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Khan Z.,Nexlogic Technologies Inc. Nexlogic.com
Printed Circuit Design and Fab

Stencil definition and design accuracy is extremely significant to avoid assembly problems when a high-count layer board is involved. A stencil should be 0.006 inch with a ratio of 1:1:1, which means that 10% more paste is deposited compared to the pad size, thus providing a good filler. A stencil for a mixed signal board must have isolation islands created to segregate current and voltage between analog and digital circuitry. A step stencil, characterized by its different depths, is used when the application has a considerable number of analog components on one side of the board and a lot of digital on the other side. Last-cut step-up and step-down stencils provide ideal solutions for ceramic BGA and RF shield applications. Electropolishing and nickel plating are recommended for stencils to achieve a good paste release for smaller aperture sizes. Source

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