Tokushima, Japan
Tokushima, Japan

Nichia Corporation is a Japanese chemical engineering and manufacturing company, headquartered in Tokushima, Japan with global subsidiaries, that specializes in the manufacturing and distribution of phosphors, including light-emitting diodes , laser diodes, battery materials, and calcium chloride. The Nichia Corporation comprises two divisions-Division 1, responsible for phosphors and other chemicals, and Division 2, responsible for LEDs.Nichia is the world’s largest supplier of LEDs. It designs, manufactures, and markets LEDs for display, LCD backlighting, automotive and general lighting applications with the many different leds across the entire visible spectrum. Nichia’s invention and development of white LEDs have spanned several accomplishments throughout the history of the company.With 6,600 employees and multiple subsidiaries worldwide, Nichia achieved sales of approximately US$2.3 billion in 2007. Wikipedia.


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An object of the invention is to provide a method for producing a conductive member having low electrical resistance, and the conductive member is obtained using a low-cost stable conductive material composition that does not contain an adhesive. Disclosed is a method for producing a semiconductor device in which silver (520, 620, 720) formed by silver sputtering, silver vapour deposition or silver plating and provided on a surface of a base (500, 600, 700) and silver (140, 240, 340) formed by silver sputtering, silver vapour deposition or silver plating and provided on a surface of a semiconductor element (100, 200, 300) are bonded, the method comprising the steps of arranging the semiconductor element (100, 200, 300) on the base (500, 600, 700) such that said silver (140, 240, 340) provided on a surface of the semiconductor element (100, 200, 300) is in contact with said silver (520, 620, 720) provided on a surface of the base (500, 600, 700), temporarily bonding the semiconductor element (100, 200, 300) and the base (500, 600, 700) by applying a pressure or an ultrasonic vibration to the semiconductor element (100, 200, 300) or the base (500, 600, 700), and permanently bonding the semiconductor element (100, 200, 300) and the base (500, 600, 700) by applying heat having a temperature of 150 to 900C to the semiconductor element (100, 200, 300) and the base (500, 600, 700) in air or in an oxygen environment. The step of temporarily bonding and the step of permanently bonding may be performed simultaneously. The semiconductor element (100, 200, 300) and the base (500, 600, 700) may be heated in advance at 150 to 900C before the step of temporarily bonding. A pressure of 5 to 50 MPa may be applied before the step of temporarily bonding. The semiconductor element (100, 200, 300) may be a light emitting semiconductor element.


Patent
Nichia Corporation | Date: 2017-01-25

A semiconductor laser element includes a semiconductor stack with a ridge, a first electrode layer, a current injection prevention layer, and a second electrode layer. The semiconductor stack has an emission surface and a reflection surface. The first electrode layer extends in the lengthwise direction and disposed on the ridge in contact with the semiconductor stack. The current injection prevention layer partially covers the first electrode layer, and has one or more island portions. Each of the island portions is disposed in a center region of the ridge in plan view. The second electrode layer is disposed on the current injection prevention layer, and partially in contact with the first electrode layer.


Patent
Nichia Corporation | Date: 2017-01-19

A semiconductor light emitting element includes a substrate and a semiconductor structure. The substrate has a first main surface, a second main surface and side surfaces. The side surfaces form a first altered area in which voids are positioned in a first imaginary line and a second imaginary line different from the first imaginary line in the thickness direction of the substrate. The semiconductor structure is provided on or above the first main surface of the substrate.


Patent
Nichia Corporation | Date: 2017-01-26

A light emitting device includes a resin package and a light emitting element. The resin package includes a molded resin part and a pair of leads. The molded resin part defines a part of a recessed portion. Each of the leads includes a plating layer including a first plating portion and a second plating portion. Each of the leads is exposed from the molded resin part at a lower surface of the resin package with the first plating portion being arranged in at least a part of the lead exposed at the lower surface of the resin package. Each of the leads includes an exposed portion exposed from the molded resin part at a lateral side surface of the resin package with the second plating portion being arranged in an outer periphery of the exposed portion. The light emitting element is mounted on the bottom surface of the recessed portion.


