National Center For Advanced Packaging Co. | Date: 2014-05-07
A TSV front-top interconnection process is provided. In an embodiment of the present invention, the stress concentration area of a TSV copper pillar is eliminated, which reduces the possibility of generating delamination or cracks between an insulating layer and the substrate due to stress. Meanwhile, the defect of the existing process that the TSV copper pillar may expose after an electroplating and annealing process is re-used to achieve the interconnection between the TSV copper pillar and the metal redistribution layer.
National Center for Advanced Packaging Co. | Date: 2014-04-15
A mechanical debonding method and system are provided. A mechanical debonding method, used to debond temporary bonding wafers formed by bonding a device wafer and a carrier wafer by an adhesive, includes: obtaining the height position of the adhesive through a thickness measurement apparatus; moving a cutting apparatus to a position between the device wafer and the carrier wafer based on the height position of the adhesive, then removing the adhesive at the edge of the temporary bonding wafers by the cutting apparatus; removing the carrier wafer from the temporary bonding wafers; cleaning the adhesive left on the surface of the device wafer.
National Center for Advanced Packaging Co. | Date: 2015-04-17
A method for polishing a polymer surface is provided by an embodiment of the present invention. The method includes: curing the polymer surface; polishing the polymer surface cured through a CMP process. By using the method for polishing a polymer surface provided by embodiments of the present invention, the mentioned problems in the prior art are solved. The uniformity of the polymer surface can be improved to <1% through a CMP process, which can meet the requirements of high density and small linewidth integration.
National Center for Advanced Packaging Co. | Date: 2014-08-28
An optical fiber assembly and a method of assembly thereof. The optical fiber assembly includes a support plate defining an array of support plate through holes, and an alignment template plate defining an array of alignment template plate through holes. At least one support plate through hole or alignment template plate through hole may be flared. At least one support plate through hole or alignment template plate through hole may include a compliant film.
National Center For Advanced Packaging Co. | Date: 2014-04-15
A fine pitch stud POP structure and method is disclosed. The studs are made in bonding pads on the top surface of a lower substrate, which greatly increase the height of the interconnection such as solder balls. In addition, the lower substrate and the upper substrate are connected by reflowing two solder balls on them separately. The two features make the diameter of the bonding balls greatly reduce and further make the pitch between two bonding balls on the lower substrate or the upper substrate greatly reduce, and then the fine pitch POP is achieved.