. The wavelength converter has a converter upper surface. The light transmitting layer has a layer lower surface facing the converter upper surface. The converter upper surface is smaller than the layer lower surface.


A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means or an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.


Patent
Nichia Corporation | Date: 2017-01-27

A light emitting device includes a substrate, a light emitting element and a sealing resin member. The substrate includes a flexible base, a plurality of wiring portions and a groove portion. The groove portion is formed between the plurality of wiring portions spaced apart from each other, and includes a first groove portion, a second groove portion, and a third groove portion extending in a direction intersecting the first and second groove portions. The first and third groove portions are connected to each other with a curve. The second and third groove portions are connected to each other with a curve. The sealing resin member seals the light emitting element and the substrate. The sealing resin member is arranged on the third groove portion and spaced apart from the first groove portion and the second groove portion.


A method of producing a nitride fluorescent material having a high light emission intensity and including a calcined product having a composition represented by formula M^(a)_(v)M^(b)_(w)M^(c)_(x)M^(d)_(y)N_(z) is provided. M_(a) is at least one element selected from Sr, Ca, Ba, and Mg; M^(b) is at least one element selected from Li, Na, and K; M^(c) is at least one element selected from Eu, Mn, Tb, and Ce; M^(d) is at least one element selected from Al, B, Ga, and In; v, w, x, y, and z satisfy 0.8 v 1.1, 0.8 w 1.1, 0.001 < x 0.1, 2.0 y 4.0, and 3.0 z 5.0, respectively.In one embodiment, the method includes mixing the calcined product with a polar solvent, and optionally removing the polar solvent after mixing, wherein the polar solvent is alcohol and/or ketone containing water in a range of 0.0 1 % by mass or more and 12% by mass or less. In another embodiment, the method includes: providing a calcined product having the composition represented by the formula (I); mixing the calcined product with a polar solvent having a relative dielectric constant in a range of 10 to 70 at 20C, and optionally removing the polar solvent after mixing. A nitride fluorescent material and a light-emitting device are also provided.


A light emitting device mount comprising a pair of lead terminals (10, 11), each including a first main surface (10a), a second main surface (10b) that is located on the opposite side to said first main surface (10a), and an end surface having first and second recessed surface areas (10ca, 10cb) that include curved surfaces and extend from said first and second main surfaces (10a, 10b), respectively, as viewed in cross-section, the end surface also having a middle area (10cc) between said first and second recessed surface areas (10ca, 10cb); and a resin portion (20) that is integrally formed with said pair of lead terminals (10, 11), and covers said end surface so that said second main surface (10b) is at least partially exposed, wherein the area of said second recessed surface area (10cb) is larger than that of said first recessed surface area (10ca).


Patent
Nichia Corporation | Date: 2017-01-17

A light emitting device including a supporting body; first wirings formed on a surface of the supporting body; second wirings formed on the surface of the supporting body; a plurality of first light emitting elements, which are flip-chip mounted on respective ones of the first wirings and are electrically connected to each other by the first wirings; and a second light emitting element electrically connected to at least one of the second wirings. The second light emitting element is disposed on at least one of the first wirings at a location between at least two of the electrically-connected first light emitting elements, without being electrically connected to said at least one of the first wirings.


Patent
Nichia Corporation | Date: 2017-01-17

A light-emitting device includes: one or more first light-emitting elements each having a peak wavelength in a range from 430 nm to less than 490 nm; a second light-emitting element having a peak wavelength Y in a range from 490 nm to less than a wavelength X; a third light-emitting element having a peak wavelength Z in a range from more than the wavelength X to 570 nm; and a phosphor or a fourth light-emitting element having a peak wavelength in a range from 580 nm to 680 nm. At least one of the second and third light-emitting elements is connected to at least one of the first light-emitting elements in series. The wavelength X is in a range from more than 490 nm to less than 570 nm with an absolute value of difference between |XY| and |XZ| being 10 nm or less.


Patent
Nichia Corporation | Date: 2017-01-17

A light emitting device is disclosed. The light emitting device includes a mounting board, one or more light emitting elements arranged on the mounting board, a frame disposed to surround the one or more light emitting elements, and a light transmissive member encapsulating an area surrounded by the frame. The frame has an inner perimeter that includes at least a pair of opposing sides and four acute-angled portions each provided at each end of the pair of opposing sides, in a plan view.


Patent
Nichia Corporation | Date: 2017-04-03

A light emitting apparatus includes a package and at least one light emitting device. The package has a package bottom surface and defining a recessed portion having a recessed portion bottom surface. The package includes a first leadframe, a second leadframe, and a resin portion. The first leadframe has a first leadframe upper surface and a first leadframe bottom surface. The second leadframe has a second leadframe upper surface and a second leadframe bottom surface. The first leadframe has a first leadframe main portion and a first leadframe extension portion. A first recessed part is formed at the first leadframe bottom surface and embedded with the resin portion. The first leadframe forms a second recessed part at an upper surface thereof other than an area approximately above the first recessed part, while the second recessed part is not provided on the area approximately above the first recessed part.

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