Tokushima, Japan
Tokushima, Japan

Nichia Corporation is a Japanese chemical engineering and manufacturing company, headquartered in Tokushima, Japan with global subsidiaries, that specializes in the manufacturing and distribution of phosphors, including light-emitting diodes , laser diodes, battery materials, and calcium chloride. The Nichia Corporation comprises two divisions-Division 1, responsible for phosphors and other chemicals, and Division 2, responsible for LEDs.Nichia is the world’s largest supplier of LEDs. It designs, manufactures, and markets LEDs for display, LCD backlighting, automotive and general lighting applications with the many different leds across the entire visible spectrum. Nichia’s invention and development of white LEDs have spanned several accomplishments throughout the history of the company.With 6,600 employees and multiple subsidiaries worldwide, Nichia achieved sales of approximately US$2.3 billion in 2007. Wikipedia.


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A method for producing a nitride fluorescent material having high emission luminance can be provided. The method includes heat-treating a raw material mixture containing silicon nitride, silicon, an aluminium compound, a calcium compound, and a europium compound.


Patent
Nichia Corporation | Date: 2017-03-15

A semiconductor laser device includes a base, a semiconductor laser element, a lid, a support member, a wavelength converting member, a holding member, and a buffer material. The lid has a recess formed in an upper portion of the lid, and a through-hole formed in the bottom of the recess. The support member is disposed in the recess and has a through-hole. A diameter of the through-hole of the support member is smaller than that of the through-hole of the lid. A coefficient of thermal expansion of the support member is different from that of the lid. The wavelength converting member is supported in the through-hole of the support member. The holding member is fixed to the lid and holds the support member. The buffer material is disposed in at least a part of a space between the lateral surfaces of the recess and the support member.


Patent
Nichia Corporation | Date: 2017-02-01

A light emitting device is provided. The light emitting device includes a light emitting element, a wavelength converting member, a light transmissive member, an adhesive member, and a light reflective member. The wavelength converting member has an upper surface and lateral surfaces, contains a fluorescent substance, and is placed on the light emitting element. The light transmissive member covers the upper surface of the wavelength converting member. The adhesive member is interposed between the light emitting element and the wavelength converting member, and covers the lateral surfaces of the wavelength converting member. The light reflective member covers the lateral surfaces of the wavelength converting member via the adhesive member.


Patent
Nichia Corporation | Date: 2017-04-05

A semiconductor package mounted with a semiconductor component comprising a package upper surface and a package lower surface, and a package front surface and a package back surface, facing each other respectively, wherein the package front surface and the package back surface are adjacent to the package upper surface and the package lower surface respectively, the package upper surface and the package lower surface are disposed so that the thickness of the package decreases from the package front side toward the package back surface side, and a protrusion is formed on at least either the package upper surface or the package lower surface so as to be continuous to the package back surface, wherein a recess step is formed by defining a recess approximately in the center of the package back surface, and a protrusion is formed protruding from the bottom surface of the recess step and the top of the protrusion is fit within the recess step.


Patent
Nichia Corporation | Date: 2017-02-01

A light emitting element (10) with a hexagonal planar shape, has: an n-side semiconductor layer (2n); a p-side semiconductor layer (3p) provided on the n-side semiconductor layer; a plurality of holes (6) that are provided to an area excluding at least three corners at mutually diagonal positions of the p-side semiconductor layer in plan view, and expose the n-side semiconductor layer; a first p-electrode (4p) provided in contact with the p-side semiconductor layer; second p-electrodes (5p) provided to the at least three corners on the first p-electrode; and an n-electrode (7n) that is provided on the first p-electrode and is electrically connected to the n-side semiconductor layer through the plurality of holes.


Patent
Nichia Corporation | Date: 2016-06-03

A method for producing a -sialon fluorescent material is provided. The method includes heat-treating a mixture containing an aluminium compound, a first europium compound, and silicon nitride to obtain a first heat-treated product; and heat-treating the first heat-treated product with a second europium compound in a rare gas atmosphere to obtain a second heat-treated product.


A positive electrode active material for non-aqueous secondary battery includes core particles containing a lithium transition metal composite oxide, and a covering layer covering, that covers a surface of the core particle. The covering layer contains niobium and carbonate ions, and the carbonate ions are present at a concentration of from 0.2 weight % to 0.4 weight %. The positive electrode active material for non-aqueous secondary battery exhibits infrared absorption peaks at a wavenumber range of from 1320 cm^(1 )to 1370 cm^(1), and at a wavenumber range of from 1640 cm^(1 )to 1710 cm^(1).


Patent
Nichia Corporation | Date: 2016-09-08

A method for manufacturing a light emitting device, having mounting a light emitting element on a board, forming a phosphor layer that contains a phosphor by spraying on surfaces of the board and the light emitting element after the mounting of the light emitting element; and forming a cover layer that contains at least one type of light reflecting material and light blocking material on a surface of the phosphor layer over the board.


Patent
Nichia Corporation | Date: 2016-09-12

A light-emitting device includes a substrate; a light-emitting element mounted on the substrate; a first light-transmissive member bonded to an upper surface of the light-emitting element via an adhesive; and a second light-transmissive member placed on an upper surface of the first light-transmissive member. In a plan view of the light-emitting device, a peripheral edge of a lower surface of the first light-transmissive member is positioned more inward than a peripheral edge of the upper surface of the light-emitting element. The adhesive extends from the upper surface of the light-emitting element to a lower surface of the second light-transmissive member, the adhesive covers a side surface of the first light-transmissive member, and the adhesive is separated from the substrate.


Patent
Nichia Corporation | Date: 2016-05-04

A light emitting device includes a substrate, a plurality of first wiring members, a plurality of second wiring members and a plurality of light emitting elements. The first wiring members extend in a first direction. The second wiring members extend in a second direction. Each of the second wiring members is segmented into a plurality of second wiring portions. The light emitting elements are disposed along the second direction. A first electrode of the light emitting element is connected to a corresponding one of the first wiring members. A second electrode of the light emitting element has a first connection part and a second connection part that is linked to the first connection part. The first connection part and the second connection part are connected to a corresponding one of the second wiring members and bridge at least two of the segmented second wiring portions in the second direction.

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