Chen C.-Y.,National Pingtung University
JVC/Journal of Vibration and Control | Year: 2012
The most important problem related to internal wave observation is that it is difficult to obtain clear results with in-situ observations. There are many factors, including the topography, time, season, wind and temperature, which may affect the shape of the wave, perhaps even making it disappear or not leave strong evidence. This paper discusses the research on in-situ observations of such waves in oceans, estuaries and lakes. Over the past decades, researchers have observed this phenomenon and have carried out numerical experiments about these internal solitary waves. They have used high tech equipment and mathematical methods to detect and calculate the results of wave vibration and simulate the in-situ conditions seen during wave turbulence. We focus on the in-situ observation of such waves in oceans, estuaries and lakes, surveying scholarly work over the past few years from a wide variety of places including Europe, the United States, South Africa, Taiwan, the South China Sea and the Yellow Sea. Even now, with the rapid development of new technology for use in in-situ observations, there are still many elements of the behavior of such waves that remain to be solved. © 2011 The Author(s) Reprints and permissions.
Chen C.Y.,National Pingtung University
Applied Soft Computing Journal | Year: 2013
Although there are many successful applications of neural networks (NNs), however, there are still some drawbacks in using neural networks (NNs) in any control scheme. In this study an NN-based model is applied for a tension leg platform (TLP) system. A linear differential inclusion (LDI) state-space representation is constructed to represent the dynamics of the NN model. Control performance is achieved by using the parallel distributed compensation (PDC) scheme to ensure the stability of TLP systems subjected to an external wave force. In terms of the stability analysis, the linear matrix inequality (LMI) conditions are derived using the Lyapunov theory to guarantee the robustness design and stability of the TLP system. A simulation example based on practical data is given to demonstrate the feasibility of the proposed fuzzy control approach. In the end, we discuss a practical application with field data on the wave properties and structural characteristics. The results indicate the efficiency and robustness of the proposed NN based approach.
National Pingtung University | Date: 2014-10-01
A despin device includes a central base installed in an outer rotational ring. The outer rotational ring includes a plurality of through-holes extending from an inner wall face thereof through an outer wall face thereof. Masses are symmetrically installed in ball grooves of the central base and the through-holes of the outer rotational ring. The masses are connected by a connecting line extending through a line cutter and tensioned by a tensioning device. Cables are wrapped around an outer periphery of the central base. Each cable includes an end attached to one of the masses. A plurality of release-hitch devices is provided. Each release-hitch device includes a hitch member fixed to the central base and a disengagement member releasably engaged with the hitch member and fixed to the other end of one of the cables.
National Pingtung University | Date: 2013-01-30
A microfluidic device including a microfluidic channel formed in a face of a substrate. The microfluidic channel is discontinuous and includes a first channel and a second channel not connected to the first channel. A pressure change section is formed between the first and second channels. The first channel is in communication with a first fluid port. The second channel is in communication with a second fluid port. An elastic membrane is applied to the face of the substrate. The elastic membrane includes a deformation area aligned with the pressure change section. A remaining portion of the elastic membrane outside of the deformation area forms a clinging area. The clinging area clings to a remaining area of the face of the substrate outside of the pressure change section. A fluid conveying member is in communication with one of the first and second fluid ports.
National Pingtung University | Date: 2014-09-16
A microfluidic chip for steam distillation includes a chip body and a condenser. The chip body includes a steam inlet and a steam outlet. The steam inlet is connected to the steam outlet by a micro channel. The micro channel includes a first channel, a second channel, and a receiving space having an enlarged cross sectional area larger than a cross sectional area of each of the first and second channels. The first channel connects the steam inlet with the receiving space. The second channel windingly connects the steam outlet with the receiving space. The condenser includes a condensing channel inlet and a condensing channel outlet. The condenser further includes a condensing channel windingly connecting the condensing channel inlet with the condensing channel outlet. The steam outlet 11b intercommunicates with the condensing channel inlet.
National Pingtung University | Date: 2014-09-16
A microfluidic mixing device includes a body having a base, a sealing cover, and a thermally conductive member. The base includes a compartment. A chip access opening is defined in an end of the compartment. An engagement opening is defined in the other end of the compartment. The base further includes a gas port intercommunicated with the compartment. The sealing cover is detachably mounted to the base to seal the chip access opening. The thermally conductive member is mounted to the base and seals the engagement opening. A gas passage is defined between the thermally conductive member and an inner periphery of the base, is located in the compartment, and intercommunicates with the gas port. A pressure control module is connected to the gas port of the base. A heating module is coupled to the thermally conductive member. A cooling module is coupled to the thermally conductive member.
National Pingtung University | Date: 2016-06-07
A method for roughening silicon substrate surface includes providing a silicon substrate having a waiting-for-etching surface, the waiting-for-etching surface has a plurality of first and second areas; forming a plurality of covering bumps on the first areas, and a gap is formed between each of the covering bumps and each of the first areas; and etching the waiting-for-etching solution by a anisotropic etching solution. The anisotropic etching solution permeates into each of the first areas through the gap to lead the etching time of the first areas is shorter than that of the second areas, so the waiting-for-etching surface becomes a undulate surface having a plurality of undulate structures because the etching depth of the first areas is smaller than that of the second areas.
National Pingtung University | Date: 2015-12-15
The present invention provides a biochip image-forming system including a case having a cavity, an optical assembly, a chip-holding assembly and an electricity storage assembly. The cavity communicates with a chip inlet for a biochip to be inserted into the cavity through the chip inlet and an image outlet for an image of the biochip to be outputted from the cavity via the image outlet. The optical assembly is received in the cavity and aligned with the image outlet for forming the image of the biochip. The chip-holding assembly is received in the cavity and arranged between the optical assembly and a heating component. The chip-holding assembly aligns with the chip inlet for the biochip to be placed thereon. The electricity storage assembly is electrically connected with the optical assembly and the heating component. As such, a biochip can be analyzed conveniently using said biochip image-forming system.
National Pingtung University | Date: 2015-07-13
An electroless plating process includes providing a semiconductor substrate which has a substrate and a copper pillar disposed on the substrate; providing a tin-silver plating solution includes 0.1-50 wt % tin and 110^(5)-2 wt % silver; and performing a reduction reaction, wherein the semiconductor substrate is disposed in the tin-silver plating solution for making tin and silver of the tin-silver plating solution deposit jointly on the copper pillar surface to form a tin-silver co-deposition layer. The tin-silver co-deposition layer is able to enhance the coupling strength between the copper pillar of the semiconductor substrate and the other semiconductor substrate and is also able to reduce the time and cost of the process performing tin-plating and silver-plating separately.
National Pingtung University | Date: 2014-12-16
A welding activated flux for structural alloy steels including 40-50 wt % of SiO_(2), 25-30 wt % of MoO_(3), 5-10 wt % of TiO_(2 )and 10-20 wt % of Cr_(2)O_(3 )is disclosed. Accordingly, with the use of the welding activated flux, the depth of the weld is significantly increased, thereby enhancing the mechanical strength of the weldment and reducing the distortion of the weldment.