A bonded magnet is provided which includes first and second components. The first and second components have first and second non-action surfaces, and first and second action surfaces that intersect the first and second non-action surfaces, respectively. First and second flux groups curve inside the first and second components from the first and second non-action surfaces to the first and second action surfaces, respectively. The areas of the first and second non-action surfaces are greater than the first and second action surfaces, respectively. The flux densities on the first and second action surfaces are higher than the first and second non-action surfaces, respectively. The pole on the first non-action surface is opposite to the second non-action surface. The first and second non-action surfaces are coupled to each other. The first flux groups continuously extend from one to another.


Patent
Nichia Corporation | Date: 2017-01-11

A light emitting device includes a light emitting element, a wavelength converter, a light transmissive member, a light guider, and a light transmitting layer. The light emitting element has an element upper surface, an element lower surface, and an element side surface. The wavelength converter has a converter lower surface. The wavelength is provided to be connected to the light emitting element such that the converter lower surface faces the element upper surface. The converter lower surface has an exposed region that does not face the element upper surface. The light guider guides light from the light emitting element to the wavelength converter. The light guider covers the element side surface and the exposed region. The wavelength converter has a converter upper surface. The light transmitting layer has a layer lower surface facing the converter upper surface. The converter upper surface is smaller than the layer lower surface.


Patent
Nichia Corporation | Date: 2017-01-12

A light emitting device mount includes a positive lead terminal, and a negative lead terminal. Each of the positive and negative lead terminal includes a first main surface, a second main surface, and an end surface. The end surface is provided between the first main surface and the second main surface. The end surface includes a first recessed surface area and a second recessed surface area. The first recessed surface area is extending from a first point of the first main surface in cross section. The second recessed surface area is extending from a second point of the second main surface in cross section. The first and second recessed surface areas define a protruding portion protruding outwardly.


A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means or an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.


Patent
Nichia Corporation | Date: 2017-01-27

A light emitting device includes a substrate, a light emitting element and a sealing resin member. The substrate includes a flexible base, a plurality of wiring portions and a groove portion. The groove portion is formed between the plurality of wiring portions spaced apart from each other, and includes a first groove portion, a second groove portion, and a third groove portion extending in a direction intersecting the first and second groove portions. The first and third groove portions are connected to each other with a curve. The second and third groove portions are connected to each other with a curve. The sealing resin member seals the light emitting element and the substrate. The sealing resin member is arranged on the third groove portion and spaced apart from the first groove portion and the second groove portion.


A method of producing a nitride fluorescent material having a high light emission intensity and including a calcined product having a composition represented by formula M^(a)_(v)M^(b)_(w)M^(c)_(x)M^(d)_(y)N_(z) is provided. M_(a) is at least one element selected from Sr, Ca, Ba, and Mg; M^(b) is at least one element selected from Li, Na, and K; M^(c) is at least one element selected from Eu, Mn, Tb, and Ce; M^(d) is at least one element selected from Al, B, Ga, and In; v, w, x, y, and z satisfy 0.8 v 1.1, 0.8 w 1.1, 0.001 < x 0.1, 2.0 y 4.0, and 3.0 z 5.0, respectively.In one embodiment, the method includes mixing the calcined product with a polar solvent, and optionally removing the polar solvent after mixing, wherein the polar solvent is alcohol and/or ketone containing water in a range of 0.0 1 % by mass or more and 12% by mass or less. In another embodiment, the method includes: providing a calcined product having the composition represented by the formula (I); mixing the calcined product with a polar solvent having a relative dielectric constant in a range of 10 to 70 at 20C, and optionally removing the polar solvent after mixing. A nitride fluorescent material and a light-emitting device are also provided.

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