New Japan Radio Co. | Date: 2012-12-03
An aluminum material can be used on a surface of the electrode of a semiconductor element, this aluminum layer need not be formed thick unnecessarily, a copper wire is bonded strongly to the semiconductor element irrespective of a diameter of the wire, and high heat resistance can be achieved. Silicon carbide (SiC) is used as a substrate of the semiconductor element 10, the titanium layer 20 and the aluminum layer 21 are formed as the electrode 15 on the silicon carbide substrate, and by a ball bonding or a wedge bonding of the copper wire 16 to the aluminum layer 21 of the electrode 15 while applying ultrasonic wave, the copper-aluminum compound layer 23 (Al_(4)Cu_(9), AlCu or the like) is formed between the copper wire 16 and the titanium layer 20.
New Japan Radio Co. | Date: 2011-06-22
The switching element is provided in a state of being electromagnetically coupled to the cavity resonator of the high frequency oscillator; the bias voltage applying terminal is connected to one electrode of the switching element; another electrode of the switching element is electrically connected to the cavity resonator (the anode shell in FIG. 1); the metal plate having a size enough for reflecting an electric wave to be transmitted before and after the switching element in a high-frequency manner is provided at any one end of the switching element; and by applying a bias voltage to the switching element and varying that, a reactance of the switching element is changed and a resonance frequency of the cavity resonator is varied. By this method, an oscillation frequency can be varied greatly relative to a small change in a bias voltage.
New Japan Radio Co. | Date: 2013-10-16
The object of the presently disclosed embodiment is to improve heat dissipation and an overall cooling efficiency to raise a peak oscillation output. To achieve the object, there is provided a coaxial magnetron having the following configuration: Around a cathode, vanes and an anode cylinder form an anode resonant cavity, and a cylindrical side body forms an outer cavity. An input side structure having an input part and an upper structure are joined to both ends of the cylindrical side body. One end of the anode cylinder is joined to the input side structure. A groove (or step) for adjusting the distance between the structures and at the both ends is provided, and the groove is joined to the other end of the anode cylinder.
New Japan Radio Co. | Date: 2014-02-06
A position detecting device using a reflection type photosensor, comprising a reflector fitted to a moving target and having reflecting portions and non-reflecting portions arranged alternately in a moving direction of the moving target, a reflection type photosensor having a light emitting element and a light receiving element with plural light receiving portions, and an operation unit for calculating a value indicating the position of the moving target. The light receiving element comprises the first and second light receiving portions outputting signals having different phases, the second light receiving portion is divided into two regions provided at far and near sides from the light emitting element about the first light receiving portion, and the operation unit calculates the value using the one signal calculated from the output signals from the two regions and the output signal from the first light receiving portion.
New Japan Radio Co. | Date: 2012-02-28
A semiconductor device that is equipped with an ESD protection element, which has a size increase thereof suppressed, does not require extra process, and can be formed without inducing deterioration of characteristics of the semiconductor device. This semiconductor device includes a semiconductor substrate, a circuit element, that includes a PN junction formed of a region, which is formed on the semiconductor substrate, and which has a conductivity type different from that of the substrate and a protection element for the circuit element. The protection element is a transistor formed of the region, another region having the conductivity type same as that of the region, and the semiconductor substrate. The emitter for the transistor and the semiconductor substrate are connected to each other.
New Japan Radio Co. | Date: 2016-01-05
One embodiment provides a semiconductor device having a first chip for lowering an input voltage and a second chip for performing signal processing, mounted on a die pad. Lead terminals are divided into a first lead row and a second lead row. The first lead row are connected with the first chip, the first chip are connected with the second chip or the second lead row, and the second chip are connected with the second lead row. A distance between the lead terminals of the first lead row is set longer than a distance between the lead terminals of the second lead row, and a sealing resin is provided to fill at least between the lead terminals of the first lead row.
New Japan Radio Co. | Date: 2015-02-10
There is provided a mounting structure of electronic components wherein the heat sink is disposed so as to allow a high heat releasing property to be achieved and ensure that manufacturing is easy. The resin film is provided at the lower surface side of the whole circuit element to which the lead is connected; a molding resin is molded at the upper side from the lower surface of the lead including the side portions of the lead, the circuit element and the connecting portions of the lead and the circuit element; the lead is connected to the electrode of the circuit board so that flattened back surfaces of a plurality of one side resin-molded elements are on the same horizontal plane; and a single heat sink is mounted on the back surfaces of the plurality of one side resin-molded elements.
New Japan Radio Co. | Date: 2014-12-18
There is provided a circuit package which makes it possible to reduce equipment investment and production cost, change a package size easily according to specifications, and produce a lead frame having an outer lead with a proper length. In the circuit package in which a circuit element is connected to the top surface of the inner lead of the lead frame, the circuit package has a first molded resin portion formed at an upper side of a bottom surface of the lead frame so as to cover the inner lead of the lead frame and a portion of the circuit element to be connected to the inner lead and a second molded resin portion formed at side portions of the outer lead except the top and bottom surfaces of the outer lead.
New Japan Radio Co. | Date: 2012-07-06
An object of the present invention is to provide a position detecting device using a reflection type photosensor, which assures a small size and low cost and enables detection of a long distance of about 10 mm or more, and a position detecting method. The position of a moving body is detected by providing, on the moving body, a reflection plate (12) having reflecting surfaces (sa) and non-reflecting surfaces (sb) arranged alternately in a moving direction of the moving body, providing a light receiving element (8) of the reflection type photosensor (9) with, for example, two light receiving portions (8a and 8b) having different light receiving regions in the moving direction of the moving body, outputting output signals from these two light receiving portions (8a and 8b), and carrying out at least one calculation of adding, subtracting, dividing and function calculation of these two output signals.
New Japan Radio Co. | Date: 2011-10-20
There is provided a position detecting device using reflection type photosensors in which a position sensing of lens located not less than 1 mm apart from a sensor can be conducted. A pair of reflection type photosensors PR1 and PR2 are oppositely arranged, a double sided reflector 5 attached on a movable body is movably arranged between the pair of reflection type photosensors and a position of the double sided reflector 5 is detected from the outputs of these reflection type photosensors. In the position detecting device of the present invention, an operating formula in which linear values are obtained depending on a moving distance of the double sided reflector can be used. For example, when an output of one of the pair of reflection type photosensors is Vo1, and an output of the other is Vo2, the position detecting is conducted using the operating formula of (Vo1Vo2)/(Vo1+Vo2).