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Tokushima, Japan

Nichia Corporation is a Japanese chemical engineering and manufacturing company, headquartered in Tokushima, Japan with global subsidiaries, that specializes in the manufacturing and distribution of phosphors, including light-emitting diodes , laser diodes, battery materials, and calcium chloride. The Nichia Corporation comprises two divisions-Division 1, responsible for phosphors and other chemicals, and Division 2, responsible for LEDs.Nichia is the world’s largest supplier of LEDs. It designs, manufactures, and markets LEDs for display, LCD backlighting, automotive and general lighting applications with the many different leds across the entire visible spectrum. Nichia’s invention and development of white LEDs have spanned several accomplishments throughout the history of the company.With 6,600 employees and multiple subsidiaries worldwide, Nichia achieved sales of approximately US$2.3 billion in 2007. Wikipedia.

Nichia Corporation | Date: 2015-04-09

Provided are a red light emitting fluorescent material excellent in durability, and a method for producing the red light emitting fluorescent material. The present disclosure provides a method for producing a fluoride fluorescent material that includes subjecting a mixture that contains a fluoride in a liquid medium to a pressurization treatment and a heating treatment, the fluoride having a chemical composition represented by the following formula (I). The present disclosure also provides a fluoride fluorescent material that exhibits a rate of decrease in light-emitting energy efficiency is 5% or less after the fluoride fluorescent material is irradiated with laser light having a wavelength of 445 nm at an optical density of 3.5 W/cm In the formula (I), A represents at least one cation selected from the group consisting of K

A method for producing a fluoride fluorescent material including: preparing a first solution containing manganese, a second solution containing at least one cation selected from the group consisting of K

Nichia Corporation | Date: 2015-04-07

A light emitting device includes a semiconductor laser element; a cap defining a through-hole allowing light from the semiconductor laser element to pass therethrough; and a wavelength converting member disposed in the through-hole defined in the cap, the wavelength converting member being configured to emit light that has a wavelength different from a wavelength of light from the semiconductor laser element. The cap includes a first member made of a ceramic, and a second member made of a metal material. The through-hole includes a first through-hole penetrating the first member, and a second through-hole penetrating the second member. The wavelength converting member is disposed on the second member.

Nichia Corporation | Date: 2015-04-10

A light emitting device includes a semiconductor light emitting element, a resin layer, and a metal wire. The semiconductor light emitting element includes a semiconductor stack and an electrode. The semiconductor stack has one surface. The metal wire has a first surface, a second surface opposite to the first surface, and an end surface between the first surface and the second surface. The metal wire is provided in the resin layer and electrically connected to an upper surface of the electrode via the first surface. The end surface of the metal wire is exposed from the resin layer. A lower end of the end surface closest to the first surface of the metal wire that is exposed from the resin layer is provided at an opposite side of the one surface of the semiconductor stack with respect to the upper surface of the electrode.

Nichia Corporation | Date: 2015-04-13

The present invention provides a semiconductor device in which wet-spreading of an adhesive member for bonding the semiconductor element on a base body is suppressed. The semiconductor device (

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